公开(公告)号：US20190200450A1

公开(公告)日：2019-06-27

申请号：US16328412

申请日：2017-09-19

Applicant: Intel Corporation

Inventor： Richard I. MELLITZ ,  Brandon GORE ,  Beom-Taek LEE

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/14 ,  H01R12/71

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01R12/716 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/112 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: Methods and apparatus for utilizing flexible (flex) circuit technology and/or axial cable to facilitate routing of high-speed data channels are described herein. Under one aspect, a high-speed data channel if routed between an integrated circuit (IC) and a high-speed data connector mounted to a multilayer printed circuit board as part of a circuit assembly. The circuit assembly includes a signal pathway providing a high-speed data channel from the integrated circuit to the high-speed data connector, wherein a portion of the signal pathway includes a flex circuit or axial cable.

公开(公告)号：US20190158773A1

公开(公告)日：2019-05-23

申请号：US15817976

申请日：2017-11-20

Applicant: Waymo LLC

Inventor： Huihui Hu ,  Min Wang

IPC: H04N5/38 ,  H05K1/11 ,  H05K1/02 ,  H05K3/40 ,  G01S7/00

CPC classification number: H04N5/38 ,  G01S7/003 ,  G01S17/023 ,  G01S17/936 ,  H04B3/548 ,  H04L5/14 ,  H05K1/025 ,  H05K1/111 ,  H05K1/162 ,  H05K1/165 ,  H05K3/4007 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10356

Abstract: Aspects of the disclosure provide for a system for a power over data line (PoDL) system. The system includes a ground plane that has a cutout. In addition, an alternating current (AC) capacitor pad configured to establish a bidirectional data channel. The AC capacitor pad is positioned in the cutout of the ground plane. Similarly, a PoDL pad connected to one or more inductors and a direct current (DC) power source is positioned in the cutout of the ground plane and is in series with the AC capacitor pad.

公开(公告)号：US20180220545A1

公开(公告)日：2018-08-02

申请号：US15936100

申请日：2018-03-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Guodong ZHANG ,  Jian ZHANG ,  Jianping SHU

IPC: H05K7/14 ,  H01R12/75 ,  H01R12/79 ,  H01R12/70 ,  H05K1/18 ,  H05K1/14 ,  H04Q1/02

CPC classification number: H05K7/1439 ,  H01R12/7005 ,  H01R12/75 ,  H01R12/79 ,  H04Q1/15 ,  H05K1/141 ,  H05K1/18 ,  H05K7/1449 ,  H05K7/1451 ,  H05K7/1452 ,  H05K2201/044 ,  H05K2201/10318 ,  H05K2201/10356

Abstract: A backplane and a communications device are disclosed. In one example, the backplane includes at least one fixing plate, multiple connectors, and multiple flexible cables, where signal connection is implemented between corresponding connectors by the flexible cables. Each of the connectors is provided with a housing, and multiple signal pins are installed on the housing. The housing is installed on the fixing plate and is provided with a jack for insertion of a connector of a subcard in the communications device. One end of each signal pin is inserted into the jack, and the other end is connected to each flexible cable.

公开(公告)号：US20180184516A1

公开(公告)日：2018-06-28

申请号：US15738218

申请日：2016-07-04

Applicant: NEC Corporation

Inventor： Kazuhiro KASHIWAKURA ,  Ayako UEMURA

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K1/0224 ,  H05K1/0219 ,  H05K1/0251 ,  H05K1/115 ,  H05K1/141 ,  H05K1/185 ,  H05K3/429 ,  H05K2201/09609 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10356

Abstract: An objective of the present invention is to provide a printed board capable of suppressing EMI emissions from an electric cable. To accomplish the objective, the present invention is a printed board including a signal wiring to which an electric cable is connected, the printed board including: ground layers above and below the signal wiring put on upper and lower sides of the signal wiring to which the electric cable is connected; and a plurality of through holes connecting the ground layers above and below the signal wiring, wherein the plurality of the through holes are disposed at and near the signal wiring and are spaced apart at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.

公开(公告)号：US09936595B2

公开(公告)日：2018-04-03

申请号：US15357328

申请日：2016-11-21

Applicant: THOMSON LICENSING

Inventor： Mickey Hunt ,  William P. Dernier

IPC: H01R4/70 ,  H05K5/03 ,  H05K1/02 ,  H05K7/14 ,  H05K1/11 ,  H05K1/18 ,  H01Q1/38 ,  H01Q1/22 ,  H01Q13/10

CPC classification number: H05K5/03 ,  H01Q1/2258 ,  H01Q1/38 ,  H01Q13/10 ,  H05K1/02 ,  H05K1/0203 ,  H05K1/117 ,  H05K1/18 ,  H05K3/32 ,  H05K5/02 ,  H05K7/1417 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10287 ,  H05K2201/10356

Abstract: A wire retention cover for an antenna mounting arrangement within an electronic device is configured to be positioned over an edge of a printed circuit board and protect the antenna wires and connectors on the connector side thereof. A non-connector side portion or leg of the cover includes one or more slots for receiving antenna wires. A connector side portion or leg of the cover includes raised and lowered portions. The raised portions are configured to cover and protect antenna wire connections to the PCB.

