公开(公告)号：US09575040B2

公开(公告)日：2017-02-21

申请号：US14265623

申请日：2014-04-30

Applicant: International Business Machines Corporation

Inventor： S. Jay Chey ,  Hendrik F. Hamann ,  Levente I. Klein ,  Michael A. Schappert ,  Prabjit Singh

IPC: G01R27/08 ,  G01N19/00 ,  G01N33/00 ,  G01N17/04 ,  G01N17/00 ,  G01N27/04

CPC classification number: G01N33/0027 ,  G01N17/00 ,  G01N17/046 ,  G01N27/04 ,  H05K2201/09736 ,  Y10T29/49124

Abstract: A corrosion sensor includes a plurality of metal strips having different thicknesses. A first metal strip with the least thickness is first employed to provide sensitive corrosion detection. After an exposed portion of the first metal strip is consumed, a second metal strip having a second least thickness can be employed to provide continued sensitive corrosion detection employing a remaining un-corroded portion of the second metal strip. The plurality of metal strips can be sequentially employed as exposed portions of thinner metal strips become unusable through complete corrosion and un-corroded exposed portions of thicker metal strips become thin enough to provide sensitive corrosion detection.

Abstract translation: 腐蚀传感器包括具有不同厚度的多个金属条。 首先使用具有最小厚度的第一金属条来提供敏感的腐蚀检测。 在消耗第一金属带的暴露部分之后，可以使用具有第二最小厚度的第二金属带，以使用第二金属带的剩余未腐蚀部分提供连续敏感的腐蚀检测。 可以顺序地使用多个金属条，因为较薄金属条的暴露部分通过完全腐蚀变得不可用，而较厚金属条的未腐蚀暴露部分变得足够薄以提供敏感的腐蚀检测。

公开(公告)号：US09560756B2

公开(公告)日：2017-01-31

申请号：US14202333

申请日：2014-03-10

Applicant: Hefei BOE Optoelectronics Technology Co., LTD. ,  BOE Technology Group Co., LTD.

Inventor： Juncai Ma

IPC: H01R9/00 ,  H05K1/11 ,  H05K7/00 ,  H05K7/10 ,  G02F1/1345 ,  H05K1/18

CPC classification number: H05K1/111 ,  G02F1/13452 ,  G02F1/13454 ,  G02F1/13458 ,  H05K1/181 ,  H05K2201/094 ,  H05K2201/09436 ,  H05K2201/09709 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2201/10234 ,  Y02P70/611

Abstract: The present invention relates to an array substrate assembly and a display device. The array substrate assembly comprises a substrate; a first metal line formed at one side of the substrate; an insulating layer formed on the first metal line; a second metal line formed on the insulating layer, wherein one end of the second metal line connected with a driving circuit is formed with a second terminal, wherein in a thickness direction of the substrate, a distance between a surface of the second terminal away from the one side of the substrate and the substrate is less than a distance between a surface of the second metal line away from the one side of the substrate and the substrate. The display device includes the array substrate assembly. With the solution of the present invention, when the array substrate assembly is connected to IC or COF, deformation difference between a conducting gold ball at a gate line terminal and a conducting gold ball at a date line is small, thus impedances at the two terminals are close to each other, and therefore image quality of the display device is improved.

Abstract translation: 本发明涉及阵列基板组件和显示装置。 阵列基板组件包括基板; 形成在所述基板一侧的第一金属线; 形成在所述第一金属线上的绝缘层; 形成在绝缘层上的第二金属线，其中与驱动电路连接的第二金属线的一端形成有第二端子，其中在基板的厚度方向上，第二端子的表面之间的距离远离 基板和基板的一侧小于离开基板的一侧的第二金属线的表面与基板之间的距离。 显示装置包括阵列基板组件。 利用本发明的解决方案，当阵列基板组件连接到IC或COF时，栅极线端子处的导电金球与日期线处的导电金球之间的变形差小，因此两个端子处的阻抗 彼此接近，因此改善了显示装置的图像质量。

