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11.发明申请Angle-Adjustable And/Or Angled Printed Circuit Board Structure Having At Least Two Printed Circuit Board Sections And Method For Producing The Same 有权具有至少两个印刷电路板部分的角度可调和/或有角度的印刷电路板结构及其制造方法公开(公告)号：US20150327355A1
公开(公告)日：2015-11-12
申请号：US14443231
申请日：2013-11-15
Applicant: JUMATECH GMBH
Inventor： Markus WÖLFEL
CPC classification number: H05K1/028 , H05K1/0265 , H05K1/0278 , H05K1/111 , H05K3/0014 , H05K3/0017 , H05K3/202 , H05K2201/0275 , H05K2201/0355 , H05K2201/0376 , H05K2201/057 , H05K2201/09027 , H05K2201/0969 , H05K2201/1028 , Y10T29/49156
Abstract: An angle-adjustable printed circuit board structure having two printed circuit board sections arranged angularly with respect to one another. The printed circuit board structure contains at least one conduction element which is embedded at least predominantly in the printed circuit board structure and which extends between two contact pads and is electrically conductively connected to said contact pads. The two contact pads are situated on different printed circuit board sections. The printed circuit board sections are angle-adjustable and/or angled relative to one another with maintenance of the connections between the contact pads and the at least one conduction element and with bending of the at least one conduction element via a bending edge between the printed circuit board sections. The conduction element has a larger extent along the bending edge than perpendicularly thereto, as viewed in cross section.
Abstract translation: 一种角度可调的印刷电路板结构，其具有相对于彼此成角度地布置的两个印刷电路板部分。 印刷电路板结构包含至少一个导电元件，其至少主要嵌入在印刷电路板结构中，并且在两个接触焊盘之间延伸并且导电地连接到所述接触焊盘。 两个接触垫位于不同的印刷电路板部分上。 印刷电路板部分可相对于彼此具有角度可调节和/或成角度，同时维持接触焊盘和至少一个传导元件之间的连接，并且通过经印刷的弯曲边缘弯曲至少一个导电元件 电路板部分。 如横截面所示，导电元件沿着弯曲边缘比垂直方向具有更大的程度。
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公开(公告)号：US09173289B2
公开(公告)日：2015-10-27
申请号：US14628455
申请日：2015-02-23
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru Kato , Jun Sasaki , Satoshi Ishino
CPC classification number: H05K1/0281 , H05K1/024 , H05K1/028 , H05K1/0298 , H05K1/032 , H05K1/09 , H05K2201/0141 , H05K2201/057 , H05K2201/0715 , H05K2201/09018 , H05K2201/09409
Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.
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公开(公告)号：US08692125B2
公开(公告)日：2014-04-08
申请号：US13369363
申请日：2012-02-09
Applicant: Noboru Kato , Jun Sasaki , Satoshi Ishino
Inventor： Noboru Kato , Jun Sasaki , Satoshi Ishino
IPC: H05K1/00
CPC classification number: H05K1/0281 , H05K1/024 , H05K1/028 , H05K1/0298 , H05K1/032 , H05K1/09 , H05K2201/0141 , H05K2201/057 , H05K2201/0715 , H05K2201/09018 , H05K2201/09409
Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.
Abstract translation: 保持弯曲状态而不引起电特性波动的多层基板包括：主体，其包括要堆叠并由柔性材料制成的多个绝缘片。 信号线在主体中延伸。 接地导体相对于主体中的信号线在z轴方向的正方向侧设置，并且在从z轴方向看的俯视图中与信号线重叠。 接地导体相对于主体中的信号线在z轴方向的负方向侧设置，并且在从z轴方向观察的俯视图中与信号线重叠。 主体弯曲的状态使得信号线定义为电弧，由接地导体的塑性变形保持。
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公开(公告)号：US08603574B2
公开(公告)日：2013-12-10
申请号：US12940544
申请日：2010-11-05
Applicant: Lili Huang , Seung Jae Hong , John Z. Zhong
Inventor： Lili Huang , Seung Jae Hong , John Z. Zhong
IPC: H05K3/00
CPC classification number: G06F3/044 , G06F2203/04103 , H05K1/028 , H05K3/0014 , H05K2201/057
Abstract: A method of forming a curved touch surface is disclosed. The method can include depositing and patterning a conductive thin film on a flexible substrate to form at least one touch sensor pattern, while the flexible substrate is in a flat state. According to certain embodiments, the method can include supporting the flexible substrate in the flat state on at least one curved forming substrate having a predetermined curvature; and performing an anneal process, or an anneal-like high-heat process, on the conductive thin film, wherein the anneal process can cause the flexible substrate to conform to the predetermined curvature of the at least one curved forming substrate. According to an embodiment, the curved forming substrate can include a first forming substrate having a first predetermined curvature and a second forming substrate having a second predetermined curvature complementing the first predetermined curvature.
