公开(公告)号：US20170130947A1

公开(公告)日：2017-05-11

申请号：US14935075

申请日：2015-11-06

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： ANITA SURE ,  VIGHNESWARA RAO KOLLATI ,  RAGHUVEER HANUMANTHRAO DESAI

IPC: F21V29/503 ,  F21K99/00

CPC classification number: F21V29/503 ,  F21K9/30 ,  F21V29/74 ,  F21V29/83 ,  F21Y2105/001 ,  F21Y2105/16 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/642 ,  H05K1/0209 ,  H05K1/05 ,  H05K2201/09045 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/10106

Abstract: An LED panel includes a support having a first side, a second side opposite the first side, and a window that extends from the first side to the second side. An LED is affixed to the first side. A diverter affixed to the second side. The diverter includes an angled portion, wherein the angled portion extends over a window portion that is less than all of the window.

公开(公告)号：US09608364B2

公开(公告)日：2017-03-28

申请号：US14060873

申请日：2013-10-23

Applicant: GERMANE SYSTEMS, LC

Inventor： Michael Stock ,  Scott Semmler

IPC: H01R13/533 ,  H05K3/00 ,  H05K7/14 ,  H05K1/14 ,  H01R12/70 ,  H05K3/36

CPC classification number: H01R13/533 ,  H01R12/7029 ,  H05K1/141 ,  H05K3/00 ,  H05K3/366 ,  H05K7/1405 ,  H05K2201/09045 ,  H05K2201/09909 ,  H05K2201/10159 ,  H05K2201/10325 ,  H05K2201/10606 ,  Y10T29/49117 ,  Y10T156/1089

Abstract: A circuit board that is to be mounted in a connector socket includes a plurality of electrical connectors located along a side edge of the circuit board. Retention bosses are formed on first and second opposite sides of the circuit board, each of the retention bosses protruding from a surface of the circuit board and extending parallel to and adjacent to the first edge of the circuit board. When the first edge of the circuit board is inserted into a slot of a connector socket, contact surfaces of the first and second retention bosses contact top surfaces of the connector socket to help immobilize the circuit board with respect to the connector socket. Adhesive layers on the contact surfaces of the first and second retention bosses may adhere to the top surfaces of the connector socket to help hold the circuit board immobile with respect to the connector socket.

公开(公告)号：US09560772B2

公开(公告)日：2017-01-31

申请号：US12674129

申请日：2008-07-18

Applicant: Stefan Kopf ,  Hartmut Rohde

Inventor： Stefan Kopf ,  Hartmut Rohde

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/36 ,  H01R12/71 ,  H01R13/405 ,  H05K1/02 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K3/368 ,  H01R12/714 ,  H01R13/405 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/181 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10393

Abstract: An electric circuit configuration having an MID circuit carrier and a connecting interface, the connecting interface being situated on a surface of the MID circuit carrier. The electric circuit configuration further includes at least one electrical contact pair having at least one connecting interface contact element and at least one MID contact element that is provided on the surface and is situated on the connecting interface contact element. The exemplary embodiments and/or exemplary methods of the present invention further relates to a contact element group having at least one electrical contact element for the electrical contacting of an MID circuit carrier, which is developed on a surface of an MID circuit carrier, is electrically connected to it, and extends away from the surface. The at least one contact element is connected to a line element of the MID circuit carrier.

Abstract translation: 一种具有MID电路载体和连接接口的电路结构，该连接接口位于MID电路载体的表面上。 电路结构还包括至少一个电接触对，其具有至少一个连接接口接触元件和设置在表面上并位于连接接口接触元件上的至少一个MID接触元件。 本发明的示例性实施例和/或示例性方法还涉及一种接触元件组，其具有至少一个电接触元件，用于在MID电路载体的表面上显影的MID电路载体的电接触， 连接到它，并远离表面延伸。 所述至少一个接触元件连接到所述MID电路载体的线路元件。

公开(公告)号：US09513759B2

公开(公告)日：2016-12-06

申请号：US14217544

申请日：2014-03-18

Applicant: Eastman Kodak Company

Inventor： Ronald Steven Cok

IPC: H01L29/41 ,  G06F3/047 ,  H01L33/42 ,  H01L51/52 ,  G06F3/044 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K1/09

CPC classification number: G06F3/047 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01L29/413 ,  H01L33/42 ,  H01L51/5215 ,  H05K1/0289 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/117 ,  H05K3/465 ,  H05K3/4664 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09845 ,  H05K2201/10128 ,  Y10T29/49155

Abstract: A multi-layer micro-wire structure includes first and second substrates having first and second layers extending to first and second layer edges, respectively. The first layer includes first micro-wire electrodes and first connection pads. Each first micro-wire electrode includes one or more electrically connected first micro-wires and each first connection pad electrically connects to a corresponding first micro-wire electrode. The second layer includes second micro-wire electrodes and second connection pads. Each second micro-wire electrode includes one or more electrically connected second micro-wires, and each second connection pad electrically connects to a corresponding second micro-wire electrode. The second layer is located between the first substrate and the second substrate and the second layer edge extends at least partly beyond the first layer edge so that one or more of the second connection pads is located between at least a portion of the first layer edge and the second layer edge.

