公开(公告)号：US20240096543A1

公开(公告)日：2024-03-21

申请号：US18389120

申请日：2023-11-13

Applicant: Delta Electronics, Inc.

Inventor： Yahong Xiong ,  Da Jin ,  Qinghua Su

IPC: H01F27/28 ,  G05F1/575 ,  G06F1/18 ,  H01F17/04 ,  H01F17/06 ,  H01F27/02 ,  H01F27/24 ,  H01F27/29 ,  H01L25/16 ,  H01R12/52 ,  H01R12/58 ,  H02M3/00 ,  H02M3/158 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K3/28 ,  H05K7/14 ,  H05K7/20

CPC classification number: H01F27/2804 ,  G05F1/575 ,  G06F1/183 ,  H01F17/04 ,  H01F17/06 ,  H01F27/02 ,  H01F27/24 ,  H01F27/292 ,  H01L25/16 ,  H01R12/52 ,  H01R12/58 ,  H02M3/003 ,  H02M3/1584 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/117 ,  H05K1/145 ,  H05K1/165 ,  H05K1/181 ,  H05K1/186 ,  H05K3/284 ,  H05K7/1427 ,  H05K7/2089 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2201/10984

Abstract: A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.

公开(公告)号：US20240090124A1

公开(公告)日：2024-03-14

申请号：US17766865

申请日：2020-10-19

Applicant: HARTING Electric Stiftung & Co. KG

Inventor： Norbert KROPIEWNICKI

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K5/00

CPC classification number: H05K1/0256 ,  H05K1/181 ,  H05K3/0005 ,  H05K5/0069 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/10522

Abstract: A circuit board has an upper face and a lower face. The circuit board comprises at least two circuits, with each of the at least two circuits comprising at least one conductor track and at least one current carrying electronic component. The circuit board has at least one through-hole which is provided with at least one insulating unit. The at least one insulating unit is arranged in the at least one through-hole and so is mechanically connected to the circuit board and thus is positioned between a first circuit and at least one second circuit of the circuit board.

公开(公告)号：US11837588B2

公开(公告)日：2023-12-05

申请号：US17978389

申请日：2022-11-01

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： Milind S. Bhagavat ,  Rahul Agarwal

IPC: H01L25/16 ,  H01L21/56 ,  H01L23/498 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K3/28

CPC classification number: H01L25/16 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/49838 ,  H05K1/0231 ,  H05K3/284 ,  H05K3/303 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/10636

Abstract: Various circuit boards with mounted passive components and method of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes at least partially encapsulating a first plurality of passive components in a molding material to create a first molded passive component group. The first molded passive component group is mounted on a surface of a circuit board. The first plurality of passive components are electrically connected to the circuit board.

公开(公告)号：US11830833B2

公开(公告)日：2023-11-28

申请号：US17363018

申请日：2021-06-30

Applicant: Innolux Corporation

Inventor： Chueh Yuan Nien ,  Chao-Chin Sung ,  Chia-Hung Hsieh ,  Mei Cheng Liu

IPC: H01L23/00 ,  H05K1/11 ,  H01L23/31 ,  H05K1/18 ,  H01L25/16

CPC classification number: H01L24/05 ,  H01L23/3192 ,  H01L25/162 ,  H01L25/167 ,  H05K1/111 ,  H05K1/181 ,  H01L24/32 ,  H01L2224/0502 ,  H01L2224/05013 ,  H01L2224/05073 ,  H01L2224/05553 ,  H01L2224/05564 ,  H01L2224/05573 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2924/12041 ,  H01L2924/1426 ,  H01L2924/35121 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2201/10522

Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a protruding portion, and a bonding pad. The protruding portion and the bonding pad are disposed on the base. The bonding pad is not overlapped with a boundary of the protruding portion.

公开(公告)号：US11785715B2

公开(公告)日：2023-10-10

申请号：US18066473

申请日：2022-12-15

Applicant: Exro Technologies Inc.

