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    WEAVED ELECTRICAL COMPONENTS IN A SUBSTRATE PACKAGE CORE
    14.
    发明申请
    WEAVED ELECTRICAL COMPONENTS IN A SUBSTRATE PACKAGE CORE 审中-公开
    基片包装芯中的电气元件

    公开(公告)号：US20170027062A1

    公开(公告)日：2017-01-26

    申请号：US15286276

    申请日：2016-10-05

    Applicant: Intel Corporation

    Inventor： MIHIR K. ROY ,  Mathew J. MANUSHAROW

    IPC: H05K3/10 ,  H05K3/30 ,  H05K1/16 ,  H05K3/22 ,  H05K3/40

    CPC classification number: H05K3/10 ,  H01B3/485 ,  H01B3/50 ,  H01B7/083 ,  H01F17/0006 ,  H05K1/0222 ,  H05K1/038 ,  H05K1/165 ,  H05K3/043 ,  H05K3/103 ,  H05K3/22 ,  H05K3/26 ,  H05K3/30 ,  H05K3/40 ,  H05K3/4046 ,  H05K2201/029 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K2201/1081 ,  H05K2203/0228 ,  H05K2203/025 ,  H05K2203/1461 ,  H05K2203/175 ,  H05K2203/30

    Abstract: A substrate package includes a woven fabric having electrically non-conductive strands woven between electrically conductive strands including wire strands, co-axial strands, and/or an inductor pattern of strands. The package may be formed by an inexpensive and high throughput process that first weaves the non-conductive strands (e.g., glass) between the conductive strands to form a circuit board pattern of conductive strands in a woven fabric. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planarized. Planarizing segments and exposes ends of the wire, co-axial, and inductor pattern strands. Since the conductive strands were formed integrally within the planarized woven fabric, the substrate has a high mechanical stability and provides conductor strand based electrical components built in situ in the substrate package.

    Abstract translation: 衬底封装包括织造织物，其具有在导电股线之间编织的非导电股线，包括线股，同轴股线和/或股线的电感器图案。 封装可以通过廉价且高通量的工艺来形成，该工艺首先在导电股线之间编织非导电股线（例如玻璃），以形成机织织物中导电股线的电路板图案。 接下来，用树脂材料浸渍织物以形成浸渍织物，然后将其固化以形成固化织物。 随后将固化的织物的上表面和下表面平坦化。 平面化节段并露出导线，同轴和电感图案线的端部。 由于导电丝线整体地形成在平面织造织物内，所以基底具有高的机械稳定性，并提供了在基底包装中原位构建的基于导线的电气部件。

    Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof
    15.
    发明申请
    Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof 审中-公开
    具有有源器件的同轴波导微结构及其形成方法

    公开(公告)号：US20160268665A1

    公开(公告)日：2016-09-15

    申请号：US15079614

    申请日：2016-03-24

    Applicant: Nuvotronics, INC

    Inventor： David W. Sherrer ,  John J. Fisher

    IPC: H01P3/06 ,  H01P11/00

    CPC classification number: H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

    Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

    Abstract translation: 提供同轴波导微结构。 微结构包括设置在衬底上方的衬底和同轴波导。 同轴波导包括：中心导体; 包括一个或多个壁的外导体，与中心导体间隔开并设置在中心导体周围; 一个或多个电介质支撑构件，用于支撑与中心导体接触并封闭在外部导体内的中心导体; 以及中心导体和外部导体之间的芯体积，其中芯体积处​​于真空状态或气体状态。 还提供了通过顺序构建工艺形成同轴波导微结构的方法和包括同轴波导微结构的密封封装。

    PRINTED BOARD AND METHOD FOR MOUNTING ON PRINTED BOARD
    16.
    发明申请
    PRINTED BOARD AND METHOD FOR MOUNTING ON PRINTED BOARD 有权
    印刷板和打印板安装方法

    公开(公告)号：US20160205768A1

    公开(公告)日：2016-07-14

    申请号：US14912677

    申请日：2014-09-11

    Applicant: NEC CORPORATION

    Inventor： Kazuhiro KASHIWAKURA

    IPC: H05K1/02 ,  H05K3/00 ,  H05K3/40 ,  H05K1/11

    CPC classification number: H05K1/0222 ,  H01P1/045 ,  H01P5/085 ,  H05K1/0213 ,  H05K1/0251 ,  H05K1/113 ,  H05K1/116 ,  H05K3/0047 ,  H05K3/40 ,  H05K2201/09063 ,  H05K2201/09609 ,  H05K2201/09809

    Abstract: To provide a printed board that solves the problem of transmission characteristics deterioration, the disclosed printed board includes a substrate, a circular signal pad that is provided on the substrate, a doughnut-shaped ground pad, which sandwiches the substrate that surrounds, in a doughnut shape, the signal pad, and which surrounds the outer circumference of the substrate, and one or more recessed sections that are disposed on the substrate that surrounds, in the doughnut shape, the signal pad.

