公开(公告)号：US20190035993A1

公开(公告)日：2019-01-31

申请号：US16135317

申请日：2018-09-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Alejandro Aldrin II Agcaoili Narag ,  Siang Sin Foo ,  Hiromitsu Kosugi

IPC: H01L33/62 ,  B32B15/08 ,  B32B27/28 ,  H01L33/48 ,  H01L33/58 ,  B32B7/12 ,  H05K1/03 ,  H05K1/18 ,  H05K3/28

CPC classification number: H01L33/62 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/202 ,  B32B2457/202 ,  H01L33/486 ,  H01L33/58 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2201/10106

Abstract: Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

公开(公告)号：US20180366518A1

公开(公告)日：2018-12-20

申请号：US16111155

申请日：2018-08-23

Applicant: E Ink Holdings Inc.

Inventor： Kuan-Yi LIN ,  Yu-Wen CHEN ,  Yu-Chieh HUNG ,  Chun-Yu LU ,  Wen-Chung TANG ,  Po-Wei CHEN ,  Yu-Lin HSU

IPC: H01L27/28 ,  H01L51/05 ,  H01L51/10 ,  H01L27/12 ,  H01L51/00 ,  H01L51/52 ,  H05K1/00

CPC classification number: H01L27/283 ,  H01L27/124 ,  H01L51/0097 ,  H01L51/0533 ,  H01L51/0541 ,  H01L51/107 ,  H01L51/5253 ,  H05K1/00 ,  H05K1/036 ,  H05K1/113 ,  H05K1/189 ,  H05K3/423 ,  H05K2201/0179 ,  H05K2201/0338 ,  H05K2201/10128 ,  Y02E10/549

Abstract: A flexible display device includes a flexible substrate, an inorganic barrier layer, a metal layer, an organic buffer layer, and an insulating layer. The inorganic barrier layer is located on the flexible substrate. The metal layer is located on the inorganic barrier layer and in contact with the inorganic barrier layer. The organic buffer layer covers the inorganic barrier layer and the metal layer, and has at least one conductive via connected to the metal layer. The insulating layer is located on the organic buffer layer.

公开(公告)号：US20170367192A1

公开(公告)日：2017-12-21

申请号：US15612357

申请日：2017-06-02

Applicant: Nanoshield Technology Co. Ltd.

Inventor： James Cheng LEE

IPC: H05K3/28 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K3/284 ,  H05K1/185 ,  H05K3/285 ,  H05K3/303 ,  H05K2201/0104 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0179 ,  H05K2201/0257 ,  H05K2203/1333

Abstract: A method for waterproofing a device and the resulting device are provided. The device includes a printed circuit board assembly (PCBA), which includes a printed circuit board, and at least one electronic component disposed on the printed circuit board. A waterproof coating such as a polymer coating is disposed on or in contact with at least one portion of the at least one electronic component. A nanofilm is disposed on the PCBA. The nanofilm includes an inner coating and an outer coating. The inner coating is disposed on the printed circuit board or in contact with the waterproof coating. The inner coating comprises metal oxide nanoparticles having a particle diameter in a range of about 5 nm to about 100 nm. The outer coating in contact with the inner coating, and comprises silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

公开(公告)号：US09745481B2

公开(公告)日：2017-08-29

申请号：US14971595

申请日：2015-12-16

Applicant: The United States of America as Represented by the Administrator of the National Aeronautics and Space Administration

Inventor： Terry D. Rolin ,  Curtis W. Hill

IPC: B05D5/12 ,  C09D11/033 ,  C09D11/14 ,  H01G13/04 ,  C08K3/22 ,  C08K3/40

CPC classification number: C09D11/033 ,  C08K3/22 ,  C08K3/24 ,  C08K3/40 ,  C08K9/02 ,  C08K2003/2206 ,  C08K2003/2237 ,  C08K2201/003 ,  C08K2201/011 ,  C09D11/037 ,  C09D11/14 ,  C09D11/322 ,  C09D11/36 ,  H01G4/12 ,  H01G4/129 ,  H01G4/30 ,  H01G4/33 ,  H01G13/04 ,  H05K1/162 ,  H05K2201/0179 ,  H05K2201/0209 ,  H05K2203/0776

Abstract: The present invention is a dielectric ink and means for printing using said ink. Approximately 10-20% of the ink is a custom organic vehicle made of a polar solvent and a binder. Approximately 30-70% of the ink is a dielectric powder having an average particle diameter of approximately 10-750 nm. Approximately 5-15% of the ink is a dielectric constant glass. Approximately 10-35% of the ink is an additional amount of solvent. The ink is deposited on a printing substrate to form at least one printed product, which is then dried and cured to remove the solvent and binder, respectively. The printed product then undergoes sintering in an inert gas atmosphere.