Abstract translation: 多层微线结构包括分别具有延伸到第一和第二层边缘的第一和第二层的第一和第二基底。 第一层包括第一微线电极和第一连接焊盘。 每个第一微线电极包括一个或多个电连接的第一微线，并且每个第一连接焊盘电连接到对应的第一微线电极。 第二层包括第二微线电极和第二连接焊盘。 每个第二微线电极包括一个或多个电连接的第二微线，并且每个第二连接焊盘电连接到对应的第二微线电极。 第二层位于第一衬底和第二衬底之间，并且第二层边缘至少部分地延伸超过第一层边缘，使得一个或多个第二连接焊盘位于第一层边缘的至少一部分和 第二层边缘。

公开(公告)号：US20160341368A1

公开(公告)日：2016-11-24

申请号：US15114831

申请日：2015-01-27

Applicant: SHANGHAI SANSI ELECTRONIC ENGINEERING CO., LTD ,  SHANGHAI SANSI SCIENCE AND TECHNOLOGY DEVELOPMENT CO., LTD ,  JIASHAN SANSI PHOTOELECTRIC TECHNOLOGY CO. , LTD

Inventor： Bishou ChEN ,  Li XU ,  Peng WANG ,  Xiaoliang HE ,  Sheng LI ,  Haibo LIU

IPC: F21K9/232 ,  F21V29/74 ,  F21V29/83 ,  F21K9/238 ,  B05D3/02 ,  F21V17/10 ,  F21K9/237 ,  F21V3/02 ,  F21K9/235 ,  F21V19/00 ,  F21V3/04 ,  F21V23/00

CPC classification number: F21K9/232 ,  B05D3/0254 ,  F21K9/20 ,  F21K9/235 ,  F21K9/237 ,  F21K9/238 ,  F21V3/02 ,  F21V3/061 ,  F21V3/10 ,  F21V17/101 ,  F21V19/006 ,  F21V23/00 ,  F21V23/005 ,  F21V29/506 ,  F21V29/74 ,  F21V29/83 ,  F21V29/86 ,  F21Y2113/00 ,  F21Y2115/10 ,  H05K1/0284 ,  H05K1/097 ,  H05K3/0014 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0999 ,  H05K2201/10106

Abstract: An LED light device and a circuit preparation method thereof are provided. The LED light device includes a base, an LED light unit, and a lamp shade. The LED light-emitting unit and the lamp shade are arranged on the base. The lamp shade covers the LED light-emitting unit inside. The circuit preparation method includes following steps of: providing a base which is a physical entity having a three-dimensional structure on the surface thereof; coating a circuit layer on the base surface through a programmable coating equipment, manual coating or the combined mode, wherein the circuit layer is a liquid or powder coating containing metal materials, and the thickness of the circuit layer is 20 μm or more; baking the base coated with the circuit layer at the high temperature of 100-1,000° C. until the circuit layer is dried; and obtaining a base having a three-dimensional circuit after cooling.

Abstract translation: 提供了一种LED灯装置及其电路制备方法。 LED灯装置包括基座，LED灯单元和灯罩。 LED发光单元和灯罩布置在基座上。 灯罩内置LED发光单元。 电路准备方法包括以下步骤：在其表面上提供具有三维结构的物理实体的基座; 通过可编程涂层设备，手动涂层或组合模式在基底表面上涂覆电路层，其中电路层是含有金属材料的液体或粉末涂层，电路层的厚度为20μm以上; 在100-1,000℃的高温下烘烤涂覆有电路层的基底，直到电路层干燥; 并在冷却后获得具有三维电路的基底。