    Abstract translation: 为了提供解决传输特性恶化的印刷电​​路板，公开的印刷电路板包括基板，设置在基板上的圆形信号焊盘，将环状的基板夹在环状的环形接地垫中 形状，信号垫，并且其围绕基板的外周;以及一个或多个凹陷部分，其设置在基板上，环形圈中包围信号垫。

    ORIENTATION-INDEPENDENT DEVICE CONFIGURATION AND ASSEMBLY
    19.
    发明申请
    ORIENTATION-INDEPENDENT DEVICE CONFIGURATION AND ASSEMBLY 有权
    方向独立的设备配置和组装

    公开(公告)号：US20150093860A1

    公开(公告)日：2015-04-02

    申请号：US14040552

    申请日：2013-09-27

    Applicant: David W. Hamby ,  Adam M. Scotch ,  Sridharan Venk ,  Alan Lenef

    Inventor： David W. Hamby ,  Adam M. Scotch ,  Sridharan Venk ,  Alan Lenef

    IPC: H01L33/62 ,  H01L33/38 ,  H05K1/11 ,  H01L23/00

    CPC classification number: H01L33/62 ,  H01L24/83 ,  H01L33/38 ,  H01L2924/12041 ,  H05K1/111 ,  H05K3/303 ,  H05K2201/0939 ,  H05K2201/09809 ,  H05K2201/10106 ,  H05K2203/048 ,  H05K2203/0776 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

    Abstract: The present disclosure is directed to orientation-independent device configuration and assembly. An electronic device may comprise conductive pads arranged concentrically on a surface of the device. The conductive pads on the device may mate with conductive pads in a device location in circuitry. Example conductive pads may include at least a first circular conductive pad and a second ring-shaped conductive pad arranged to concentrically surround the first conductive pad. The concentric arrangement of the conductive pads allows for orientation-independent placement of the device in the circuitry. In particular, the conductive pads of the device will mate correctly with the conductive pads of the circuitry regardless of variability in device orientation. In one embodiment, the device may also be configured for use with fluidic self-assembly (FSA). For example, a device housing may be manufactured with pockets that cause the device to attain neutral buoyancy during manufacture.

    Abstract translation: 本公开涉及定向无关的装置配置和组装。 电子设备可以包括同心地布置在设备的表面上的导电焊盘。 器件上的导电焊盘可与电路中的器件位置中的导电焊盘配合。 示例性导电焊盘可以包括至少第一圆形导电焊盘和布置成同心地围绕第一导电焊盘的第二环形导电焊盘。 导电焊盘的同心布置允许器件在电路中的定向无关放置。 特别地，器件的导电焊盘将正确地与电路的导电焊盘配合，而不管器件取向如何变化。 在一个实施例中，该装置还可以被配置为与流体自组装（FSA）一起使用。 例如，可以制造具有在制造期间使装置达到中性浮力的袋的装置壳体。

    Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof
    20.
    发明申请
    Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof 有权
    具有有源器件的同轴波导微结构及其形成方法

    公开(公告)号：US20140266515A1

    公开(公告)日：2014-09-18

    申请号：US14293696

    申请日：2014-06-02

    Applicant: Nuvotronics, LLC

    Inventor： David W. Sherrer ,  John J. Fisher

    IPC: H01P3/06 ,  H01P11/00

    CPC classification number: H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

    Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

    Abstract translation: 提供同轴波导微结构。 微结构包括设置在衬底上方的衬底和同轴波导。 同轴波导包括：中心导体; 包括一个或多个壁的外导体，与中心导体间隔开并设置在中心导体周围; 一个或多个电介质支撑构件，用于支撑与中心导体接触并封闭在外部导体内的中心导体; 以及中心导体和外部导体之间的芯体积，其中芯体积处​​于真空状态或气体状态。 还提供了通过顺序构建工艺形成同轴波导微结构的方法和包括同轴波导微结构的密封封装。

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