公开(公告)号：US20170265303A1

公开(公告)日：2017-09-14

申请号：US15067439

申请日：2016-03-11

Applicant: Continental Automotive Systems, Inc.

Inventor： Donald J. Zito ,  David Wayne Currier ,  Keith A. Meny ,  Leobardo Martinez Hernandez ,  Russ Dalbke ,  Peter Lechowicz

IPC: H05K1/18 ,  H05K3/30 ,  H05K5/03 ,  H05K1/11 ,  H01G9/008

CPC classification number: H05K1/183 ,  H01G2/06 ,  H01G9/008 ,  H01G9/06 ,  H01G9/08 ,  H05K1/184 ,  H05K3/30 ,  H05K3/301 ,  H05K3/32 ,  H05K3/3421 ,  H05K5/0056 ,  H05K7/1432 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/2018 ,  Y02P70/613

Abstract: A retention structure which provides both soldering and vibration stabilization of a capacitor as the capacitor is mounted to a printed circuit board (PCB) of an electronic module. An aperture is part of the PCB to stabilize and prevent the capacitor from rolling during manufacturing. Once secured to the PCB, Room Temperature Vulcanization (RTV), or similar adhesive bead, is placed onto a rigidizer or base plate (typically a casted or aluminum sheet plate). Once the capacitor is soldered in place and fixated on the PCB, the assembly is then placed onto the rigidizer such that the PCB is attached to the rigidizer using an adhesive, and the RTV bead contacts and is deformed by the capacitor, connecting the capacitor to the rigidizer to provide vibration stabilization support. The electronic module includes a cover, and optional dampening/constraint pads are attached to the cover of the electrolytic capacitor for additional vibration stabilization.

公开(公告)号：US09750140B2

公开(公告)日：2017-08-29

申请号：US14656387

申请日：2015-03-12

Applicant: InnoLux Corporation

Inventor： Hung-Kun Chen ,  Po-Hung Shen ,  Hui- Min Huang ,  Shih-Hsiung Wu ,  Jui-Chu Lai ,  Huan-Kuang Peng ,  Hong-Kang Chang ,  Yu-Chien Kao ,  Li-Wei Sung

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H05K3/00 ,  H01L51/52 ,  G02F1/1339 ,  H05K1/14 ,  G02F1/1333

CPC classification number: H05K3/0052 ,  G02F1/133351 ,  G02F1/1339 ,  G02F1/13394 ,  G02F2001/133388 ,  H01L51/5246 ,  H01L51/525 ,  H05K1/144 ,  H05K2201/09154 ,  H05K2201/10128 ,  H05K2201/2018 ,  H05K2201/2036 ,  Y10T428/24355

Abstract: The disclosure provides a display device including a first substrate, a display region disposed above the first substrate; a second substrate; a sealant disposed between the first substrate and the second substrate and outside the display region; and, a plurality of spacers disposed within the sealant. In particular, the first substrate and the second substrate are bonded together via the sealant. Further, the first substrate has a side wall including a first cutting crack surface and a first median crack surface, wherein a roughness of the first cutting crack surface is different from that of the first median crack surface.

公开(公告)号：US20170245363A1

公开(公告)日：2017-08-24

申请号：US15057078

申请日：2016-02-29

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Nan GUO ,  Feifan CHEN ,  Bojie ZHAO ,  Bo PENG ,  Zhen HUANG

IPC: H05K1/02 ,  G02B7/09 ,  H05K3/32 ,  H04N5/225 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K1/0298 ,  G02B7/09 ,  H04N5/2253 ,  H05K3/0014 ,  H05K3/0052 ,  H05K3/0058 ,  H05K3/20 ,  H05K3/32 ,  H05K3/46 ,  H05K3/4673 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/2018

Abstract: A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

公开(公告)号：US09721870B2

公开(公告)日：2017-08-01

申请号：US14561663

申请日：2014-12-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Paul F. Bodenweber ,  Kenneth C. Marston ,  Kamal K. Sikka ,  Hilton T. Toy ,  Randall J. Werner ,  Jeffrey A. Zitz

