公开(公告)号：US11832386B2

公开(公告)日：2023-11-28

申请号：US17644593

申请日：2021-12-16

Applicant: Dell Products L.P.

Inventor： Deeder M. Aurongzeb

IPC: B23K35/00 ,  H05K1/09 ,  H05K3/40 ,  B23K35/26 ,  C22C13/02 ,  B23K35/22 ,  B23K1/00 ,  H05K1/11

CPC classification number: H05K1/09 ,  B23K1/0016 ,  B23K35/22 ,  B23K35/262 ,  C22C13/02 ,  H05K3/4007 ,  H05K1/115 ,  H05K1/119 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2203/043 ,  H05K2203/0759 ,  H05K2203/1333 ,  H05K2203/1366

Abstract: A solder composition for use in solder joints of printed circuit boards (PCBs), including a compound layer comprising an alloy of bismuth and tin; and a graphene coating positioned on the compound layer.

公开(公告)号：US20230371175A1

公开(公告)日：2023-11-16

申请号：US18044869

申请日：2021-09-13

Applicant: TDK Corporation

Inventor： Yu FUKAE ,  Tomoya HANAI ,  Yusuke OBA ,  Kenichi YOSHIDA ,  Katsuharu YASUDA ,  Takashi OHTSUKA

IPC: H05K1/02 ,  H05K1/05

CPC classification number: H05K1/0298 ,  H05K1/05 ,  H05K2201/0338 ,  H05K2201/09409

Abstract: To prevent interfacial peeling due to the stress of an insulating layer in a capacitor-inductor integrated electronic component having three or more conductor layers. An electronic component includes: a conductor layer M1 including a conductor pattern constituting an inductor; a conductor pattern overlapping a part of the conductor pattern through a dielectric film; an insulating layer covering the conductor layer M1 and conductor pattern; a conductor layer M2 provided on the insulating layer and including a conductor pattern constituting the inductor; and an insulating layer covering the conductor layer M2. The conductor layer M2 is formed to be branching from or independently of the conductor pattern and further includes a dummy pattern overlapping the conductor pattern. This prevents the stress of the insulating layer from being directly applied to the conductor pattern to thereby prevent peeling at the interface between the conductor layer M1 and the dielectric film.

公开(公告)号：US11798875B2

公开(公告)日：2023-10-24

申请号：US17535167

申请日：2021-11-24

Applicant: InnoLux Corporation

Inventor： Chung-Chun Cheng ,  Kuang-Ming Fan ,  Yao-Wen Hsu

IPC: H05K1/11 ,  H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L24/19 ,  H01L24/20 ,  H05K1/11 ,  H05K1/111 ,  H01L23/49822 ,  H01L2224/19 ,  H01L2224/214 ,  H05K1/0268 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/09372

Abstract: An electronic component includes: an insulating layer; and a first metal bump disposed on the insulating layer and provided with: a first metal layer disposed on the insulating layer; and a second metal layer disposed on the first metal layer, wherein, in a cross-sectional view of the electronic component, the first metal layer has a first width, the second metal layer has a second width, and the first width is smaller than the second width.

公开(公告)号：US11792926B2

公开(公告)日：2023-10-17

申请号：US17818555

申请日：2022-08-09

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Kyungmo Lee ,  Jongjin Lee ,  Minsu Choi

IPC: G06F1/18 ,  H05K1/11 ,  G09G3/00

CPC classification number: H05K1/112 ,  G06F1/183 ,  G09G3/006 ,  G09G2330/12 ,  H05K2201/0338 ,  H05K2201/10128 ,  H05K2201/10189

Abstract: Provided is a display apparatus including: a display panel including a display area and a peripheral area; a printed circuit board attached to the peripheral area and including a ground portion and a test electrode spaced apart from the ground portion; a connector including a plurality of connector terminals connected to an external control apparatus and electrically connecting the printed circuit board and the external control apparatus to each other; and a cover layer arranged on the printed circuit board and covering at least a part of the printed circuit board. Accordingly, not only the display quality and reliability of the electric characteristics of the display apparatus are improved, but also a loss is reduced and a yield is improved during manufacturing processes.

公开(公告)号：US20230301048A1

公开(公告)日：2023-09-21

申请号：US18050421

申请日：2022-10-27

Applicant: Samsung Display Co.,

Inventor： MYONG-SOO OH

IPC: H05K13/00 ,  H05K3/32 ,  H05K1/11

CPC classification number: H05K13/0015 ,  H05K3/325 ,  H05K1/117 ,  H05K2201/10128 ,  H05K2201/0338 ,  H05K2203/166

Abstract: A display device includes a film align pad disposed under a connection film connected to a display panel and including a base lead and an align lead. The base lead extends in a first direction and the align lead protrudes from the base lead in a second direction intersecting the first direction. A board align pad is disposed on a printed circuit board, is connected to the connection film, and includes a base land and an align land. The base land extends in the first direction and the align land protrudes from the base land in the second direction.

