公开(公告)号：US09744472B2

公开(公告)日：2017-08-29

申请号：US14953814

申请日：2015-11-30

Applicant: Augustine J. DiCiacce

Inventor： Augustine J. DiCiacce

IPC: F21V19/00 ,  F21V21/00 ,  A63H33/04 ,  B44C5/00 ,  G09F19/02 ,  H05K1/14

CPC classification number: A63H33/044 ,  A63H33/042 ,  B44C3/12 ,  B44C5/00 ,  G09F19/02 ,  H05K1/14 ,  H05K2201/047 ,  H05K2201/10106 ,  H05K2201/10303 ,  H05K2201/10424

Abstract: An illuminated modular decorative article includes a base control panel and a side panel. The base control panel includes a base, a first electrical/mechanical connection interface, and a power source. The side panel includes a base, a second electrical/mechanical connection interface, and illumination sources. The first electrical/mechanical connection interface connects to the second electrical/mechanical connection interface to electrically connect the base control panel to the side panel and to mechanically connect the base control panel substantially orthogonally to the side panel.

公开(公告)号：US09655256B2

公开(公告)日：2017-05-16

申请号：US14351979

申请日：2012-10-25

Applicant: Hella KGaA Hueck & Co.

Inventor： Gunnar Lindner

IPC: H05K5/00 ,  H05K1/14

CPC classification number: H05K5/0026 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10106 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/2018 ,  H05K2203/0495

Abstract: An electronic circuit, comprising at least three circuit boards (2.1, 2.2, 2.3) fastened at a frame (1) and electrically connected via contact pins (7) arranged therein, and an electric connection (11), connected to a third of the circuit boards (2.1). The circuit shall show a low structural space and here be cost-effective in its production and assembly. The circuit boards (2.1, 2.2, 2.3) are arranged in levels parallel in reference to each other and are fastened at a predetermined mutual distance at the frame (1), with bases (4, 5, 6) being embodied at the faces of the frame (1), with the ends being parallel to the faces of at least two of the bases (4, 5, 6) in one level, arranged in groups, and with the embodiment of the frame (1) and the circuit boards (2.1, 2.2, 2.3) being adjusted to each other.

公开(公告)号：US20170135204A1

公开(公告)日：2017-05-11

申请号：US15141997

申请日：2016-04-29

Applicant: HE BEI SINOPACK ELECTRONIC TECH CO., LTD.

Inventor： Fei Ding ,  Linjie Liu ,  Lei Zhang

IPC: H05K1/03 ,  H05K3/40 ,  H05K3/00 ,  H05K3/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0306 ,  H01L23/13 ,  H05K1/0213 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/112 ,  H05K3/005 ,  H05K3/188 ,  H05K3/40 ,  H05K3/4038 ,  H05K3/4617 ,  H05K2201/0723 ,  H05K2201/09218 ,  H05K2201/09618 ,  H05K2201/10303

Abstract: The present invention discloses a ceramic insulator for electronic packaging and a method for fabricating the same, and relates to a technical field of outer shell packaging of electronic devices. Under the circumstance of using neither a chemical coating nor any bonding wire connection circuit, through a design that builds a electroplated circuit into the ceramic insulator, the method accomplishes coating of a nickel alloy protection layer onto a porcelain by an electroplating method, so that not only quality of a coating layer but also requirement of a complete appearance can be ensured. All circuits of the ceramic insulator fabricated by the aforesaid method can conduct with external circuits, such that the electroplating method can be used to accomplish coating of the nickel alloy layer, after accomplishment of all metal coating, metallization parts on an end surface of the porcelain is removed.

公开(公告)号：US20170085015A1

公开(公告)日：2017-03-23

申请号：US15124519

申请日：2015-02-25

Applicant: Sumitomo Wiring Systems, Ltd

Inventor： Hideki Goto

IPC: H01R12/58 ,  H05K1/11

CPC classification number: H01R12/58 ,  H05K1/115 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10303 ,  H05K2201/10787 ,  H05K2201/1081 ,  H05K2201/10818

Abstract: The present invention provides a printed substrate having a novel structure in which substrate terminals can be fixed to the printed substrate without needing a base, and the substrate terminals can be press-fitted into through-holes without applying pressing force to printed wiring and a plating layer in the through-holes, and also provides a printed substrate with terminals that uses this printed substrate. A printed substrate includes through-holes into which the first end portions of substrate terminals are to be inserted. The through-holes each include press-fitting regions into which the first end portion of a substrate terminal is to be press-fitted, and conduction regions arranged so as to oppose the outer circumferential surfaces of the first end portion of the substrate terminal via gaps in directions perpendicular to the axis. Printed wiring is connected to the conduction regions, and a plating layer is adhered to the conduction regions.

