公开(公告)号：US20180182681A1

公开(公告)日：2018-06-28

申请号：US15904469

申请日：2018-02-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Hirofumi SHINAGAWA ,  Yuki ITO

IPC: H01L23/12 ,  H05K1/02 ,  H05K3/32

CPC classification number: H01L23/12 ,  H01L23/13 ,  H01L23/48 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/1329 ,  H01L2224/16225 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2924/15151 ,  H01L2924/15159 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/0326 ,  H05K3/32 ,  H05K3/328 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/0949 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/10121 ,  H05K2201/10553 ,  H05K2201/2009 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A component-mounting resin substrate includes a resin substrate and a component. The resin substrate includes a thermoplastic resin body. The component is mounted on the resin substrate by ultrasonic bonding. In a mounting area of the resin body in which the component is mounted, a cavity that is hollowed from a mounting surface on which the component is mounted is defined. A plating layer that includes a material harder than the resin body is disposed on at least a portion of a wall surface of the cavity.

公开(公告)号：US09961766B2

公开(公告)日：2018-05-01

申请号：US15278558

申请日：2016-09-28

Applicant: NIPPON MEKTRON, LTD.

Inventor： Masayuki Iwase

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/36 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0283 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/118 ,  H05K3/365 ,  H05K2201/2009

Abstract: A stretchable circuit board includes a stretchable base, a stretchable wiring portion, a reinforcement base having in-plane rigidity higher than that of the stretchable base, and a draw-out wiring portion. The stretchable wiring portion having stretchability is formed on a main surface located on at least one side of the stretchable base. The draw-out wiring portion is formed at least on a main surface that is one side of the reinforcement base. The main surface of the reinforcement base is overlaid with a part of an area where the stretchable wiring portion is formed, in which the main surface faces the main surface of the stretchable base. A part of the stretchable wiring portion and a part of the draw-out wiring portion are joined together, and they are electrically continuous.

公开(公告)号：US20180093041A1

公开(公告)日：2018-04-05

申请号：US15832124

申请日：2017-12-05

Applicant: UCB Biopharma SPRL

Inventor： Martin John Mcloughlin ,  Michael James David Heald ,  Cameron Townley Charles ,  Dylan Sanders Garrett ,  Kevin Richard Lozeau

IPC: A61M5/20 ,  A61M5/00 ,  H05K1/18 ,  H05K1/02 ,  A61M5/24 ,  A61M5/32 ,  A61M5/315 ,  A61M5/31

CPC classification number: A61M5/20 ,  A61M5/002 ,  A61M5/3134 ,  A61M5/31505 ,  A61M5/31515 ,  A61M5/3202 ,  A61M5/3204 ,  A61M5/326 ,  A61M2005/2013 ,  A61M2005/206 ,  A61M2005/208 ,  A61M2005/2477 ,  A61M2205/13 ,  A61M2205/50 ,  A61M2205/502 ,  A61M2205/505 ,  A61M2205/583 ,  A61M2205/586 ,  A61M2205/8206 ,  H05K1/0298 ,  H05K1/189 ,  H05K2201/052 ,  H05K2201/10151 ,  H05K2201/2009

Abstract: Provided is a drive unit for an auto-injector having a drive unit housing arranged for docking receipt of a syringe or of a cassette unit comprising a syringe movable from a rest position, in which a needle tip of the syringe is within the drive unit housing to a use position, in which the needle tip protrudes from a needle delivery aperture; and a drive arrangement including one or more electrically powered sources of axial drive; a first drive transfer element for advancing the syringe to said use position; and a second drive transfer element for moving a plunger into the barrel of the syringe to eject liquid contents thereof. The drive unit housing is provided with a skin sensor arrangement having an array of plural skin sensor electrodes located about the needle delivery aperture.

