公开(公告)号：US09761552B2

公开(公告)日：2017-09-12

申请号：US15271744

申请日：2016-09-21

Applicant: FUJITSU LIMITED

Inventor： Kozo Shimizu ,  Seiki Sakuyama

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L25/00 ,  B23K1/00 ,  B23K3/08 ,  H01L23/31 ,  H01L23/488 ,  H01L23/498 ,  B23K35/02 ,  B23K35/26 ,  H05K1/02 ,  H05K3/34 ,  H01L23/14 ,  B23K101/40 ,  B23K101/42 ,  H05K1/09 ,  H05K1/11

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

公开(公告)号：US09554488B2

公开(公告)日：2017-01-24

申请号：US14256108

申请日：2014-04-18

Applicant: Raytheon Company

Inventor： Cary C. Kyhl ,  Scott M. Heston ,  James M. Elliott

IPC: H05K7/20 ,  H05K3/34 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K7/2039 ,  H01L2224/73253 ,  H01L2924/16195 ,  H05K3/303 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/1056 ,  H05K2201/10628 ,  H05K2201/10689 ,  Y02P70/613

Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.

Abstract translation: 公开了一种表面贴装装置。 表面安装装置可以包括可在电子电路中操作的电子部件。 表面安装装置还可以包括热耦合到电子部件的传热部件。 传热部件可以具有配置成与散热器相接合的传热表面。 此外，表面安装器件可以包括弹性柔性引线，以将电子部件电耦合到电路板。 弹性柔性引线可以被配置为弹性偏转，以促进热传递表面与电路板的可变距离，使得热传递表面和另一类似配置的表面安装器件的平面传热表面能够基本上对准用于接口 与散热器。

公开(公告)号：US09532475B2

公开(公告)日：2016-12-27

申请号：US15016915

申请日：2016-02-05

Applicant: FUJITSU LIMITED

Inventor： Satoshi Masuda

IPC: H01L23/66 ,  H05K7/02 ,  H01L25/16 ,  H01L23/045 ,  H01L23/047 ,  H01L23/498 ,  H05K3/46 ,  H05K7/20 ,  H01L23/00 ,  H01L23/367 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K7/026 ,  H01L23/045 ,  H01L23/047 ,  H01L23/3677 ,  H01L23/49833 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/06181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/19107 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/0215 ,  H05K3/4697 ,  H05K7/20509 ,  H05K9/0039 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10242 ,  H05K2201/10371 ,  H05K2201/1056 ,  H01L2224/45099

Abstract: A high-frequency module includes a lower base member having a recess part formed in an upper face thereof, and having a base metal part formed on a lower face thereof that is to be grounded, an upper substrate disposed inside the recess part of the lower base member. The high frequency module also includes a semiconductor device and a first ground metal part connected to the base metal part and disposed in the lower base member. The upper substrate has a first through hole formed therethrough at a position where the first ground metal part is situated, and the semiconductor device is placed on the first ground metal part in the first through hole.

Abstract translation: 高频模块包括下基部件，其具有形成在其上表面中的凹部，并且具有形成在其下表面上的待接地的基底金属部分，设置在下部的凹部内的上基板 基地会员 高频模块还包括半导体器件和连接到母体金属部分并设置在下部基底部件中的第一接地金属部件。 上基板具有在第一接地金属部件所在的位置处穿过其形成的第一通孔，并且半导体器件被放置在第一通孔中的第一接地金属部件上。

公开(公告)号：US09408327B2

公开(公告)日：2016-08-02

申请号：US14800374

申请日：2015-07-15

Applicant: TDK-LAMBDA CORPORATION

Inventor： L. Ray Albrecht, III ,  Gordon K. Y. Lee ,  Jin He

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/14 ,  H01L23/473

CPC classification number: H05K7/20463 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/144 ,  H05K7/20454 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/1056 ,  H05K2201/10871 ,  Y10T29/49144

Abstract: A thermal management system/method allowing efficient electrical/thermal attachment of heat sourcing PCBs to heat sinking PCBs using reflow/wave/hand soldering is disclosed. The disclosed system/method may incorporate a combination of support pins, spacer pads, and/or contact paste that mechanically attaches a heat sourcing PCB (and its associated components) to a heat sinking PCB such that thermal conductivity between the two PCBs can be optimized while simultaneously allowing controlled electrical conductivity between the two PCBs. Controlled electrical isolation between the two PCBs is provided for using spacer pads that may also be thermally conductive. Contact paste incorporated in some embodiments permits enhanced conductivity paths between the heat sourcing PCB, a thermally conductive plate mounted over the heat sourcing PCB, and the heat sinking PCB. The use of self-centering support pins incorporating out-gassing vents in some embodiments allows reflow/wave/hand soldering as desired.