公开(公告)号：US20160316570A1

公开(公告)日：2016-10-27

申请号：US14772888

申请日：2014-12-17

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： ADRIANUS JOHANNES STEPHANUS MARIA DE VAAN ,  WILHELMUS GERARDUS MARIA PEELS ,  JOSEPHUS PAULUS AUGUSTINUS DEEBEN

IPC: H05K3/32 ,  H05K3/12 ,  H05K3/00 ,  H05K3/44

CPC classification number: H05K3/32 ,  H05K1/0284 ,  H05K1/056 ,  H05K1/092 ,  H05K3/0014 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/321 ,  H05K3/44 ,  H05K2201/0129 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2203/1461

Abstract: A method for manufacturing a non-planar printed circuit board assembly (1) is disclosed. The method comprises providing a planar formable substrate (2) for supporting a conductive material (3) and at least one electronic component (4), printing a circuit pattern of an uncured conductive material (3) on the planar substrate (2), forming the substrate (2) and the uncured conductive material (3) into a non-planar shape, and curing the conductive material (3), wherein the substrate (2) comprises a metal sheet and an electrically insulating coating (2b) arranged between the metal sheet and the conductive material (3).

Abstract translation: 公开了一种用于制造非平面印刷电路板组件（1）的方法。 该方法包括提供用于支撑导电材料（3）和至少一个电子部件（4）的平面可成形基底（2），在平面基底（2）上印刷未固化的导电材料（3）的电路图案，形成 所述基板（2）和所述未固化的导电材料（3）成为非平面形状，并且固化所述导电材料（3），其中所述基板（2）包括金属片和布置在所述导电材料（3）之间的电绝缘涂层 金属片和导电材料（3）。

公开(公告)号：US20160278200A1

公开(公告)日：2016-09-22

申请号：US15074503

申请日：2016-03-18

Applicant: THALES

Inventor： David Costes

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/40 ,  H05K1/18

CPC classification number: H05K1/0206 ,  B33Y80/00 ,  H05K1/0298 ,  H05K1/185 ,  H05K3/1241 ,  H05K3/4038 ,  H05K3/46 ,  H05K3/4664 ,  H05K3/4694 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/08 ,  H05K2201/09736

Abstract: The manufacturing method gives the possibility of manufacturing a printed circuit comprising an electrically insulating substrate and electrically conductive elements borne by the substrate. The manufacturing method comprises the manufacturing of the insulating substrate and of the conductive elements together by additive manufacturing.

Abstract translation: 制造方法给出制造包括电绝缘基板和由基板承载的导电元件的印刷电路的可能性。 制造方法包括通过添加剂制造将绝缘基板和导电元件一起制造。

公开(公告)号：US09426887B2

公开(公告)日：2016-08-23

申请号：US13927554

申请日：2013-06-26

Applicant: KYOCERA SLC Technologies Corporation

Inventor： Yoshihiro Hosoi ,  Takayuki Taguchi ,  Hidetoshi Yugawa

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/115 ,  H05K1/113 ,  H05K3/4602 ,  H05K2201/09436 ,  H05K2201/09736 ,  H05K2201/099 ,  H05K2201/1034 ,  H05K2201/10674

Abstract: A wiring board according to the present invention includes an insulating board; a first pad provided inwardly from a surface of the insulating board and electrically connected to an electrode of an electronic component; a second pad provided on the surface of the insulating board and electrically connected to a lead terminal. The first pad and the second pad include a first layer region made of copper and a second layer region arranged on the first layer region and made of nickel, and a thickness of the second layer region of the second pad is larger than a thickness of the second layer region of the first pad.