Abstract translation: 公开了一种形成弯曲的触摸表面的方法。 该方法可以包括在柔性基板上沉积和图案化导电薄膜以形成至少一个触摸传感器图案，同时柔性基板处于平坦状态。 根据某些实施例，该方法可以包括在至少一个具有预定曲率的弯曲成形衬底上支撑处于平坦状态的柔性衬底; 以及对所述导电薄膜进行退火处理或类似于退火的高热处理，其中所述退火工艺可使所述柔性衬底符合所述至少一个弯曲成形衬底的预定曲率。 根据实施例，弯曲成形基板可以包括具有第一预定曲率的第一成形基板和具有补充第一预定曲率的第二预定曲率的第二成形基板。
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15.发明申请LIQUID EJECTION HEAD AND FLEXIBLE WIRING SUBSTRATE USED IN LIQUID EJECTION HEAD 失效液体喷射头使用液体喷射头和柔性布线基板公开(公告)号：US20120113192A1
公开(公告)日：2012-05-10
申请号：US13284626
申请日：2011-10-28
Applicant: Satoshi Kimura , Satoshi Oikawa , Kenji Kitabatake , Yukuo Yamaguchi
Inventor： Satoshi Kimura , Satoshi Oikawa , Kenji Kitabatake , Yukuo Yamaguchi
CPC classification number: H05K1/028 , B41J2/1753 , B41J2/17553 , H05K2201/057 , H05K2201/09781
Abstract: A flexible wiring substrate that is used in a liquid ejection head having an element substrate provided with energy generating elements for generating energy for ejecting liquid includes: a bending portion; a base member including resin; electrical wiring lines formed on the base member and electrically connected to the element substrate, the electrical wiring lines extending over a ridge of the bending portion; and a metal layer that is arranged on an area of the base member in which no electrical wiring lines are provided and that is not electrically connected to the element substrate, the metal layer extending over the ridge.
Abstract translation: 一种柔性布线基板，其用于具有设置有用于产生喷射液体的能量的能量产生元件的元件基板的液体喷射头包括：弯曲部分; 包括树脂的基底构件; 形成在所述基底构件上并电连接到所述元件基板的电布线，所述电布线延伸越过所述弯曲部分的脊; 以及金属层，其设置在所述基底构件的没有设置电布线并且没有电连接到所述元件基板的区域上，所述金属层在所述脊上延伸。
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Patent Agency Ranking
16.发明授权公开(公告)号：US06239372B1
公开(公告)日：2001-05-29
申请号：US09085231
申请日：1998-05-27
Applicant: Bernhard Gartner , Matthias Schnell , Joerg Wolke , Peter Schaefer , Hans-Erich Steinmann , Guenter Trogisch
Inventor： Bernhard Gartner , Matthias Schnell , Joerg Wolke , Peter Schaefer , Hans-Erich Steinmann , Guenter Trogisch
IPC: H02G1502
CPC classification number: B81B7/007 , B81B7/0006 , H05K1/0281 , H05K1/189 , H05K3/28 , H05K3/281 , H05K2201/0195 , H05K2201/057 , H05K2201/2009 , H05K2203/1327
Abstract: An electrical connection in which a flexible, elastic conductor track carrier is affixed by a connecting end to an electrical component and embedded in potting compound. To prevent breakage at the fastening point at the transition from the potting compound to the outside, the conductor track carrier is reinforced with additional layers of insulating material.
Abstract translation: 一种电连接，其中柔性弹性导体轨道载体通过连接端固定到电气部件并嵌入灌封混合物中。 为了防止在从灌封化合物到外部的过渡处的紧固点处的断裂，导体轨道载体被附加的绝缘材料层增强。
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公开(公告)号：US6032357A
公开(公告)日：2000-03-07
申请号：US98155
申请日：1998-06-16
Applicant: Albert Wojewnik
Inventor： Albert Wojewnik
CPC classification number: H05K1/0283 , B60R16/0207 , H05K3/0014 , H05K2201/057 , H05K2201/09018 , H05K2201/091 , H05K2203/0271 , H05K2203/1105 , H05K2203/302 , Y10T156/1039 , Y10T156/1041 , Y10T29/49126 , Y10T29/49155
Abstract: The present invention comprises a printed circuit having a three-dimensional surface capable of conforming to a contoured surface of a vehicle trim panel. Printed circuit comprises a plurality of electrical conductors and connectors secured to a polymeric substrate. A convoluted region of the printed circuit permits formation of the three-dimensional surface in the printed circuit. The present invention further comprises a method a producing three-dimensional surface and the printed circuit by either thermoforming the printed circuit or mechanically stretching the printed circuit to produce the three-dimensional surface.