公开(公告)号：US09412677B2

公开(公告)日：2016-08-09

申请号：US11841351

申请日：2007-08-20

Applicant: Teck Kheng Lee

Inventor： Teck Kheng Lee

IPC: H01L23/13 ,  H01L23/00 ,  H01L23/498 ,  H05K3/34 ,  H05K3/40 ,  H01L23/31 ,  H01L25/065 ,  H01L25/16 ,  H05K1/02

CPC classification number: H01L23/13 ,  G06F1/18 ,  G06F1/183 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/0284 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09481 ,  H05K2201/10719 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Various embodiments of an interposer for mounting a semiconductor die, as well as methods for forming the interposer, are disclosed. The interposer includes flexible solder pad elements that are formed from a core material of the interposer, such that the interposer may absorb thermally induced stresses and conform to warped or uneven surfaces. Embodiments of electronic device packages including a semiconductor die mounted to and electrically connected to the interposer, as well as methods for forming the electronic device packages, are also disclosed. In one electronic device package, the semiconductor die is electrically connected to the interposer with wire bonds attached to a routing layer of the interposer. In another electronic device package, the semiconductor die is electrically connected to the interposer by bonding the semiconductor die to the flexible solder pad elements of the interposer in a flip-chip configuration. A computer system incorporating an electronic device package with an interposer according to the present invention is also disclosed.

Abstract translation: 公开了用于安装半导体管芯的插入件的各种实施例以及用于形成插入件的方法。 插入器包括由插入器的芯材料形成的柔性焊盘元件，使得插入器可以吸收热诱导的应力并且符合​​翘曲或不平坦的表面。 还公开了包括安装到内插器并且电连接到插入器的半导体管芯的电子器件封装的实施例以及用于形成电子器件封装的方法。 在一个电子器件封装中，半导体管芯通过连接到插入器的布线层上的引线电连接到插入器。 在另一个电子器件封装中，半导体管芯通过以倒装芯片配置将半导体管芯连接到插入器的柔性焊盘元件而电连接到插入器。 还公开了一种结合根据本发明的具有插入器的电子器件封装的计算机系统。

公开(公告)号：US09377641B2

公开(公告)日：2016-06-28

申请号：US14257612

申请日：2014-04-21

Applicant: Samsung Display Co., Ltd.

Inventor： Il-Hwan Yoon ,  Seung-Chang Woo

IPC: G02F1/1345 ,  G02F1/1333 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18

CPC classification number: G02F1/133305 ,  G02F1/13452 ,  H05K1/0281 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/09045 ,  H05K2201/09781 ,  H05K2201/10136 ,  H05K2201/10681

Abstract: A tape package includes a body portion including a flexible material, a driving circuit disposed on the body portion, a first sub-connection portion extending from the body portion in a first direction, a first main-connection portion extending from the first sub-connection portion in the first direction, a first lead line including a first end electrically connected to the driving circuit and a second end extending in the first direction, the first end being opposite to the second end and a protrusion extending from the first sub-connection portion in a third direction perpendicular to the first direction on a same plane with the first sub-connection portion. Accordingly, a crack of the lead line may be reduced or effectively prevented.

Abstract translation: 一种胶带包装体包括：主体部分，包括柔性材料;驱动电路，设置在主体部分上;第一副连接部分，从本体部分沿第一方向延伸;第一主连接部分，从第一子连接部分 所述第一引线包括电连接到所述驱动电路的第一端和沿所述第一方向延伸的第二端，所述第一端与所述第二端相对，所述第一端与所述第一子连接部分延伸， 在与第一子连接部分相同的平面上在垂直于第一方向的第三方向上。 因此，可以降低或有效地防止引线的裂纹。

公开(公告)号：US09355769B2

公开(公告)日：2016-05-31

申请号：US12329887

申请日：2008-12-08

Applicant: James E. Quilici

Inventor： James E. Quilici

IPC: H01F17/06 ,  H01F41/04 ,  H01F17/00 ,  H01F41/02 ,  H05K1/16 ,  H01F27/02 ,  H01F27/28 ,  H05K1/14

CPC classification number: H01F17/0033 ,  H01F17/062 ,  H01F27/027 ,  H01F41/02 ,  H01F41/0206 ,  H01F41/041 ,  H01F41/042 ,  H01F41/064 ,  H01F2027/2814 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/165 ,  H05K3/0014 ,  H05K3/20 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0139 ,  H05K2203/0143 ,  H05K2203/0292 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49075 ,  Y10T156/10

Abstract: A method in accordance with an embodiment comprises forming a feature on a substrate, disposing a first conductive pattern on the substrate and the feature, disposing a permeability material within the feature, disposing a substrate material on the substrate and the feature to facilitate substantial enclosure of the permeability material between the substrate and the substrate material, and disposing a second conductive pattern on the substrate material. The first conductive pattern and the second conductive pattern define at least one electrical circuit operable for coupling to a current source so as to cooperate to be capable of facilitating a magnetic field about the permeability material.