Abstract translation: 根据本发明的布线板包括绝缘板; 从绝缘板的表面向内设置并电连接到电子部件的电极的第一焊盘; 第二焊盘，设置在绝缘板的表面上并电连接到引线端子。 第一焊盘和第二焊盘包括由铜制成的第一层区域和布置在第一层区域上并由镍制成的第二层区域，并且第二焊盘的第二层区域的厚度大于 第一垫的第二层区域。

公开(公告)号：US09301386B2

公开(公告)日：2016-03-29

申请号：US13483295

申请日：2012-05-30

Applicant: Tadao Ookawa

Inventor： Tadao Ookawa

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0245 ,  H05K1/0218 ,  H05K1/0253 ,  H05K2201/09736 ,  Y10T29/49128

Abstract: A differential transmission path composed of a pair of transmission lines is formed on an upper surface of a base insulating layer. A ground conductor layer is formed on a lower surface of the base insulating layer. The ground conductor layer is opposite to the differential transmission path with the base insulating layer sandwiched therebetween. A spacing between the transmission lines at a part of the differential transmission path is smaller than a spacing between the transmission lines at another part of the differential transmission path. A thickness of a part of the ground conductor layer overlapping the part of the differential transmission path is smaller than the thickness of another part of the ground conductor layer overlapping the another part of the differential transmission path.

Abstract translation: 在基底绝缘层的上表面上形成由一对传输线组成的差动传输路径。 接地导体层形成在基底绝缘层的下表面上。 接地导体层与夹在其间的基底绝缘层的差动传输路径相反。 在差动传输路径的一部分处的传输线之间的间隔小于差分传输路径的另一部分处的传输线之间的间隔。 与差分传输路径的一部分重叠的接地导体层的一部分的厚度小于与差分传输路径的另一部分重叠的接地导体层的另一部分的厚度。

公开(公告)号：US20160037629A1

公开(公告)日：2016-02-04

申请号：US14813218

申请日：2015-07-30

Applicant: IBIDEN CO., LTD.

Inventor： Nobuya TAKAHASHI

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/18 ,  H01L21/4857 ,  H01L23/49866 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1436 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0296 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/111 ,  H05K1/141 ,  H05K3/16 ,  H05K3/4007 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/0391 ,  H05K2201/0769 ,  H05K2201/09236 ,  H05K2201/0929 ,  H05K2201/094 ,  H05K2201/09654 ,  H05K2201/097 ,  H05K2201/09736 ,  H05K2201/098 ,  H01L2924/014

Abstract: A printed wiring board includes an insulation layer, conductive pads formed on the insulation layer and positioned to connect an electronic component, and a conductive wiring pattern including first and second conductive patterns and formed on the insulation layer such that the conductive wiring pattern is extending between the conductive pads. The first pattern includes first wiring lines, the second pattern includes second wiring lines, the first and second conductive patterns are formed such that the first wiring lines and the second wiring lines are alternately arrayed on the insulation layer, each of the first wiring lines includes a first metal layer formed on an interface with the insulation layer, each of the second wiring lines includes a second metal layer formed on an interface with the insulation layer, and the first metal layer includes a metal material which is different from a metal material forming the second metal layer.

Abstract translation: 印刷布线板包括绝缘层，形成在绝缘层上并定位成连接电子部件的导电焊盘和包括第一和第二导电图案并形成在绝缘层上的导电布线图案，使得导电布线图案在 导电垫。 第一图案包括第一布线，第二图案包括第二布线，第一和第二导电图案形成为使得第一布线和第二布线交替排列在绝缘层上，每个第一布线包括 形成在与所述绝缘层的界面上的第一金属层，每个所述第二布线包括形成在与所述绝缘层的界面上的第二金属层，并且所述第一金属层包括与形成金属的金属材料不同的金属材料 第二金属层。

公开(公告)号：US20150373851A1

公开(公告)日：2015-12-24

申请号：US14727892

申请日：2015-06-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TOMOKO IWAMA

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0271 ,  H01L2224/33 ,  H01L2924/181 ,  H05K1/187 ,  H05K1/188 ,  H05K3/0014 ,  H05K3/4614 ,  H05K2201/0133 ,  H05K2201/0338 ,  H05K2201/037 ,  H05K2201/0382 ,  H05K2201/068 ,  H05K2201/09736 ,  H05K2203/063 ,  H05K2203/1327 ,  Y10T29/49131 ,  H01L2924/00012

Abstract: An electronic device according to the present disclosure includes a component, an electrode placed on the component, a conductor which includes a first conductor section, including an electrode contact surface in contact with the electrode, and two second conductor sections, electrically connected to two respective facing edges of the first conductor section to extend in respective directions away from the electrode and including respective inclined surfaces inclined in directions toward a central axis passing through a center of the electrode and perpendicular to the surface of the electrode, an insulator which is in contact with the two second conductor sections from sides opposite to the central axis and encloses the conductor and the electrode, and a case housing the component, the electrode, the conductor, and the insulator. A space without the insulator is defined between the two second conductor sections.

