公开(公告)号：US09820380B2

公开(公告)日：2017-11-14

申请号：US15444203

申请日：2017-02-27

Applicant: FUJIFILM Corporation

Inventor： Kensuke Katagiri ,  Shin Tajiri ,  Akihiko Hase

IPC: H05K1/00 ,  H05K1/09 ,  H05K3/02 ,  G06F3/041

CPC classification number: H05K1/09 ,  G06F3/041 ,  G06F3/044 ,  G06F3/045 ,  G09F9/00 ,  H01B1/02 ,  H01L51/0021 ,  H01L51/5212 ,  H05K1/0296 ,  H05K3/027 ,  H05K3/10 ,  H05K2201/0364 ,  H05K2201/09209 ,  H05K2203/0502 ,  Y10T29/49155

Abstract: A transparent conductive film comprises a transparent substrate and a metal wiring portion formed thereon. A thin metal wire contained in an electrode portion in the metal wiring portion has a surface shape satisfying the condition of Ra2/Sm>0.01 μm and has a metal volume content of 35% or more. Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than the thickness of a metal wiring located in a position where the surface roughness is measured. Sm represents an average distance between convex portions and is 0.01 μm or more.

公开(公告)号：US09820377B2

公开(公告)日：2017-11-14

申请号：US14947831

申请日：2015-11-20

Applicant: FUJIFILM CORPORATION

Inventor： Kensuke Katagiri ,  Shin Tajiri ,  Akihiko Hase

IPC: H05K3/02 ,  H05K3/10 ,  H05K1/02 ,  G06F3/041 ,  G06F3/044 ,  G09F9/00 ,  H01B1/02 ,  H01L51/00 ,  G06F3/045 ,  H01L51/52

CPC classification number: H05K1/09 ,  G06F3/041 ,  G06F3/044 ,  G06F3/045 ,  G09F9/00 ,  H01B1/02 ,  H01L51/0021 ,  H01L51/5212 ,  H05K1/0296 ,  H05K3/027 ,  H05K3/10 ,  H05K2201/0364 ,  H05K2201/09209 ,  H05K2203/0502 ,  Y10T29/49155

Abstract: A transparent conductive film comprises a transparent substrate and a metal wiring portion formed thereon. A thin metal wire contained in an electrode portion in the metal wiring portion has a surface shape satisfying the condition of Ra2/Sm>0.01 μm and has a metal volume content of 35% or more. Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than the thickness of a metal wiring located in a position where the surface roughness is measured. Sm represents an average distance between convex portions and is 0.01 μm or more.

公开(公告)号：US09736945B2

公开(公告)日：2017-08-15

申请号：US14813218

申请日：2015-07-30

Applicant: IBIDEN CO., LTD.

Inventor： Nobuya Takahashi

IPC: H05K1/09 ,  H05K3/18 ,  H05K3/16 ,  H01L23/498 ,  H05K1/11 ,  H05K1/14 ,  H05K3/40 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/48 ,  H01L23/538

CPC classification number: H05K3/18 ,  H01L21/4857 ,  H01L23/49866 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1436 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0296 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/111 ,  H05K1/141 ,  H05K3/16 ,  H05K3/4007 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/0391 ,  H05K2201/0769 ,  H05K2201/09236 ,  H05K2201/0929 ,  H05K2201/094 ,  H05K2201/09654 ,  H05K2201/097 ,  H05K2201/09736 ,  H05K2201/098 ,  H01L2924/014

Abstract: A printed wiring board includes an insulation layer, conductive pads formed on the insulation layer and positioned to connect an electronic component, and a conductive wiring pattern including first and second conductive patterns and formed on the insulation layer such that the conductive wiring pattern is extending between the conductive pads. The first pattern includes first wiring lines, the second pattern includes second wiring lines, the first and second conductive patterns are formed such that the first wiring lines and the second wiring lines are alternately arrayed on the insulation layer, each of the first wiring lines includes a first metal layer formed on an interface with the insulation layer, each of the second wiring lines includes a second metal layer formed on an interface with the insulation layer, and the first metal layer includes a metal material which is different from a metal material forming the second metal layer.

