公开(公告)号：US09736927B2

公开(公告)日：2017-08-15

申请号：US14875241

申请日：2015-10-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Suk Hyeon Cho ,  Yoong Oh ,  Young Gwan Ko ,  Yong Ho Baek ,  Young Kuk Ko

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/0271 ,  H01L2224/16227 ,  H01L2924/15313 ,  H01L2924/15788 ,  H05K1/038 ,  H05K1/115 ,  H05K1/181 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/0047 ,  H05K3/0052 ,  H05K3/429 ,  H05K3/4605 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/0909 ,  H05K2201/09536 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10674

Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board include a glass plate, an insulating member penetrating through the glass plate, insulating layers disposed on a first surface and a second surface of the glass plate, and a via through the insulating member.

公开(公告)号：US09713264B2

公开(公告)日：2017-07-18

申请号：US14576107

申请日：2014-12-18

Applicant: Intel Corporation

Inventor： Brandon M. Rawlings ,  Henning Braunisch

IPC: H05K3/00 ,  H05K3/46 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K3/0082 ,  H05K1/116 ,  H05K3/422 ,  H05K3/424 ,  H05K3/4647 ,  H05K3/4679 ,  H05K2201/09463 ,  H05K2201/09854 ,  H05K2203/0505

Abstract: A photoresist is deposited on a seed layer on a substrate. A first region of the photoresist is removed to expose a first portion of the seed layer to form a via-pad structure. A first conductive layer is deposited onto the first portion of the seed layer. A second region of the photoresist adjacent to the first region is removed to expose a second portion of the seed layer to form a line. A second conductive layer is deposited onto the first conductive layer and the second portion of the seed layer.

公开(公告)号：US20170188466A1

公开(公告)日：2017-06-29

申请号：US15461114

申请日：2017-03-16

Applicant: NextGin Technology BV

Inventor： J.A.A.M. Tourne

IPC: H05K3/10 ,  H05K3/42 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/107 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0044 ,  H05K3/403 ,  H05K3/42 ,  H05K3/4644 ,  H05K2201/09036 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2201/09854 ,  H05K2203/0228 ,  Y10T29/49165

Abstract: A method for producing a printed circuit board is disclosed, In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

公开(公告)号：US20160381796A1

公开(公告)日：2016-12-29

申请号：US15096993

申请日：2016-04-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung-Uk LEE ,  Il-Jong SEO ,  Jae-Hoon CHOI ,  Yong-Ho BAEK

IPC: H05K1/11 ,  H05K3/06

CPC classification number: H05K1/115 ,  H05K3/067 ,  H05K3/4647 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/0361 ,  H05K2201/09854 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/0384

Abstract: A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer, a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole shape to expose a part of the circuit layer from the insulating layer, and a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer, and the metal post includes a first post metal layer, a post barrier layer, and a second post metal layer disposed in that order.

Abstract translation: 提供印刷电路板和制造印刷电路板的方法。 印刷电路板包括绝缘层，嵌入绝缘层中的电路层，设置在绝缘层的一个表面上的阻焊层，阻焊层具有通孔形状的空腔，以暴露部分 电路层，以及嵌入到阻焊层中并经由阻焊层的开口暴露于外部的金属柱，金属柱包括第一后​​金属层，后阻挡层和第二柱 金属层。

公开(公告)号：US09526164B2

公开(公告)日：2016-12-20

申请号：US15002028

申请日：2016-01-20

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Han Kim ,  Dae Hyun Park

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/0216 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0044 ,  H05K3/0094 ,  H05K3/403 ,  H05K2201/09063 ,  H05K2201/09618 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/09854

Abstract: A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes a base, a wiring structure disposed on at least one of a surface and an interior of the base, and a plurality of stitching vias penetrating through the base in a thickness direction along an edge of the base and having side surfaces exposed externally.

Abstract translation: 提供印刷电路板和制造印刷电路板的方法。 印刷电路板包括底座，设置在基座的表面和内部中的至少一个上的布线结构，以及沿着基座的边缘在厚度方向上穿过基座的多个缝合通孔，并且具有侧表面 外露。

公开(公告)号：US20160345424A1

公开(公告)日：2016-11-24

申请号：US15159393

申请日：2016-05-19

Applicant: Tomoyoshi Kobayashi ,  Masato Kasashima

Inventor： Tomoyoshi Kobayashi ,  Masato Kasashima

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/05 ,  H05K1/11

CPC classification number: H05K1/0204 ,  H05K1/0271 ,  H05K3/0061 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2201/09854 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2203/063

Abstract: A printed board includes: a base member; a recess portion provided in the base member; a heat dissipation member fitted into the recess portion; and a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator. A contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member contact each other and a separation portion in which those do contact each other are formed. A gap between the recess portion and the heat dissipation member is filled with thermosetting resin of the base member melted by heating. At least a partial portion in a width direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion thereof does not pass through a position vertically overlapping the contact portion.