公开(公告)号：US20180014429A1

公开(公告)日：2018-01-11

申请号：US15646514

申请日：2017-07-11

Applicant: Lintes Technology Co., Ltd

Inventor： Ted Ju

IPC: H05K7/20 ,  H01R12/72 ,  H01R12/70 ,  H01R12/73 ,  H01R13/533 ,  H01R13/66

CPC classification number: H05K7/20154 ,  G06F1/203 ,  H01R12/7064 ,  H01R12/721 ,  H01R12/722 ,  H01R12/73 ,  H01R13/533 ,  H01R13/665 ,  H05K7/1427 ,  H05K7/20163 ,  H05K7/2039 ,  H05K7/20445 ,  H05K2201/10325 ,  H05K2201/10356

Abstract: A heat sink assembly includes a casing having an opening, a main board accommodated in the casing, a heat sink mounted on the main board, an electrical connector mounted on the main board and exposed in the opening, a mating connector located outside the casing and connected to the electrical connector through the opening in a plugging manner, and a heat conductor, disposed inside the casing. The mating connector has a chip that is electrically connected to the electrical connector. One end of the heat conductor is connected to the heat sink, and the other end of the heat conductor is thermally connected to the electrical connector or the mating connector, so that heat generated by the chip during working can be transferred to the heat sink through the heat conductor, thereby reducing a temperature of the mating connector.

公开(公告)号：US09787030B2

公开(公告)日：2017-10-10

申请号：US15398793

申请日：2017-01-05

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Amid I. Hashim ,  Brian J. Fitzpatrick ,  Bryan S. Moffitt ,  Wayne D. Larsen

IPC: H01R24/00 ,  H01R13/6469 ,  H01R24/64 ,  H01R13/6466 ,  H01R12/53 ,  H01R24/28 ,  H01R107/00

CPC classification number: H01R13/6469 ,  H01R12/53 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R24/64 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/117 ,  H05K1/162 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/1034 ,  H05K2201/10356

Abstract: Patch cords are provided that include a communications cable that has at least first through fourth conductors and a plug that is attached to the cable. The plug includes a housing that receives the cable, a printed circuit board, first through fourth plug contacts, and first through fourth conductive paths that connect the first through fourth conductors to the respective first through fourth plug contacts. The first and second conductors, conductive paths, and plug contacts form a first differential transmission line, and the third and fourth conductors, conductive paths, and plug contacts form a second differential transmission line. Each of the first through fourth plug contacts has a first segment that extends longitudinally along a first surface of the printed circuit board, and the signal current injection point into the first segment of at least some of the first through fourth plug contacts is into middle portions of their respective first segments.

公开(公告)号：US09781842B2

公开(公告)日：2017-10-03

申请号：US14142180

申请日：2013-12-27

Applicant: California Institute of Technology

Inventor： Yu-Chong Tai ,  Han-Chieh Chang

IPC: H01G2/12 ,  H05K3/40 ,  H01L23/31 ,  A61F9/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/28 ,  H05K3/38

CPC classification number: H05K3/4038 ,  A61F9/0017 ,  H01L23/3135 ,  H01L2224/73204 ,  H01L2924/0002 ,  H05K1/032 ,  H05K3/0041 ,  H05K3/281 ,  H05K3/282 ,  H05K3/284 ,  H05K3/285 ,  H05K3/381 ,  H05K2201/017 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2203/0139 ,  H05K2203/0514 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1338 ,  Y10T29/49165 ,  H01L2924/00

Abstract: The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.

公开(公告)号：US09780459B1

公开(公告)日：2017-10-03

申请号：US15084654

申请日：2016-03-30

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Arash Behziz ,  Michael David Herring

IPC: H02G15/02 ,  H02G3/00 ,  H02G15/04 ,  H01R24/00 ,  H01R13/40 ,  H01R4/02 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R4/021 ,  H01R9/035 ,  H01R12/613 ,  H05K1/0296 ,  H05K1/11 ,  H05K1/117 ,  H05K2201/10356

Abstract: Linking cable connector includes a lead frame held in an interior cavity of a cover. The lead frame includes conductive leads arranged side by side in a row and extending between a first end and an opposite second end of the lead frame. At least some adjacent conductive leads are spaced on a first lead pitch at the first end, and are spaced on a second lead pitch at the second end. The second lead pitch is less than the first lead pitch. The conductive leads engage and electrically connect to corresponding wire conductors of a first cable harness at the first end of the lead frame, and the conductive leads engage and electrically connect to corresponding wire conductors of a second cable harness at the second end of the lead frame such that the leads provide conductive paths between the first and second cable harnesses.

公开(公告)号：US20170251913A1

公开(公告)日：2017-09-07

申请号：US15057767

申请日：2016-03-01

Applicant: KARL STORZ Endovision, Inc.

Inventor： Dashiell Birnkrant ,  Gerard Vadenais ,  Jordan He ,  Jason Curtis

IPC: A61B1/05 ,  H05K3/34 ,  A61B1/00 ,  H04N5/335

CPC classification number: A61B1/0011 ,  A61B1/051 ,  H04N5/2253 ,  H04N2005/2255 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10356 ,  H05K2201/10628 ,  H05K2201/10757

Abstract: An image sensor module includes a circuit board, image sensor, electronic component assembly, and cable assembly. The circuit board includes a center section located between two end sections. The end sections each extend away from the center section and define an interior area there between. The image sensor is secured to an outer face of the circuit board in the center section with sensor contact fingers being connected at the circuit board outer face in one or both end sections. The electronic component arrangement is mounted on an inner face of the circuit board in the center section. A number of wires of the cable assembly extend through an end gap between the circuit board end sections and are connected to the inner face of the circuit board so as to overlap with the sensor contact fingers along a module longitudinal axis.