Abstract translation: 根据实施例的方法包括在衬底上形成特征，在衬底上设置第一导电图案和特征，将透气性材料设置在特征内，将衬底材料设置在衬底上，并且特征以便于实质上包围 所述基板和所述基板材料之间的导磁材料，并且在所述基板材料上设置第二导电图案。 第一导电图案和第二导电图案限定了至少一个电路，其可操作用于耦合到电流源，以便协调以便于围绕磁导率材料的磁场。

公开(公告)号：US09204551B2

公开(公告)日：2015-12-01

申请号：US13883130

申请日：2011-11-08

Applicant: Masahiro Kubo

Inventor： Masahiro Kubo

IPC: H02B1/00 ,  H05K1/18 ,  H01L23/13 ,  H05K3/34 ,  H01L23/00 ,  H05K1/11 ,  H05K1/02 ,  G02B6/42

CPC classification number: H05K1/18 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/4239 ,  G02B6/4274 ,  H01L23/13 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/10145 ,  H01L2224/10175 ,  H01L2224/13011 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/16237 ,  H01L2224/17505 ,  H01L2224/17517 ,  H01L2224/29111 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/81902 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/0274 ,  H05K1/111 ,  H05K3/3421 ,  H05K3/3436 ,  H05K2201/09045 ,  H05K2201/09472 ,  H05K2203/0307 ,  H05K2203/1173 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2924/014 ,  H01L2924/00

Abstract: Provided is a mounting structure capable of maintaining highly accurate connection reliability even when the temperature of the environment in which the mounting structure is used is high. Mounting structure (10) includes electronic component (11), metal (12), wiring substrate (13), and a preventing structure. Electronic component (11) includes first electrode (14). The melting point of metal (12) is 130° C. or less. Wiring substrate (13) includes second electrode (15) electrically connected to first electrode (14) via metal (12). The preventing structure prevents flowing-out of metal (12) in a melted state from a region where first electrode (14) and second electrode (15) are formed. Further, preventing structure (14) is formed in at least one member selected from electronic component (11) and wiring substrate (12).

Abstract translation: 提供了即使当使用安装结构的环境的温度高时也能够保持高度精确的连接可靠性的安装结构。 安装结构（10）包括电子部件（11），金属（12），布线基板（13）和防止结构。 电子部件（11）包括第一电极（14）。 金属（12）的熔点为130℃以下。 配线基板（13）包括通过金属（12）与第一电极（14）电连接的第二电极（15）。 防止结构防止从形成第一电极（14）和第二电极（15）的区域流出熔融状态的金属（12）。 此外，防止结构（14）形成在从电子部件（11）和布线基板（12）中选择的至少一个中。

公开(公告)号：US09204530B2

公开(公告)日：2015-12-01

申请号：US13869553

申请日：2013-04-24

Applicant: PANASONIC CORPORATION

Inventor： Hiromitsu Takashita ,  Tsuyoshi Takeda ,  Yuko Konno ,  Hiroaki Fujiwara ,  Shingo Yoshioka

IPC: H05K7/00 ,  H05K1/02 ,  H01L23/498 ,  H01L21/56 ,  H05K3/36 ,  H01L25/065 ,  H01L23/00 ,  H01L23/66 ,  H01L25/10 ,  H05K1/11 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K1/0213 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/66 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6605 ,  H01L2224/02311 ,  H01L2224/0235 ,  H01L2224/0237 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/131 ,  H01L2224/16104 ,  H01L2224/16105 ,  H01L2224/16112 ,  H01L2224/16113 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32104 ,  H01L2224/32105 ,  H01L2224/32147 ,  H01L2224/32148 ,  H01L2224/32227 ,  H01L2224/32237 ,  H01L2224/32238 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/30111 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K1/112 ,  H05K1/114 ,  H05K3/323 ,  H05K3/368 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09227 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09381 ,  H05K2201/09427 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

Abstract: The present invention relates to electronic components assembly for electrically connecting electronic components to each other, wherein a wiring formed on a surface of a first electronic component and a wiring formed on a surface of a second electronic component face each other, and are bonded to each other with an electric conductor interposed therebetween, so as to electrically connect the first electronic component and the second electronic component. The electric conductor is a resin composition containing solder or conductive filler.

Abstract translation: 本发明涉及将电子部件彼此电连接的电子部件组件，其中形成在第一电子部件的表面上的布线和形成在第二电子部件的表面上的布线彼此面对，并且被接合到每个 另一个电导体插入其间，以便电连接第一电子部件和第二电子部件。 电导体是含有焊料或导电填料的树脂组合物。