Abstract translation: 印刷电路板包括：基底构件; 设置在所述基座部件中的凹部; 安装在所述凹部中的散热构件; 以及经由绝缘体设置在基座构件的上侧和散热构件上的布线图案。 形成有凹部的内周面和散热构件的外周面彼此接触的接触部以及彼此接触的分离部。 凹部与散热构件之间的间隙填充有通过加热熔化的基底构件的热固性树脂。 布线图案的宽度方向的至少一部分通过与分离部垂直重叠的位置，其整个部分未穿过与接触部分垂直重叠的位置。

公开(公告)号：US20160276257A1

公开(公告)日：2016-09-22

申请号：US15159323

申请日：2016-05-19

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Satoru KURAMOCHI ,  Sumio KOIWA ,  Hidenori YOSHIOKA

IPC: H01L23/498

CPC classification number: H01L23/49827 ,  H01L23/13 ,  H01L23/15 ,  H01L23/481 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/065 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16165 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81805 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/381 ,  H05K1/115 ,  H05K3/28 ,  H05K3/445 ,  H05K2201/09154 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/09854 ,  H05K2203/0594 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/0665 ,  H01L2924/07025

Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.

Abstract translation: 通孔电极基板包括基板，该基板包括从第一表面的第一孔到第二表面的第二孔延伸的通孔，第二孔的面积大于第一孔的面积， 所述孔在所述第一孔和所述第二孔之间具有最小孔径部分，其中在平面视图中，所述通孔中的所述最小孔径部分的面积在所述通孔的多个区域中最小， 并且与暴露于第一表面和第二表面之一的填料接触的至少一个气体排出构件。

公开(公告)号：US09420683B2

公开(公告)日：2016-08-16

申请号：US14143727

申请日：2013-12-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Doo Hwan Lee ,  Yul Kyo Chung ,  Yee Na Shin ,  Seung Eun Lee

IPC: H05K1/18 ,  H05K1/02 ,  H01L23/498 ,  H01L23/64 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/0231 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/642 ,  H01L2224/16225 ,  H05K1/115 ,  H05K1/182 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09827 ,  H05K2201/09854

Abstract: A substrate embedding a passive element includes a first conductor pattern layer disposed on a lower surface thereof and a second conductor pattern layer disposed on an upper surface thereof; a first via electrically connecting between the passive element and the first conductor pattern layer; and a second via electrically connecting between the passive element and the second conductor pattern layer, in which a volume of the first via is larger than that of the second via.

Abstract translation: 嵌入无源元件的基板包括设置在其下表面上的第一导体图案层和设置在其上表面上的第二导体图案层; 第一通孔，电连接在无源元件和第一导体图案层之间; 以及第二通孔，电连接在无源元件和第二导体图案层之间，其中第一通孔的体积大于第二通孔的体积。

公开(公告)号：US20160198573A1

公开(公告)日：2016-07-07

申请号：US14850253

申请日：2015-09-10

Applicant: Advanced Powertrain Engineering, LLC

Inventor： Paul Fathauer

IPC: H05K1/11 ,  F16K31/02 ,  H05K1/18 ,  H05K3/34 ,  H05K3/42

CPC classification number: H05K1/115 ,  F16K31/02 ,  H05K1/119 ,  H05K1/18 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09854 ,  H05K2201/1003 ,  H05K2201/10303 ,  H05K2201/10818 ,  Y10T29/49002

Abstract: A printed circuit assembly (PCA) that provides for a method of rebuilding an electrically operated automatic transmission solenoid module. The PCA allows for a repairable yet rugged interconnection of several solenoids that reside within the span of the module assembly.

Abstract translation: 一种印刷电路组件（PCA），其提供重建电动自动变速器螺线管模块的方法。 PCA允许驻留在模块组件的跨度内的几个螺线管的可修复但坚固的互连。

公开(公告)号：US20160150642A1

公开(公告)日：2016-05-26

申请号：US14779232

申请日：2014-03-26

Applicant: KYOCERA CORPORATION

Inventor： Satoshi KAJITA ,  Mitsuhiro HAGIHARA ,  Yuuhei MATSUMOTO

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K1/0306 ,  H05K1/0298 ,  H05K1/036 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0038 ,  H05K3/421 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2201/2072

Abstract: A wiring board includes: an inorganic insulating layer having a via hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the inorganic insulating layer; and a via conductor which adheres to an inner wall of the via hole and is connected with the conductive layer. The inorganic insulating layer includes a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the via conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conducting portion composed of part of the via conductor which is located in gaps between the inorganic insulating particles.

Abstract translation: 布线板包括：无机绝缘层，其具有形成为在其厚度方向上穿透无机绝缘层的通孔; 设置在无机绝缘层上的导电层; 以及通孔导体，其粘附到通孔的内壁并与导电层连接。 无机绝缘层包括：第一部分，其包括彼此部分连接的多个无机绝缘颗粒，以及位于无机绝缘颗粒之间的间隙中的树脂部分和介于第一部分和通孔导体之间的第二部分， 包括彼此部分连接的多个无机绝缘颗粒和由位于无机绝缘颗粒之间的间隙中的通孔导体的一部分组成的导电部分。