Abstract translation: 公开了一种热管理系统/方法，其允许使用回流/波/手焊接将散热PCB的热源PCB与电源/热附件进行高效电连接。 所公开的系统/方法可以包括将热源PCB（及其相关部件）机械连接到散热PCB上的支撑销，间隔垫和/或接触膏的组合，使得可以优化两个PCB之间的导热性 同时允许两个PCB之间的受控电导率。 提供了两个PCB之间的受控电隔离，以使用也可以是导热的间隔垫。 在一些实施例中结合的接触膏允许加热PCB，安装在热源PCB上的导热板和散热PCB之间的增强的导电路径。 在一些实施例中，使用包含排气孔的自定心支撑销允许根据需要进行回流/波/手焊。

公开(公告)号：US09318406B2

公开(公告)日：2016-04-19

申请号：US11887082

申请日：2006-03-04

Applicant: Harald Prautzsch

Inventor： Harald Prautzsch

IPC: H05K1/02 ,  H05K7/00 ,  H01L23/34 ,  H01L23/373 ,  H01L23/62 ,  H01L23/40 ,  H05K3/00

CPC classification number: H05K1/0203 ,  H01L23/34 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/62 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0207 ,  H05K3/0061 ,  H05K2201/09745 ,  H05K2201/10409 ,  H05K2201/1056 ,  H01L2924/00

Abstract: A method for determining the temperature of a heat source and an electronic unit, including a printed-circuit board equipped with a sensor and a heat sink, the sensor being connected to the heat sink in a heat-conducting manner.

Abstract translation: 一种用于确定热源和电子单元的温度的方法，包括装有传感器和散热器的印刷电路板，传感器以导热方式连接到散热器。

公开(公告)号：US20150223325A1

公开(公告)日：2015-08-06

申请号：US14612638

申请日：2015-02-03

Applicant: Seiko Epson Corporation

Inventor： Tetsuro MIYAO ,  Hideki ISHIGAMI ,  Yukihiko SHIOHARA ,  Tetsuya OTSUKI ,  Hidefumi NAKAMURA

IPC: H05K1/02 ,  H05K3/40 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0271 ,  H01L21/486 ,  H01L23/15 ,  H01L23/498 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/1319 ,  H01L2224/16235 ,  H01L2224/81439 ,  H01L2224/81447 ,  H01L2224/81471 ,  H01L2224/8148 ,  H01L2224/81484 ,  H01L2224/8185 ,  H01L2924/14 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16251 ,  H01L2924/164 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/092 ,  H05K1/115 ,  H05K1/184 ,  H05K3/1291 ,  H05K3/4061 ,  H05K2201/0269 ,  H05K2201/0272 ,  H05K2201/10083 ,  H05K2201/1056 ,  H05K2203/1126 ,  H05K2203/1131 ,  H05K2203/1194

Abstract: A base substrate includes a ceramic sintered substrate having through holes, first and second metal wirings which are integrally disposed so as to be connected to the surface of the ceramic sintered substrate and the inside of the through holes, and first and second active metal layers which are disposed between the ceramic sintered substrate and the first and second metal wirings.

Abstract translation: 基底基板包括具有通孔的陶瓷烧结基板，一体地设置成连接到陶瓷烧结基板的表面和通孔内部的第一和第二金属布线以及第一和第二有源金属层， 设置在陶瓷烧结基板和第一和第二金属布线之间。

公开(公告)号：US08964392B2

公开(公告)日：2015-02-24

申请号：US13580140

申请日：2011-02-17

Applicant: Emil Kovatchev ,  Michael Maryschka

Inventor： Emil Kovatchev ,  Michael Maryschka

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K1/0218 ,  H05K1/0203 ,  H05K2201/1056

Abstract: A device for screening an electronic module which has electronic components fixed to a printed circuit board and which is connected to a heat sink. The heat sink comprises an electrically conductive material. The printed circuit board has at least one layer composed of electrically conductive material. The heat sink and the printed circuit board serve as screening elements.

Abstract translation: 一种用于屏蔽电子模块的装置，其具有固定到印刷电路板的电子部件，并连接到散热器。 散热器包括导电材料。 印刷电路板具有至少一层由导电材料构成的层。 散热器和印刷电路板用作屏蔽元件。

公开(公告)号：US20140321062A1

公开(公告)日：2014-10-30

申请号：US13870650

申请日：2013-04-25

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kah Hoe Ng ,  Tzye Perng Poh ,  Kay Seah Ng

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H01L23/3675 ,  H01L23/3677 ,  H01L24/17 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/1718 ,  H01L2224/73253 ,  H01L2924/0002 ,  H05K1/0215 ,  H05K1/0216 ,  H05K9/0026 ,  H05K2201/066 ,  H05K2201/1056 ,  H01L2924/00

Abstract: A heat sink that is suitable for mounting on a printed circuit board (PCB) and dissipating heat from an integrated chip (IC).