IPC: H01L23/46 ,  H01L23/34 ,  H01L35/30 ,  H01L23/367 ,  G06F1/20 ,  H01L23/467 ,  H01L23/473

CPC classification number: H05K7/20263 ,  G06F1/203 ,  H01L23/34 ,  H01L23/3672 ,  H01L23/46 ,  H01L23/467 ,  H01L23/473 ,  H01L35/30 ,  H05K1/181 ,  H05K7/20254 ,  H05K7/20272 ,  H05K2201/2018

Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

公开(公告)号：US09706661B2

公开(公告)日：2017-07-11

申请号：US14608482

申请日：2015-01-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Yong Choi

IPC: H01L23/34 ,  H05K1/18 ,  H01L21/50 ,  H01L23/13 ,  H01L21/56 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L23/31 ,  H05K1/02

CPC classification number: H05K1/181 ,  H01L21/50 ,  H01L21/561 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/023 ,  H05K2201/10371 ,  H05K2201/10378 ,  H05K2201/1056 ,  H05K2201/2018 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611 ,  H01L2224/81 ,  H01L2924/00012

Abstract: An electronic device module includes a first substrate having at least one or more electronic devices mounted on one surface thereof, a second substrate bonded to one surface of the first substrate and including at least one device accommodating part having a space in which the electronic device is accommodated, and a shielding member disposed in the device accommodating part and accommodating at least one or more electronic devices therein.

公开(公告)号：US09681550B2

公开(公告)日：2017-06-13

申请号：US12200749

申请日：2008-08-28

Applicant: Joseph C. Fjelstad

Inventor： Joseph C. Fjelstad

IPC: H05K1/18 ,  H05K1/05 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/92144 ,  H01L2224/96 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/056 ,  H05K3/284 ,  H05K3/4644 ,  H05K2201/0969 ,  H05K2201/2018 ,  H05K2203/0156 ,  H05K2203/1469 ,  Y10T29/49124 ,  Y10T29/49146 ,  H01L2924/00

Abstract: A frame 100 containing aperture(s) 102, 103, 104 is positioned on and joined to a permanent substrate 206a or temporary substrate 206b. Electrical component(s) 202, 203, 204 are placed into respective aperture(s) 102, 103, 104 with the leads 504, 1002 of the component(s) 202, 203, 204 positioned on and attached to the permanent substrate 206a or the temporary substrate 206b. Then an encapsulant 402, electrically insulating, but preferably thermally conductive, envelops the component(s) 102, 103, 104. At this point, temporary substrate 206b may be removed exposing component leads 1002. Or, if component(s) 102, 103, 104 are mounted on permanent substrate 206a, vias 502 extend from the surface of substrate 206a to leads 504. With leads 504, 1002 exposed, the completed subassembly 500, 1000 may be incorporated into various forms of reverse-interconnection process (RIP) assemblies as detailed in related applications.

公开(公告)号：US09596748B2

公开(公告)日：2017-03-14

申请号：US13852373

申请日：2013-03-28

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wee Chin Judy Lim

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0215 ,  H05K9/0024 ,  H05K9/0039 ,  H05K2201/2018 ,  Y10T29/49124

Abstract: A lens mount is attached to a circuit board and covers electrical components on the circuit board. An electrically insulating device is positioned between the lens mount and the circuit board. The circuit board includes a grounding pad adjacent the electrically insulating device. The lens mount includes an aperture aligned with the grounding pad and the electrically insulating device. A conductive glue is dispensed into the aperture to electrically ground the lens mount to the grounding pad. The electrically insulating device seals the conductive glue from the electrical components. A method of grounding a lens mount to a circuit board is provided.

Abstract translation: 镜头座安装在电路板上并覆盖电路板上的电气部件。 电绝缘装置位于透镜支架和电路板之间。 电路板包括邻近电绝缘装置的接地垫。 透镜座包括与接地垫和电绝缘装置对准的孔。 将导电胶分配到孔中以将透镜安装座电接地到接地垫。 电绝缘装置将导电胶从电气部件密封。 提供了一种将透镜座连接到电路板的方法。

公开(公告)号：US09583445B2

公开(公告)日：2017-02-28

申请号：US14218384

申请日：2014-03-18

Applicant: Apple Inc.