Inventor： Eric Hustedt

IPC: H05K1/11 ,  H05K1/18 ,  H02M7/00

CPC classification number: H05K1/111 ,  H02M7/003 ,  H05K1/181 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/10166 ,  H05K2201/10522

Abstract: An article for a power inverter, includes a multilayer printed circuit board having a first and second electrically conductive wiring layer and at least a first dielectric layer interposed between the first and second electrically conductive wiring layers. Each conductive wiring layer includes a common input and output line, the common input and output lines at least partially overlapping one another in a projection along a thickness of the multilayer printed circuit board. A set of input mounting pads is carried by the first common input line and a set of input mounting pads is carried by the second common input line, the input mounting pads of the second set of input mounting pads are interleaved with the input mounting pads of the first set of input mounting pads along a first axis. The article further includes a set output mounting pads carried by the common output line.

公开(公告)号：US11764137B2

公开(公告)日：2023-09-19

申请号：US17140926

申请日：2021-01-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin Ho ,  Chih-Cheng Lee ,  Chun Chen Chen ,  Cheng Yuan Chen

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H05K1/18 ,  H05K3/34 ,  H01L21/48

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49838 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/10446 ,  H05K2201/10522

Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

公开(公告)号：US11744056B2

公开(公告)日：2023-08-29

申请号：US17320426

申请日：2021-05-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hee-Won Kang ,  Nam-Su Kim ,  In-Hyuk Ko ,  Eun-Ji Moon

IPC: H05K5/00 ,  H05K9/00 ,  H05K1/02 ,  H05K5/02 ,  H05K1/18

CPC classification number: H05K9/0022 ,  H05K1/0215 ,  H05K1/181 ,  H05K5/006 ,  H05K5/0052 ,  H05K5/0247 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10734

Abstract: Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.

公开(公告)号：US11737214B2

公开(公告)日：2023-08-22

申请号：US17535572

申请日：2021-11-25

Applicant: Innolux Corporation

Inventor： Chen-Lin Yeh ,  Ming-Sheng Lai ,  Yan-Zheng Wu

IPC: H05K1/18 ,  H01Q3/28 ,  H01Q3/34 ,  H05K1/02

CPC classification number: H05K1/181 ,  H01Q3/28 ,  H01Q3/34 ,  H05K1/0219 ,  H05K2201/1003 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10196 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10674

Abstract: An electronic device includes a substrate, a plurality of conductive patterns, and a tunable element. A plurality of conductive patterns are disposed on the substrate. The tunable element is disposed on at least one conductive pattern in the plurality of conductive patterns and includes a first pad, a second pad, and a third pad. The first pad, the second pad, and the third pad are separated from each other. The first pad and the second pad are overlapped with the at least one conductive pattern in the plurality of conductive patterns. The third pad is disposed between the first pad and the second pad.

公开(公告)号：US20230262943A1

公开(公告)日：2023-08-17

申请号：US18169090

申请日：2023-02-14

Applicant: AUDI AG

Inventor： Daniel RUPPERT

IPC: H05K7/20 ,  H05K1/18

CPC classification number: H05K7/20509 ,  H05K1/18 ,  H05K7/209 ,  H05K2201/10522 ,  H05K2201/1059

Abstract: An electrical circuit device comprises at least one first power electronics module, at least one second power electronics module, a circuit board and a supporting structure, wherein the power electronics modules each lie by a contact side against an associated contact surface of the supporting structure and have one or more terminal pins connected to the circuit board on and/or next to a connection side situated opposite the contact side, wherein the first power electronics module has a lesser thickness between the contact side and the connection side than the second power electronics module, wherein the contact surface against which the contact side of the first power electronics module bears has a lesser distance from the circuit board than the contact surface against which the contact side of the second power electronics module bears, and/or wherein the terminal pins of the first power electronics module are longer than the terminal pins of the second power electronics module.

公开(公告)号：US11728555B2

公开(公告)日：2023-08-15

申请号：US17461539

申请日：2021-08-30

Applicant: Micron Technology, Inc.

Inventor： Yoshihito Koya

IPC: G06F3/12 ,  H01P3/12 ,  H01P1/24 ,  H05K1/18 ,  H05K1/02 ,  G06F13/16 ,  G06F13/40 ,  H01P5/08

CPC classification number: H01P3/12 ,  G06F13/1668 ,  G06F13/4068 ,  H01P1/24 ,  H05K1/0243 ,  H05K1/181 ,  H01P5/085 ,  H05K2201/10159 ,  H05K2201/10257 ,  H05K2201/10515 ,  H05K2201/10522

Abstract: Disclosed herein is an apparatus that includes a memory, a processor, and a rectangular waveguide coupled to the memory and the processor so that the memory and the processor communicate with each other via the rectangular waveguide.