公开(公告)号：US09648720B2

公开(公告)日：2017-05-09

申请号：US13947525

申请日：2013-07-22

Applicant: Frank Ferdinandi ,  Rodney Edward Smith ,  Mark Robson Humphries

Inventor： Frank Ferdinandi ,  Rodney Edward Smith ,  Mark Robson Humphries

IPC: H05K3/28 ,  H05K1/02 ,  H05K3/00 ,  H01L23/00

CPC classification number: H05K1/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2224/81024 ,  H01L2224/81395 ,  H01L2224/81815 ,  H01L2224/83024 ,  H01L2224/83205 ,  H01L2224/83395 ,  H01L2224/83815 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/85395 ,  H01L2224/85447 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/00 ,  H05K3/282 ,  H05K3/285 ,  H05K3/288 ,  H05K3/3484 ,  H05K3/3489 ,  H05K3/3494 ,  H05K2201/015 ,  H05K2201/0179 ,  H05K2203/092 ,  H05K2203/107 ,  H05K2203/1338 ,  H05K2203/1366 ,  H05K2203/1372 ,  H05K2203/1383 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method including: attaching a plurality of conductive tracks to at least one surface of a substrate, depositing a coating comprising at least one halo-hydrocarbon polymer on the at least one surface of the substrate, and soldering through the coating.

公开(公告)号：US20170018697A1

公开(公告)日：2017-01-19

申请号：US15124724

申请日：2015-02-27

Applicant: Sharp Kabushiki Kaisha

Inventor： Masahiro KONISHI ,  Shin ITOH ,  Hiroyuki NOKUBO ,  Yoshiaki ITAKURA

IPC: H01L33/64 ,  H01L33/56 ,  H01L33/62 ,  H01L33/60 ,  H01L25/075

CPC classification number: H01L33/642 ,  F21K9/00 ,  F21V29/773 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/16225 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K1/053 ,  H05K3/44 ,  H05K2201/0179 ,  H05K2201/10106

Abstract: In order to provide a substrate for light emitting devices having high heat radiating properties, dielectric strength voltage properties, light reflectivity, and excellent mass productivity, a substrate (5) includes an intermediate layer (11) containing ceramic which is formed on the surface of the aluminum base (10) by using an aerosol deposition method.

Abstract translation: 为了提供具有高散热性，介电强度电压特性，光反射率和优异的批量生产率的发光器件的衬底，衬底（5）包括含有陶瓷的中间层（11），其形成在 铝基（10）。

公开(公告)号：US20160338192A1

公开(公告)日：2016-11-17

申请号：US15222333

申请日：2016-07-28

Applicant: Stephen GONYA ,  James Sean EICHE ,  James PATTERSON ,  Kenneth R. TWIGG

Inventor： Stephen GONYA ,  James Sean EICHE ,  James PATTERSON ,  Kenneth R. TWIGG

IPC: H05K1/02 ,  H05K3/06

CPC classification number: H05K1/0284 ,  H05K3/06 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/09872

Abstract: A method of producing a non-planar conforming circuit on a non-planar surface includes creating a first set of conforming layers. The first set of conforming layers is created by applying an oxide dielectric layer to the surface, applying a conductive material layer to the oxide dielectric layer, applying a resist layer to the conductive material layer, patterning the resist layer according to a desired circuit layout, etching the surface to remove exposed conductive material, and stripping the resist layer. The process may be repeated to form multiple layers of conforming circuits with electrical connections between layers formed by blind microvias. The resulting set of conforming layers can be sealed.

Abstract translation: 在非平面表面上制造非平面符合电路的方法包括产生第一组一致的层。 通过向表面施加氧化物电介质层，向氧化物介电层施加导电材料层，向导电材料层施加抗蚀剂层，根据期望的电路布局图案化抗蚀剂层，形成第一组一致性层， 蚀刻表面以除去暴露的导电材料，并剥离抗蚀剂层。 该过程可以重复以形成具有通过盲微孔形成的层之间的电连接的多层符合电路。 所得到的一组适形层可以被密封。

公开(公告)号：US20160105970A1

公开(公告)日：2016-04-14

申请号：US14511549

申请日：2014-10-10

Applicant: Lockheed Martin Corporation

Inventor： Stephen Gonya ,  James Sean Eiche ,  James Patterson ,  Kenneth R. Twigg