公开(公告)号：US20160345434A1

公开(公告)日：2016-11-24

申请号：US14967348

申请日：2015-12-13

Applicant: HON HAI PRECISION INDUSTRY CO., LTD. ,  Tsinghua University

Inventor： YUAN-HAO JIN ,  QUN-QING LI ,  SHOU-SHAN FAN

IPC: H05K1/09 ,  H05K1/03 ,  H05K1/02

CPC classification number: B32B15/08 ,  B32B5/028 ,  B32B2307/202 ,  C03C17/09 ,  C03C2217/252 ,  C03C2217/253 ,  C03C2217/255 ,  C03C2218/15 ,  C03C2218/33 ,  C03C2218/34 ,  C23C14/20 ,  C23C14/5826 ,  C23C14/5873 ,  C23C16/06 ,  C23C16/56 ,  C23C30/00 ,  C23F4/00 ,  G06F3/044 ,  G06F3/047 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/026 ,  H01B1/16 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/03 ,  H05K1/09 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0364 ,  H05K2201/09681

Abstract: The disclosure relates to a metal nanowire film. The metal nanowire film includes a substrate and a number of first metal nanowire bundles located on the substrate. The number of first metal nanowire bundles are parallel with and spaced from each other. Each of the number of first metal nanowire bundles includes a number of first metal nanowires parallel with each other. The first distance between adjacent two of the number of first metal nanowires is less than the second distance between adjacent two of the number of first metal nanowire bundles.

Abstract translation: 本公开涉及金属纳米线膜。 金属纳米线膜包括基板和位于基板上的多个第一金属纳米线束。 第一金属纳米线束的数量彼此平行并间隔开。 多个第一金属纳米线束中的每一个包括彼此平行的多个第一金属纳米线。 第一金属纳米线的相邻两个之间的第一距离小于相邻的第二金属纳米线束之间的第二距离。

公开(公告)号：US20160081184A1

公开(公告)日：2016-03-17

申请号：US14947831

申请日：2015-11-20

Applicant: FUJIFILM CORPORATION

Inventor： Kensuke KATAGIRI ,  Shin TAJIRI ,  Akihiko HASE

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K1/09 ,  G06F3/041 ,  G06F3/044 ,  G06F3/045 ,  G09F9/00 ,  H01B1/02 ,  H01L51/0021 ,  H01L51/5212 ,  H05K1/0296 ,  H05K3/027 ,  H05K3/10 ,  H05K2201/0364 ,  H05K2201/09209 ,  H05K2203/0502 ,  Y10T29/49155

Abstract: A transparent conductive film comprises a transparent substrate and a metal wiring portion formed thereon. A thin metal wire contained in an electrode portion in the metal wiring portion has a surface shape satisfying the condition of Ra2/Sm>0.01 μm and has a metal volume content of 35% or more. Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than the thickness of a metal wiring located in a position where the surface roughness is measured. Sm represents an average distance between convex portions and is 0.01 μm or more.

Abstract translation: 透明导电膜包括透明基板和形成在其上的金属布线部分。 包含在金属配线部的电极部的细金属丝具有满足Ra2 / Sm>0.01μm的条件的表面形状，金属体积含量为35％以上。 Ra表示以微米为单位的算术平均粗糙度，并且等于或小于位于测量表面粗糙度的位置的金属布线的厚度。 Sm表示凸部之间的平均距离，为0.01μm以上。

公开(公告)号：US20160014898A1

公开(公告)日：2016-01-14

申请号：US14798550

申请日：2015-07-14

Applicant: IBIDEN CO., LTD.

Inventor： Takema Adachi ,  Wataru Nakamura ,  Tomoyoshi Hirabayashi

IPC: H05K1/14 ,  H05K1/09 ,  H01L23/498 ,  H05K1/18

CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H05K1/09 ,  H05K1/185 ,  H05K3/4007 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/09372 ,  H05K2201/10674 ,  H05K2203/054 ,  H05K2203/0723

Abstract: A printed wiring board includes a first circuit substrate having first pads and second pads such that the first pads are positioned to mount an electronic component on the first circuit substrate and that the second pads are positioned to electrically connect the first circuit substrate to a second circuit substrate, and metal posts including plating material and formed on the second pads respectively such that the metal posts are positioned to mount the second circuit substrate on the first circuit substrate. Each of the metal posts has a height h1 and a thickness b such that the metal posts have a value h1/b which is greater than 0.1 and smaller than 1.0 where the value h1/b is obtained by dividing the height h1 by the thickness b.