公开(公告)号：US09888575B2

公开(公告)日：2018-02-06

申请号：US15413714

申请日：2017-01-24

Applicant: FUJITSU LIMITED

Inventor： Yoshikatsu Ishizuki

IPC: H05K1/00 ,  H05K1/16 ,  H05K1/11 ,  H05K7/00 ,  H05K1/14 ,  H05K1/02 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K1/147 ,  H05K1/028 ,  H05K1/181 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/042 ,  H05K2201/2009

Abstract: An electronic device includes: a wiring substrate;a plurality of components having different heights mounted on one surface of the wiring substrate; and a flexible substrate, the flexible substrate being formed by laminating on a one surface side of the wiring substrate, that covers the plurality of components, the flexible substrate including a first portion that covers, among the plurality of components, one or more first components that have heights that are equivalent to or lower than a first height, and a second portion that covers, among the plurality of components, one or more second components other than the one or more first components, a first rigidity of the first portion being higher than a second rigidity of the second portion.

公开(公告)号：US09706693B2

公开(公告)日：2017-07-11

申请号：US13750184

申请日：2013-01-25

Applicant: Christopher Hunt ,  John Lewison ,  Robin Pittson

Inventor： Christopher Hunt ,  John Lewison ,  Robin Pittson

IPC: H05K1/00 ,  H05K13/00 ,  H05K3/32 ,  H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H05K3/00

CPC classification number: H05K13/00 ,  H05K1/0277 ,  H05K1/181 ,  H05K3/0058 ,  H05K3/22 ,  H05K3/321 ,  H05K2201/2009 ,  H05K2203/0769 ,  H05K2203/0776 ,  H05K2203/088 ,  H05K2203/176 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T156/10 ,  Y10T156/1111 ,  Y10T156/1153

Abstract: An electronic circuit assembly comprises a substrate and circuit components attached to the substrate by means of an electrically conductive adhesive, wherein the adhesive is releasable under predetermined release conditions, whereby to enable the circuit components to be removed from the substrate for recovery or re-use.

公开(公告)号：US09632263B2

公开(公告)日：2017-04-25

申请号：US15029016

申请日：2014-09-11

Applicant: NITTO DENKO CORPORATION

Inventor： Naoki Shibata ,  Yuichi Tsujita

IPC: G02B6/12 ,  G02B6/42 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/32

CPC classification number: G02B6/4245 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/4239 ,  G02B6/428 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/117 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0358 ,  H05K2201/09481 ,  H05K2201/09827 ,  H05K2201/10121 ,  H05K2201/2009 ,  H05K2201/2054

Abstract: In an opto-electric hybrid board according to the present invention, an electrical interconnect line and an optical element are provided on a first surface of a substrate, and an optical waveguide optically coupled to the optical element is provided on a second surface of the substrate. A reinforcement layer for reinforcing the substrate is integrally mounted on the first surface of the substrate on which the electrical interconnect line and the optical element are provided, with an adhesive layer therebetween. A connector pad part for externally electrically connecting the electrical interconnect line is provided on the second surface of the substrate on which the optical waveguide is provided. With this configuration, the reinforcement layer is mounted on the substrate with high strength without adverse effects exerted on the optical element and the optical waveguide.

公开(公告)号：US20170111990A1

公开(公告)日：2017-04-20

申请号：US15249931

申请日：2016-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ho-hyeuk IM

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0281 ,  H05K1/189 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2201/09781 ,  H05K2201/2009

Abstract: A printed circuit board (PCB) that may improve the reliability of an electronic apparatus includes a base substrate having a first edge and a second edge on both sides of the base substrate, the base substrate having a bending region including an opening adjacent to the first edge, an opening adjacent to the second edge, and mounting regions extending from both ends of the bending region and including device mounting portions, a connection line formed on the base substrate and crossing the bending region, the connection line configured to connect the device mounting portions of the mounting regions extending from the both ends of the bending region; and a guard pattern formed on each or at least one of a top surface and a bottom surface of the base substrate along a boundary of each or at least one of the openings.