公开(公告)号：US09583805B2

公开(公告)日：2017-02-28

申请号：US14676530

申请日：2015-04-01

Applicant: Hugo Enrique Cuadras ,  Nam Phan

Inventor： Hugo Enrique Cuadras ,  Nam Phan

IPC: H01P1/20 ,  H01P7/10 ,  H01P1/201 ,  H01P3/16 ,  H01P1/208 ,  H01P1/207 ,  H05K3/40

CPC classification number: H01P1/2002 ,  H01P1/201 ,  H01P1/207 ,  H01P1/2084 ,  H01P1/2088 ,  H01P3/16 ,  H01P7/10 ,  H05K3/4046 ,  H05K2201/09845 ,  H05K2201/1006 ,  H05K2201/10303

Abstract: An RF filter assembly comprising a substrate, an RF waveguide filter mounted on the substrate and a pair of alignment/mounting/RF signal transmission pins extending from respective apertures in the substrate into respective through-holes in the RF filter. In one embodiment, the RF waveguide filter is comprised of first and second blocks of dielectric material coupled together in an abutting side-by-side relationship and the pair of through-holes are defined in the first and second blocks respectively. In one embodiment, respective RF signal transmission pads defined on the respective first and second blocks of dielectric material are abutted against respective RF signal transmission pads defined on the substrate and interconnected by an RF signal transmission line in the interior of the substrate for transmitting the RF signal between the first and second blocks of dielectric material.

Abstract translation: 一种RF滤光器组件，包括衬底，安装在衬底上的RF波导滤光器和从衬底中的相应孔延伸到RF滤光器中的相应通孔的一对对准/安装/ RF信号传输销。 在一个实施例中，RF波导滤波器由以邻接并排关系耦合在一起的第一和第二介电材料块组成，并且一对通孔分别限定在第一和第二块中。 在一个实施例中，限定在相应的第一和第二电介质材料块上的各个RF信号传输焊盘抵靠在衬底上限定的相应的RF信号传输焊盘，并由衬底内部的RF信号传输线互连，用于传输RF 第一和第二电介质块之间的信号。

公开(公告)号：US09560760B2

公开(公告)日：2017-01-31

申请号：US13903521

申请日：2013-05-28

Applicant: INTEL CORPORATION

Inventor： Timothy D. Wig

IPC: H01R12/72 ,  H05K1/11 ,  H05K1/02 ,  H05K3/36

CPC classification number: H05K1/117 ,  H01R12/721 ,  H05K1/0216 ,  H05K3/366 ,  H05K2201/09781 ,  H05K2201/10303 ,  Y10T29/4913

Abstract: Techniques for reducing resonance in contact fingers of a connector are described herein. An example of a device in accordance with the present techniques includes an add-in-card that includes a circuit board and an edge contact finger disposed on an outer surface of the circuit board. The add-in-card also includes a resonator disposed in an internal layer of the circuit board and coupled to the edge contact finger, wherein the resonator reduces a resonance in the edge contact finger.

Abstract translation: 本文描述了用于减少连接器的接触指状物中的共振的技术。 根据本技术的装置的示例包括附加卡，其包括布置在电路板的外表面上的电路板和边缘接触指状物。 附加卡还包括设置在电路板的内层中并耦合到边缘接触指状物的谐振器，其中谐振器减小边缘接触指状物中的共振。

公开(公告)号：US20160374202A1

公开(公告)日：2016-12-22

申请号：US15132357

申请日：2016-04-19

Applicant: DTECH PRECISION INDUSTRIES CO., LTD.

Inventor： TING-JUI WANG

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H05K3/34 ,  H05K3/368 ,  H05K2201/10303

Abstract: A soldering fastening element, a structure thereof and a method for soldering the soldering fastening element to a circuit board are introduced. The soldering fastening element is soldered to a first circuit board so as for a second board to be coupled thereto. The soldering fastening element includes a body soldered to the first circuit board, a head for fastening the second board in place, and a neck which connects the body and the head. When in use, the soldering fastening element is contained in a carrier, taken out of the carrier with an automated tool, transferred to the first circuit board, and heated through a solder layer on the first circuit board such that the body gets soldered to the first circuit board to form a module member. Therefore, the second board gets coupled to the first circuit board through the head and neck.

Abstract translation: 引入了焊接紧固元件，其结构以及将焊接紧固元件焊接到电路板的方法。 焊接紧固元件被焊接到第一电路板，以便与第二电路板耦合。 焊接紧固元件包括焊接到第一电路板的主体，用于将第二板固定在适当位置的头部以及连接主体和头部的颈部。 当使用时，焊接紧固元件容纳在载体中，用自动工具从载体中取出，转移到第一电路板，并通过第一电路板上的焊料层加热，使得主体被焊接到 第一电路板形成模块构件。 因此，第二板通过头颈部耦合到第一电路板。

公开(公告)号：US20160286657A1

公开(公告)日：2016-09-29

申请号：US15073686

申请日：2016-03-18

Applicant: Oclaro Japan, Inc.