Abstract translation: 印刷布线板包括具有第一焊盘和第二焊盘的第一电路基板，使得第一焊盘被定位成将电子部件安装在第一电路基板上，并且第二焊盘被定位成将第一电路基板电连接到第二电路 基板和包括电镀材料的金属柱并分别形成在第二焊盘上，使得金属柱被定位成将第二电路基板安装在第一电路基板上。 每个金属柱具有高度h1和厚度b，使得金属柱具有大于0.1且小于1.0的值h1 / b，其中通过将高度h1除以厚度b获得值h1 / b 。

公开(公告)号：US20150147896A1

公开(公告)日：2015-05-28

申请号：US14251326

申请日：2014-04-11

Applicant: LOTES CO., LTD

Inventor： Ted Ju

IPC: H01R12/71

CPC classification number: H01B1/02 ,  H01B1/026 ,  H01R4/04 ,  H01R12/714 ,  H01R12/73 ,  H01R13/2414 ,  H05K1/09 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3457 ,  H05K2201/0364 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10984 ,  H05K2201/10992 ,  H05K2203/0278 ,  H05K2203/0475 ,  H05K2203/0495 ,  Y10T428/256 ,  Y10T428/31678

Abstract: An electrical connector includes a circuit board, a chip module, an isolation portion, and at least one liquid metal conductor. Multiple first conducting portions are disposed on the circuit board, and multiple second conducting portions are disposed on the chip module. The second conducting portions correspond to the first conducting portions. The isolation portion is located between the circuit board and the chip module. An upper surface and a lower surface of the isolation portion urge against the chip module and the circuit board respectively. The isolation portion surrounds, joints, and seals the first conducting portion. The at least one liquid metal conductor is correspondingly disposed between the first conducting portion and the second conducting portion, and electrically conducting the circuit board and the chip module. The liquid metal conductor is gallium or gallium alloy.

Abstract translation: 电连接器包括电路板，芯片模块，隔离部分和至少一个液态金属导体。 多个第一导电部分设置在电路板上，并且多个第二导电部分设置在芯片模块上。 第二导电部分对应于第一导电部分。 隔离部分位于电路板和芯片模块之间。 隔离部分的上表面和下表面分别推动芯片模块和电路板。 隔离部分包围，接合和密封第一导电部分。 所述至少一个液体金属导体相应地设置在所述第一导电部分和所述第二导电部分之间，并且导电所述电路板和所述芯片模块。 液态金属导体是镓或镓合金。

公开(公告)号：US20150014022A1

公开(公告)日：2015-01-15

申请号：US14299938

申请日：2014-06-09

Applicant: INNOVA DYNAMICS, INC.

Inventor： Michael Eugene Young ,  Arjun Daniel Srinivas ,  Matthew R. Robinson ,  Alexander Chow Mittal

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/09 ,  H01L31/02167 ,  H01L31/0481 ,  H01L31/05 ,  H01L31/055 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/115 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/10977 ,  Y02E10/52 ,  Y02E10/54 ,  Y02E10/542

Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

Abstract translation: 活性或功能添加剂嵌入主体材料的表面，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得到的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。

公开(公告)号：US20120132930A1

公开(公告)日：2012-05-31

申请号：US13205526

申请日：2011-08-08

Applicant: MICHAEL EUGENE YOUNG ,  ARJUN DANIEL SRINIVAS ,  MATTHEW R. ROBINSON ,  ALEXANDER CHOW MITTAL

Inventor： MICHAEL EUGENE YOUNG ,  ARJUN DANIEL SRINIVAS ,  MATTHEW R. ROBINSON ,  ALEXANDER CHOW MITTAL

IPC: H01L31/14 ,  H01L31/0232 ,  B82Y20/00

CPC classification number: H05K1/09 ,  H01L31/02167 ,  H01L31/0481 ,  H01L31/05 ,  H01L31/055 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/115 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/10977 ,  Y02E10/52 ,  Y02E10/54 ,  Y02E10/542

Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

Abstract translation: 活性或功能添加剂嵌入主体材料的表面，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得到的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。

公开(公告)号：US11968788B2

公开(公告)日：2024-04-23

申请号：US17333274

申请日：2021-05-28

Applicant: Avary Holding (Shenzhen) Co., Limited. ,  QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD ,  GARUDA TECHNOLOGY CO., LTD.

Inventor： Yong-Quan Yang ,  Han-Pei Huang

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46

CPC classification number: H05K3/4644 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/189 ,  H05K3/303 ,  H05K2201/0364 ,  H05K2201/05

Abstract: A method for manufacturing a fixing belt for a wearable device, includes providing a flexible circuit board including a first area, a second area, and a pad in the first area; disposing an insulating layer on the flexible circuit board, the insulating layer being disposed in the second area; forming an electric conductive portion in the insulating layer; disposing a first protective layer and a second protective layer on opposite surfaces of the flexible circuit board, the electric conductive portion being between the flexible circuit board and the first protective layer; mounting an electronic component on the pad. A portion of the fixing belt containing the second area is a plug-in area, and the plug-in area is configured to be engaged with a device body of the wearable device, the electric conductive portion is disposed in the plug-in area.