Abstract translation: 根据本公开的电子设备包括部件，放置在部件上的电极，导体，其包括第一导体部分，第一导体部分包括与电极接触的电极接触表面，以及两个第二导体部分，电连接到两个相应的 所述第一导体部分的相对边缘沿着相对于所述电极的各个方向延伸，并且包括相对于所述倾斜表面倾斜的倾斜表面，所述倾斜表面朝着穿过所述电极的中心并垂直于所述电极的中心的中心轴线倾斜， 其中两个第二导体部分从与中心轴线相反的一侧包围导体和电极，以及容纳该部件，电极，导体和绝缘体的壳体。 在两个第二导体部分之间限定没有绝缘体的空间。

公开(公告)号：US09166397B2

公开(公告)日：2015-10-20

申请号：US14316012

申请日：2014-06-26

Applicant: DENSO CORPORATION ,  Murata Manufacturing Co., Ltd.

Inventor： Yuuki Mikami ,  Toru Itabashi ,  Takahiko Furuta ,  Ryoichi Shiraishi ,  Hiroaki Nakamura ,  Shigeki Nishiyama

IPC: H02H5/04 ,  H01H85/10 ,  H05K1/02 ,  H01H85/046 ,  H01H85/08

CPC classification number: H02H5/047 ,  H01H85/046 ,  H01H85/08 ,  H01H85/10 ,  H05K1/0265 ,  H05K1/0293 ,  H05K2201/09263 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10181

Abstract: An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.

Abstract translation: 电子控制装置包括基板，多个部件安装导线，多个电子部件，公共线，中断线和保护层。 组件安装线和公共线设置在基板上。 电子部件安装在相应的部件安装的导线上并与公共线耦合。 中断线耦合在一个部件安装的线和公共线之间，并且被配置为根据由过电流产生的热量熔化，以中断部件安装的线和公共线之间的耦合。 保护层覆盖包括中断线的基板的表面，并且限定开口部分，使得中断线的至少一部分被暴露。

公开(公告)号：US09155209B2

公开(公告)日：2015-10-06

申请号：US13459628

申请日：2012-04-30

Applicant: Akihiro Sato ,  Masahiro Sasaki ,  Tadahiro Ohmi ,  Akihiro Morimoto

Inventor： Akihiro Sato ,  Masahiro Sasaki ,  Tadahiro Ohmi ,  Akihiro Morimoto

IPC: H05K3/06 ,  H05K3/46 ,  C23F1/02 ,  C23F1/18 ,  C23F4/04 ,  C23F4/00 ,  H05K3/24

CPC classification number: H05K3/4691 ,  C23F1/02 ,  C23F1/18 ,  C23F4/00 ,  C23F4/04 ,  H05K3/064 ,  H05K3/243 ,  H05K3/4652 ,  H05K2201/09736 ,  H05K2203/0369 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/10

Abstract: A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board. The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness “tf” of the conductor layer on the base film formed in the flexible region and the average thickness “tR” of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf

Abstract translation: 提供柔性刚性印刷线路板，其可以保持柔性部分的柔性，同时增加柔性部分的折叠的耐久性，并且可以确保刚性部分中的导电性，以及制造印刷线路板的方法。 柔性刚性印刷电路板包括设置在基膜的至少一个面上的导体层，所述布线基板的一个区域包含基膜为刚性区域，另一区域包含基膜为柔性区域。 形成在柔性区域的基底膜上的导体层的平均厚度“tf”和形成在刚性区域中的基底膜上的导体层的平均厚度“tR”满足tf