Abstract translation: 适用于安装在印刷电路板（PCB）上并散发集成芯片（IC）的热量的散热器。

公开(公告)号：US20140308907A1

公开(公告)日：2014-10-16

申请号：US14252717

申请日：2014-04-14

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Howard E. CHEN

IPC: H05K1/02 ,  H04B1/38 ,  H05K1/18

CPC classification number: H05K1/0218 ,  B23K26/361 ,  B23K26/362 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/172 ,  H01L21/565 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3121 ,  H01L23/481 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H03H9/64 ,  H04B1/3833 ,  H04B1/3838 ,  H04B1/40 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/181 ,  H05K1/183 ,  H05K3/288 ,  H05K3/30 ,  H05K3/303 ,  H05K9/0022 ,  H05K2201/1006 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10287 ,  H05K2201/1056 ,  H05K2203/107 ,  H05K2203/1327 ,  Y10T29/49002 ,  Y10T29/49016 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Disclosed are apparatus and methods related to ground paths implemented with surface mount devices to facilitate shielding of radio-frequency (RF) modules. In some embodiments, a module can include a packaging substrate configured to receive a plurality of components. The module can further include an RF component mounted on the packaging substrate and configured to facilitate processing of an RF signal. The module can further include an RF shield disposed relative to the RF component, with the RF shield being configured to provide shielding for the RF component. The RF shield can include at least one shielding-component configured to provide one or more electrical paths between a conductive layer on an upper surface of the module and a ground plane of the packaging substrate. The shielding-component can include a surface-mount device such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD).

Abstract translation: 公开了与表面贴装器件实现的接地路径相关的装置和方法，以便于射频（RF）模块的屏蔽。 在一些实施例中，模块可以包括被配置为接收多个部件的封装基板。 该模块还可以包括安装在封装衬底上并被配置为便于处理RF信号的RF组件。 该模块还可以包括相对于RF部件布置的RF屏蔽，RF屏蔽被配置为为RF部件提供屏蔽。 RF屏蔽件可以包括至少一个屏蔽部件，其被配置为在模块的上表面上的导电层和封装基板的接地平面之间提供一个或多个电路径。 屏蔽部件可以包括诸如实现为芯片尺寸表面声波（SAW）器件（CSSD）器件的RF滤波器的表面贴装器件。

公开(公告)号：US20130343006A1

公开(公告)日：2013-12-26

申请号：US13996497

申请日：2011-12-09

Applicant: Claus Reitlinger ,  Thomas Kerssebrock ,  Thomas Klingl ,  Felix Hudlberger ,  Frank Rehme ,  Michael Gerner

Inventor： Claus Reitlinger ,  Thomas Kerssebrock ,  Thomas Klingl ,  Felix Hudlberger ,  Frank Rehme ,  Michael Gerner

IPC: H05K7/02

CPC classification number: H05K7/026 ,  H01L23/053 ,  H01L23/10 ,  H01L23/544 ,  H01L23/552 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0655 ,  H01L2223/54486 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/2902 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/73253 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/83007 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/92225 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H05K3/303 ,  H05K2201/1056 ,  H05K2201/10568 ,  Y02P70/613 ,  Y10T29/49002 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: The invention relates to an electrical module (100) for being received by automatic placement machines by means of generating a vacuum, comprising a carrier substrate (10), at least one component (20, 21) disposed on the carrier substrate (10), and a cover element (30) disposed above the at least one component (20, 21). A fixing component (40) by which the cover element (30) is attached to the at least one component (21) is disposed between the cover element (30) and the at least one component (21). The cover element can be implemented as a dimensionally stable, flat film by means of which it is possible to suction the module by means of vacuum for a placement method, and to place said module at a position on a circuit board.

Abstract translation: 本发明涉及一种电气模块（100），用于通过产生真空来由自动放置机器接收，该模块包括载体基板（10），设置在载体基板（10）上的至少一个部件（20,21） 以及设置在所述至少一个部件（20,21）上方的覆盖元件（30）。 覆盖元件（30）与所述至少一个部件（21）之间设置有固定部件（40），所述固定部件（40）通过所述固定部件（40）与所述至少一个部件（21）相连。 覆盖元件可以实现为尺寸稳定的平坦膜，通过该膜可以通过用于放置方法的真空抽吸模块，并将所述模块放置在电路板上的位置。