Inventor： Takuma BAN

IPC: H05K1/18 ,  H05K1/02 ,  G02B6/42 ,  H05K1/11

CPC classification number: G02B6/4278 ,  G02B6/4281 ,  H05K1/115 ,  H05K1/117 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K3/363 ,  H05K3/366 ,  H05K2201/10121 ,  H05K2201/10303

Abstract: An electrical interface includes an insulating body, first electrodes, and second electrodes. The insulating body includes a first front edge surface and a second front edge surface facing in a direction along a transmission direction of an optical signal at an optical interface and having different heights. The first electrode and the second electrode are provided on the insulating body so as to have a thickness from the first front edge surface and the second front edge surface in a direction of the height. A first flexible wiring board and a second flexible wiring board include a first area and a second area extending in directions along the first front edge surface and the second front edge surface, respectively, of the insulating body, and include, in the first area and the second area, first pads and second pads electrically connected with the first electrodes and the second electrodes.

Abstract translation: 电接口包括绝缘体，第一电极和第二电极。 绝缘体包括在光学界面处沿着光信号的传输方向的方向上面对具有不同高度的第一前边缘表面和第二前边缘表面。 第一电极和第二电极设置在绝缘体上，以便在高度方向具有来自第一前边缘表面和第二前边缘表面的厚度。 第一柔性布线板和第二柔性布线基板包括分别沿绝缘体的第一前边缘表面和第二前边缘表面延伸的第一区域和第二区域，并且包括在第一区域和 第二区域，与第一电极和第二电极电连接的第一焊盘和第二焊盘。

公开(公告)号：US20160233595A1

公开(公告)日：2016-08-11

申请号：US15022544

申请日：2014-06-02

Applicant: ADVANTEC SENSING AS

Inventor： Tore Gundersen

IPC: H01R12/58 ,  H01R43/02 ,  G01D5/24 ,  H05K1/14

CPC classification number: H01R12/58 ,  G01D5/24 ,  G01F23/265 ,  G01F23/268 ,  H01R43/0256 ,  H05K1/0201 ,  H05K1/144 ,  H05K2201/10151 ,  H05K2201/10257 ,  H05K2201/10303 ,  H05K2201/10356 ,  H05K2201/1059 ,  H05K2201/2036

Abstract: Connecting a capacitive measuring probe at elevated temperatures is achieved by direct attachment of metallic connecting components on a temperature substrate. A method and apparatus for a high temperature cable to circuit board connection involves a set or plurality of connecting elements that are soldered directly on the circuit board and a set or plurality of mating connecting elements that are soldered to a secondary circuit board having soldering pads for a cable.

Abstract translation: 在高温下连接电容测量探头是通过将金属连接部件直接连接在温度基板上实现的。 用于高温电缆到电路板连接的方法和装置包括直接焊接在电路板上的一组或多个连接元件，以及一组或多个匹配的连接元件，其被焊接到具有焊盘的焊盘的二次电路板 一根电缆

公开(公告)号：US09402319B2

公开(公告)日：2016-07-26

申请号：US14116642

申请日：2012-05-11

Applicant: Patrizio Vinciarelli ,  Michael B. LaFleur ,  Sean Timothy Fleming ,  Rudolph F. Mutter ,  Andrew T. D'Amico

Inventor： Patrizio Vinciarelli ,  Michael B. LaFleur ,  Sean Timothy Fleming ,  Rudolph F. Mutter ,  Andrew T. D'Amico

IPC: H05K7/00 ,  H05K3/28 ,  H05K1/18 ,  H05K1/11 ,  B29C45/00 ,  B29C45/14 ,  H01R43/24 ,  H05K5/06 ,  H05K7/20 ,  H01R43/20

CPC classification number: H05K3/284 ,  B29C45/0055 ,  B29C45/14639 ,  B29C2045/0058 ,  B29C2793/0009 ,  B29C2793/0027 ,  B29C2793/009 ,  H01R27/02 ,  H01R43/205 ,  H01R43/24 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/186 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/007 ,  H05K5/064 ,  H05K5/065 ,  H05K7/209 ,  H05K2201/0183 ,  H05K2201/066 ,  H05K2201/10303 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/167

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features. Wide cuts may be made in the molds after encapsulation reducing thermal stresses. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations.

Abstract translation: 封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。 可以包括多个部件的面板可以在封装之后切割成一个或多个单独的部件。 模具可用于形成成品的一部分。 在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。 模具可以包括各种内部特征。 封装后可以在模具中进行宽切削，减少热应力。 空白模具面板可以被加工以在按需制造系统中提供上述特征中的一些或全部。 可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。