公开(公告)号：US11737211B2

公开(公告)日：2023-08-22

申请号：US17371813

申请日：2021-07-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hong Min ,  Ho Hyung Ham ,  Yong Soon Jang ,  Ki Suk Kim ,  Hyung Ki Lee ,  Chi Won Hwang

IPC: H05K1/11 ,  G06F1/18

CPC classification number: H05K1/115 ,  G06F1/189 ,  H05K2201/0338 ,  H05K2201/041

Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.

公开(公告)号：US20190098754A1

公开(公告)日：2019-03-28

申请号：US16189342

申请日：2018-11-13

Applicant: Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.

Inventor： NING HOU ,  SI-HONG HE ,  BIAO LI ,  MEI-HUA HUANG

IPC: H05K1/09 ,  H05K3/06 ,  H05K3/24 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K1/09 ,  H05K1/115 ,  H05K3/06 ,  H05K3/241 ,  H05K3/244 ,  H05K3/4038 ,  H05K2201/0338 ,  H05K2201/09063 ,  H05K2201/099 ,  Y10T29/49165

Abstract: A circuit board film-plated against corrosion of conductive traces comprises a substrate, a conductive circuit layer attached to the substrate, a plating film attached to outer surface of the conductive circuit layer, and a covering film. Each plating film comprises a top outer surface and a side surface. The circuit board defines at least one through hole. Each through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surfaces, and the through holes. The conductive circuit layer and the side surfaces of the plating films are sealed against the atmosphere and cannot be corroded. A method for making the circuit board is also provided.

公开(公告)号：US20180358145A1

公开(公告)日：2018-12-13

申请号：US15969144

申请日：2018-05-02

Applicant: E I DU PONT DE NEMOURS AND COMPANY

Inventor： Daniel Aneurin Inns ,  Jeffrey J. G. Dee

IPC: H01B1/22 ,  H05K1/02 ,  H05K1/09 ,  H05K3/12 ,  H01B5/14

CPC classification number: H01B1/22 ,  H01B3/302 ,  H01B3/427 ,  H01B5/14 ,  H05K1/028 ,  H05K1/095 ,  H05K3/12 ,  H05K2201/0129 ,  H05K2201/0314 ,  H05K2201/0338

Abstract: This invention is related to a thermoformed article containing a bendable region traversed by an electrical conductor, the electrical conductor comprising a substrate and a two-layer electrical conductor. The two-layer conductor comprises (a) a layer of polymer thick film silver conductor comprising a polymer selected from the group consisting of (i) a mixture of thermoplastic polyurethane and thermoplastic polyhydroxyether and (ii) a thermoplastic polyurethane having a percent elongation of at least 200% and a tensile stress necessary to achieve 100% elongation of less than 1000 pounds per square inch and (b) a layer of polymer thick film silver conductor comprising thermoplastic polyhydroxyether.

公开(公告)号：US10017133B2

公开(公告)日：2018-07-10

申请号：US15355149

申请日：2016-11-18

Applicant: YAZAKI CORPORATION

Inventor： Mitsunori Tsunoda ,  Gaku Ito ,  Tomoaki Sasaki ,  Shuji Kimura ,  Taku Furuta ,  Shoichi Nomura

IPC: B60R16/02 ,  H05K3/26 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/04 ,  H05K3/24

CPC classification number: B60R16/02 ,  B60R16/0215 ,  H05K1/0265 ,  H05K1/0284 ,  H05K1/181 ,  H05K3/043 ,  H05K3/045 ,  H05K3/125 ,  H05K3/247 ,  H05K3/26 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/09036 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10053 ,  H05K2201/10272 ,  H05K2203/025 ,  H05K2203/0353 ,  H05K2203/0545

Abstract: An instrument panel as a vehicular panel includes a panel body on a surface side of which key tops are installed, a printed wiring section arranged on the surface side of the panel body, and an insulation outer layer arranged on the surface side of the panel body so as to cover the printed wiring section.

公开(公告)号：US09955588B1

公开(公告)日：2018-04-24

申请号：US15361983

申请日：2016-11-28

Applicant: Chang Chun Petrochemical Co., Ltd.

Inventor： Yao-Sheng Lai ,  Kuei-Sen Cheng ,  Jui-Chang Chou

IPC: H05K1/00 ,  H05K3/46 ,  H01L23/498 ,  H01L21/48 ,  H05K3/02 ,  H05K1/09 ,  H05K3/30 ,  H05K3/22

CPC classification number: H05K3/4644 ,  H01L21/4857 ,  H01L23/49822 ,  H05K1/09 ,  H05K3/022 ,  H05K3/22 ,  H05K3/303 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/107

Abstract: The present disclosure relates to a multilayer carrier foil, a core structure formed using the multilayer carrier foil, printed circuit boards, and electronic devices. The multilayer carrier foil comprises: (a) a copper carrier layer having a release side and a laminate side, the laminate side of carrier layer optionally having nodules; (b) a chromium release layer applied to the copper carrier layer; (c) an intermediate copper layer applied to the chromium release layer; (d) an anti-migration layer applied to the intermediate copper layer of (c); and (e) an ultra-thin copper layer applied to the anti-migration layer of (d). The disclosure further relates to methods of making the multi-layer carrier foil, the core structure, and printed circuit boards.