Inventor： Richard H. Dinh ,  Ashutosh Y. Shukla ,  Scott A. Myers

IPC: H01L23/552 ,  H01L27/146 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18 ,  H01L23/13 ,  H01L23/15 ,  H01L23/00 ,  H05K3/00 ,  H05K3/36

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L27/14618 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/81801 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15311 ,  H01L2924/15787 ,  H05K1/0218 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/363 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09145 ,  H05K2201/09354 ,  H05K2201/09509 ,  H05K2201/09618 ,  H05K2201/10378 ,  H05K2201/2018 ,  H01L2924/014 ,  H01L2924/00

Abstract: An electrical component may be mounted on a substrate such as a ceramic substrate. Contacts may be formed on upper and lower surfaces of the substrate. The electrical component may be soldered to the contacts on the upper surface. The contacts on the lower surface may be used to solder the substrate to a printed circuit. During manufacturing, it may be desirable to use metal traces on a ceramic panel to make connections to contacts on the substrate. Following singulation of the ceramic panel to form the ceramic substrate, some of the metal traces may run to the edge of the ceramic substrate. A folded tab of the printed circuit may form a shield that covers these exposed traces. A divided metal-coated groove or a row of divided metal-coated vias running along each edge of the substrate may also provide shielding.

Abstract translation: 电气部件可以安装在诸如陶瓷基板的基板上。 可以在基板的上表面和下表面上形成接触。 电气部件可以焊接到上表面上的触点。 下表面上的触点可用于将基板焊接到印刷电路。 在制造过程中，可能需要在陶瓷板上使用金属迹线来连接到基板上的触点。 在陶瓷面板分层以形成陶瓷衬底之后，一些金属迹线可以流到陶瓷衬底的边缘。 印刷电路的折叠片可以形成覆盖这些暴露痕迹的屏蔽。 沿着衬底的每个边缘延伸的划分的金属涂覆的凹槽或一排划分的金属涂覆的通孔也可以提供屏蔽。

公开(公告)号：US20160374223A1

公开(公告)日：2016-12-22

申请号：US15067146

申请日：2016-03-10

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Hai-Bin XU ,  Tao WANG ,  Shou-Yu HONG ,  Zhen-Qing ZHAO

IPC: H05K7/14 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K3/30 ,  H05K3/284 ,  H05K5/064 ,  H05K7/1432 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10636 ,  H05K2201/2018 ,  H05K2203/1316 ,  Y02P70/611

Abstract: A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.

Abstract translation: 封装模块包括电路板，布置在电路板上的电子部件，邻近电子部件的至少一侧设置的框架和密封剂。 在框架和电子部件之间形成间隙。 密封剂包括覆盖电路板的至少一部分的第一部分和填充到间隙的至少一部分中的第二部分。 第一部分具有相对于电路板的第一高度，并且第二部分具有相对于电路板的第二高度，其中第二高度大于第一高度。

公开(公告)号：US20160358836A1

公开(公告)日：2016-12-08

申请号：US14732119

申请日：2015-06-05

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Yi Pan ,  Hilton T. Toy ,  Jeffrey A. Zitz

IPC: H01L23/367 ,  H05K3/30 ,  H01L21/52 ,  H01L23/04 ,  H01L23/498

CPC classification number: H01L21/52 ,  H01L23/04 ,  H01L23/16 ,  H01L23/3675 ,  H01L23/467 ,  H01L23/473 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/00014 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16793 ,  H01L2924/171 ,  H01L2924/1715 ,  H01L2924/176 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/2018 ,  H01L2924/014

Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.

Abstract translation: 集成电路（IC）芯片模块包括载体，加强框架，IC芯片和第一定向散热器。 第二定向散热器还可以布置成与第一定向散热器正交。 载体具有构造成电连接到母板的顶表面和底表面。 加强框架包括容纳IC芯片并且可以附接到载体的顶表面的开口。 IC芯片同心地布置在加强框架的开口内。 第一定向散热器附接到加强框架和IC芯片，并且通常在第一相对的双向驱动器方向上移除热量。 当包括在IC芯片模块中时，第二定向散热器附接到加强框架和第一定向散热器，并且通常在与第一相对的双向驱动器方向正交的第二相对的双向驱动器方向上去除热量。