Abstract translation: 本发明包括具有能够符合车辆装饰板的轮廓表面的三维表面的印刷电路。 印刷电路包括固定到聚合物基底上的多个电导体和连接器。 印刷电路的卷积区域允许在印刷电路中形成三维表面。 本发明还包括通过热成型印刷电路或机械拉伸印刷电路以产生三维表面来制造三维表面和印刷电路的方法。
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公开(公告)号：US4974121A
公开(公告)日：1990-11-27
申请号：US199878
申请日：1988-05-27
Applicant: Kazuhisa Masuko , Yosuke Ishiguro
Inventor： Kazuhisa Masuko , Yosuke Ishiguro
CPC classification number: H05K3/363 , H02G3/00 , H05K1/118 , H05K1/095 , H05K1/117 , H05K2201/048 , H05K2201/052 , H05K2201/053 , H05K2201/057 , H05K2201/0715 , H05K2201/09145 , H05K2201/10189 , H05K2201/10393 , H05K2201/2009 , H05K3/4644
Abstract: A wiring module for electrically connecting a plurality of electric parts disposed on an equipment frame to a source of electric power, the module comprising an elongated insulating substrate formed to extend along a path adjacent to electric parts disposed on the frame. A pattern of wiring conductors extends along and integral with the insulating substrate for conducting electric current from the source of electric power to each of the electric parts to be connected. The insulating substrate has one or more edge portions provided with protrusions integrally formed with the substrate and extending laterally therefrom. The protrusions each are positioned on the insulating substrate at a location adjacent an electric part to be connected and at least a portion of the wiring conductors are integral with the protrusions to provide a contact on the protrusions for connection to corresponding electric parts.
Abstract translation: 一种用于将设置在设备框架上的多个电气部件电连接到电力源的布线模块，所述模块包括细长绝缘基板，所述细长绝缘基板沿着邻近设置在所述框架上的电气部件的路径延伸。 布线导体的图案沿绝缘基板延伸并与绝缘基板一体化，以将电流从电源传导到要连接的每个电气部件。 所述绝缘基板具有设置有与所述基板一体形成并从其横向延伸的突起的一个或多个边缘部分。 突起各自位于绝缘基板上邻近要连接的电气部件的位置，并且布线导体的至少一部分与凸起成一体，以在突出部上提供与相应的电气部件连接的接触。
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公开(公告)号：US20170347444A1
公开(公告)日：2017-11-30
申请号：US15164847
申请日：2016-05-25
Applicant: MOORETEC CO.,LTD.
Inventor： YU-MIN LIN , CHIA-PIN WANG , CHIA-CHING SUNG , NA LU
CPC classification number: H05K1/028 , H05K1/0353 , H05K1/0393 , H05K3/0014 , H05K3/182 , H05K3/185 , H05K3/28 , H05K3/4635 , H05K2201/041 , H05K2201/057 , H05K2203/0709 , H05K2203/085 , H05K2203/1105 , H05K2203/1327
Abstract: The present invention provides a manufacturing method of a curved circuit board which includes the following steps. The first step is to provide a flexible substrate. The next step is to form a patterned catalyst layer on the flexible substrate. The next step is to deposit metal on the patterned catalyst layer by electroless plating to form a wiring substrate, wherein the wiring substrate includes a planar wiring structure. The last step is to place the wiring substrate into a mold having a molding surface with a three-dimensional design, and then execute a heating process to shape the planar wiring structure to a three-dimensional wiring structure, wherein the heated wiring substrate is laminated to the molding surface of the mold. The present invention further provides an electronic product using the curved circuit board.
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公开(公告)号：US09635764B2
公开(公告)日：2017-04-25
申请号：US14866648
申请日：2015-09-25
Applicant: Intel Corporation
Inventor： Shipeng Qiu , Shawna Liff , Kayleen L Helms , Joshua D Heppner , Adel Elsherbini , Johanna Swan , Gary M. Barnes
CPC classification number: H05K1/189 , H05K1/0278 , H05K1/028 , H05K1/036 , H05K1/144 , H05K3/0014 , H05K3/22 , H05K3/303 , H05K3/326 , H05K3/361 , H05K2201/0133 , H05K2201/0308 , H05K2201/041 , H05K2201/047 , H05K2201/057 , H05K2201/10007 , H05K2201/10128 , H05K2203/10 , H05K2203/104 , H05K2203/105 , H05K2203/1105 , H05K2203/1194
Abstract: An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.
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