IPC: H05K3/02 ,  H05K3/28 ,  H05K1/11 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K1/0284 ,  H05K3/06 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/09872

Abstract: A method of producing a non-planar conforming circuit on a non-planar surface includes creating a first set of conforming layers. The first set of conforming layers is created by applying an oxide dielectric layer to the surface, applying a conductive material layer to the oxide dielectric layer, applying a resist layer to the conductive material layer, patterning the resist layer according to a desired circuit layout, etching the surface to remove exposed conductive material, and stripping the resist layer. The process may be repeated to form multiple layers of conforming circuits with electrical connections between layers formed by blind microvias. The resulting set of conforming layers can be sealed.

公开(公告)号：US20150294793A1

公开(公告)日：2015-10-15

申请号：US14646637

申请日：2013-11-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Dipankar Ghosh ,  Christopher S. Lyons ,  Robin E. Gorrell ,  Stephen P. Maki

IPC: H01G4/33 ,  H01G4/20

CPC classification number: H01G4/33 ,  H01G4/20 ,  H01G4/206 ,  H01L28/56 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/162 ,  H05K3/022 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/1366

Abstract: A multilayer dielectric film including a first dielectric layer made from a material having a first breakdown field strength and a second dielectric layer disposed on the first dielectric layer made from a material having a different breakdown filed strength. A multilayer film including a first electrically conductive layer, the first dielectric layer disposed on the first electrically conductive layer, the second dielectric layer disposed on the first dielectric layer, and a second electrically conductive layer disposed on the second dielectric layer is also disclosed. The first electrically conductive layer can have at least one of an average surface roughness of at least ten nanometers, a thickness of at least ten micrometers, or an average visible light transmission of up to ten percent. The first dielectric layer may be a polymer and typically has a lower dielectric constant than the second dielectric layer, which may be ceramic.

Abstract translation: 一种多层电介质膜，包括由具有第一击穿场强的材料制成的第一电介质层和设置在具有不同击穿场强的材料制成的第一电介质层上的第二电介质层。 还公开了一种多层膜，其包括第一导电层，设置在第一导电层上的第一介电层，设置在第一介电层上的第二介电层和设置在第二介电层上的第二导电层。 第一导电层可以具有至少10纳米的平均表面粗糙度，至少10微米的厚度或高达10％的平均可见光透射率中的至少一个。 第一介电层可以是聚合物，并且通常具有比可以是陶瓷的第二介电层更低的介电常数。

公开(公告)号：US20150182142A1

公开(公告)日：2015-07-02

申请号：US14625364

申请日：2015-02-18

Applicant: Second Sight Medical Products, Inc.

Inventor： Robert J. Greenberg ,  Jordan M. Neysmith ,  Neil H. Talbot ,  Jerry Ok

IPC: A61B5/04 ,  A61N1/05 ,  H05K3/04 ,  H05K3/06 ,  C23C16/56 ,  C23C16/01

CPC classification number: A61B5/04001 ,  A61B2562/125 ,  A61N1/0529 ,  A61N1/0543 ,  A61N1/0551 ,  A61N1/0553 ,  C23C16/01 ,  C23C16/56 ,  H05K1/032 ,  H05K3/007 ,  H05K3/048 ,  H05K3/06 ,  H05K3/28 ,  H05K3/4676 ,  H05K2201/0179 ,  H05K2203/016 ,  H05K2203/0502 ,  H05K2203/176 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: The invention is directed to a method of making an implantable insulated electrical circuit that utilizes polyparaxylylene, preferably as Parylene, a known polymer that has excellent living tissue implant characteristics, to provide for chronic implantation of conductive electrical devices, such as stimulators and sensors. The device is thin, flexible, electrically insulated, and stable after long exposure to living tissue. Layers of Parylene may be combined with layers of a polymer, such as polyimide, to yield greater design flexibility in the circuit. Multiple electrical conduction layers may be stacked in the circuit to increase packing density.

Abstract translation: 本发明涉及一种制造可植入绝缘电路的方法，该方法利用聚对二甲苯，优选作为聚对二甲苯（parylene），已知具有优异活体组织植入特征的聚合物，以提供诸如刺激剂和传感器的导电电气装置的慢性植入。 该设备在长时间暴露于生物体组织之后，薄，柔性，电绝缘和稳定。 聚对二甲苯层可以与诸如聚酰亚胺的聚合物层结合，以在电路中产生更大的设计灵活性。 多个导电层可以堆叠在电路中以增加堆积密度。