公开(公告)号：US20170102502A1

公开(公告)日：2017-04-13

申请号：US15316940

申请日：2015-03-18

Applicant: NITTO DENKO CORPORATION

Inventor： Naoki Shibata ,  Yuichi Tsujita

IPC: G02B6/12 ,  H05K1/02 ,  G02B6/42

CPC classification number: G02B6/12 ,  G02B6/4214 ,  G02B6/4274 ,  G02B6/428 ,  G02B6/43 ,  H01L25/167 ,  H01L31/02325 ,  H01L33/58 ,  H01L33/62 ,  H05K1/02 ,  H05K1/0274 ,  H05K3/0061 ,  H05K2201/10121 ,  H05K2201/2009

Abstract: An opto-electric hybrid board includes opto-electric module portions respectively defined on opposite end portions of an elongated insulation layer, and an interconnection portion defined on a portion of the insulation layer between the opto-electric module portions and including an optical waveguide. A metal reinforcement layer extends over the opto-electric module portions into the interconnection portion. A portion of the metal reinforcement layer present in the interconnection portion has a smaller width than portions of the metal reinforcement layer present in the opto-electric module portions, and has a discontinuity extending widthwise across the metal reinforcement layer. This arrangement makes it possible to protect the optical waveguide from the bending and the twisting of the interconnection portion, while ensuring the flexibility of the interconnection portion including the optical waveguide.

公开(公告)号：US20170064818A1

公开(公告)日：2017-03-02

申请号：US15197736

申请日：2016-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-gyu KIM ,  Hyun LEE ,  Dong-han KIM

IPC: H05K1/02 ,  H05K3/00 ,  H01L21/48 ,  H05K1/03 ,  H01L23/498

CPC classification number: H05K1/0271 ,  H01L21/4846 ,  H01L23/145 ,  H01L23/49838 ,  H05K1/03 ,  H05K1/0366 ,  H05K3/0011 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/2009

Abstract: A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.

Abstract translation: 封装板包括包括电路层和纤维层的堆叠结构。 纤维层包括沿第一方向延伸并且是无纺纤维的至少一个第一纤维。 此外，预浸料坯包括作为无纺纤维的第一纤维; 与第一纤维间隔开并且是编织纤维的多个第二纤维; 以及填充第一纤维和多个第二纤维之间的间隙的绝缘层。

公开(公告)号：US09572259B2

公开(公告)日：2017-02-14

申请号：US14755173

申请日：2015-06-30

Applicant: NITTO DENKO CORPORATION

Inventor： Naohiro Terada ,  Yoshito Fujimura

IPC: H05K1/00 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/181 ,  H05K1/0281 ,  H05K1/189 ,  H05K2201/0394 ,  H05K2201/2009 ,  Y02P70/611

Abstract: A suspension board with circuit includes a metal supporting board having a support opening portion passing through a thickness direction; a base insulating layer disposed on an upper surface of the metal supporting board and having an insulating opening portion passing through the thickness direction, when projected in the thickness direction, to be included in the support opening portion; and a conductive layer having a wire portion disposed on an upper surface of the base insulating layer and a terminal portion disposed in the insulating opening portion to be connected to an electronic element and connected to the wire portion. The base insulating layer has a cutout portion obtained by cutting out the base insulating layer in a direction orthogonal to the thickness direction and continuous to the insulating opening portion and the terminal portion includes a terminal free end portion opened by the cutout portion.

Abstract translation: 具有电路的悬挂板包括具有穿过厚度方向的支撑开口部分的金属支撑板; 基底绝缘层，其设置在所述金属支撑基板的上表面上，具有贯穿所述厚度方向的绝缘开口部，当在厚度方向上突出时，所述绝缘开口部包含在所述支撑开口部中; 以及导电层，其具有布置在所述基底绝缘层的上表面上的导线部分和设置在所述绝缘开口部分中以连接到电子元件并连接到所述导线部分的端子部分。 所述基底绝缘层具有通过在与所述厚度方向正交的方向上切割所述基底绝缘层而与所述绝缘开口部连续的端部而形成的切口部，并且所述端子部包括由所述切口部开口的端子自由端部。