公开(公告)号：US08982169B2

公开(公告)日：2015-03-17

申请号：US13747703

申请日：2013-01-23

Applicant: Rohm Co., Ltd.

Inventor： Shinobu Obata ,  Koji Nishi ,  Takafumi Katsuno ,  Masumi Okumura ,  Nobuhito Kinoshita

IPC: B41J2/335 ,  B41J2/045 ,  H05K3/06 ,  H05K1/09 ,  H05K3/12 ,  H05K1/03

CPC classification number: B41J2/3352 ,  B41J2/04541 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/3353 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/3359 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/092 ,  H05K3/06 ,  H05K3/12 ,  H05K3/40 ,  H05K2201/017 ,  H05K2201/0338 ,  H05K2201/035

Abstract: According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.

Abstract translation: 根据本公开，公开了精细布线图案的制造方法。 该制造方法包括制备支撑构件，通过厚膜印刷在支撑构件上形成第一层，并通过厚膜印刷在第一层上形成包括Ag的第二层。 该方法还包括通过对第一层和第二层执行蚀刻处理来形成预定的精细布线图案。

公开(公告)号：US20150053466A1

公开(公告)日：2015-02-26

申请号：US14465794

申请日：2014-08-21

Applicant: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD. ,  ZHEN DING TECHNOLOGY CO., LTD.

Inventor： MING-JAAN HO ,  XIAN-QIN HU ,  JIAN LUO ,  FU-YUN SHEN

IPC: H05K1/02 ,  H05K3/02 ,  H05K1/09

CPC classification number: H05K1/0274 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0338 ,  H05K2201/0355 ,  Y10T29/49156

Abstract: A printed circuit board (PCB) and a method for manufacturing the PCB are disclosed. A PCB includes a transparent insulating substrate, a conductive circuit layer 16, and a transparent cover layer. The conductive circuit layer is located between the transparent insulating substrate and the transparent cover layer. The conductive circuit layer includes a first Ni—W alloy pattern layer, a copper pattern layer, and a second Ni—W alloy pattern layer. The first Ni—W alloy pattern layer is adhered with the transparent adhesive layer. Bottom surfaces of the conductive pattern layer are coated by the first Ni—W alloy pattern layer. Top surfaces and side surfaces of conductive pattern layer are coated by the second Ni—W alloy pattern layer.

Abstract translation: 公开了一种印刷电路板（PCB）及其制造方法。 PCB包括透明绝缘基板，导电电路层16和透明覆盖层。 导电电路层位于透明绝缘基板和透明覆盖层之间。 导电电路层包括第一Ni-W合金图案层，铜图案层和第二Ni-W合金图案层。 第一Ni-W合金图案层用透明粘合剂层粘附。 导电图案层的底表面被第一Ni-W合金图案层涂覆。 导电图案层的顶表面和侧表面由第二Ni-W合金图案层涂覆。

公开(公告)号：US20150027760A1

公开(公告)日：2015-01-29

申请号：US14086500

申请日：2013-11-21

Applicant: SAMSUNG ELECTRO-MECHANICS., LTD.

Inventor： Seong Min CHO ,  Jung Youn PANG ,  Eun Heay LEE ,  Seung Min KANG

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/18

CPC classification number: H05K3/3457 ,  H05K1/111 ,  H05K3/388 ,  H05K2201/0338 ,  H05K2201/09663 ,  Y02P70/611

Abstract: A printed circuit board includes an insulating layer; a metal pad formed on the insulating layer; a surface treatment layer formed on the metal pad; a solder layer formed on the surface treatment layer and the insulating layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer. Further, a printed circuit board may include an insulating layer; a metal seed layer formed on the insulating layer; a metal pad formed on the metal seed layer; a surface treatment layer formed on the metal pad and the metal seed layer; a solder layer formed on the surface treatment layer of the metal pad and the surface treatment layer of the metal seed layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer.

Abstract translation: 印刷电路板包括绝缘层; 形成在所述绝缘层上的金属焊盘; 形成在所述金属垫上的表面处理层; 形成在表面处理层和绝缘层上的焊料层; 以及在焊料层和表面处理层之间形成的金属间化合物层。 此外，印刷电路板可以包括绝缘层; 形成在所述绝缘层上的金属籽晶层; 形成在金属籽晶层上的金属垫; 形成在所述金属焊盘和所述金属种子层上的表面处理层; 在金属焊盘的表面处理层和金属种子层的表面处理层上形成的焊料层; 以及在焊料层和表面处理层之间形成的金属间化合物层。

公开(公告)号：US20150016049A1

公开(公告)日：2015-01-15

申请号：US14386637

申请日：2013-03-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Seol Hee Lim

IPC: H05K1/05

CPC classification number: H05K1/05 ,  C25D3/14 ,  C25D3/16 ,  C25D5/022 ,  C25D5/12 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/11 ,  H05K1/117 ,  H05K1/181 ,  H05K3/244 ,  H05K2201/0104 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/10159 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on exposed surfaces of the mounting part and the terminal part.

Abstract translation: 用于存储卡的印刷电路板包括绝缘层; 绝缘层的第一表面上的安装部分，所述安装部分电连接到存储装置; 以及在所述绝缘层的第二表面上的端子部分，所述端子部分电连接到外部电子设备，其中在所述安装部分和所述端子部分的暴露表面上形成具有相同特性的相同金属层。

公开(公告)号：US20150008023A1

公开(公告)日：2015-01-08

申请号：US14496203

申请日：2014-09-25

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Manoj Nirmal ,  Stephen P. Maki ,  Jason C. Radel ,  Robert L. Brott ,  Donald J. McClure ,  Clark I. Bright

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/11

CPC classification number: H05K1/0274 ,  G02F1/133502 ,  G02F1/133512 ,  G02F1/13439 ,  G02F1/13718 ,  G02F2001/133521 ,  G02F2203/34 ,  H05K1/032 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/0108 ,  H05K2201/0338 ,  H05K2201/10136

Abstract: A conducting film or device electrode includes a substrate and two transparent or semitransparent conductive layers separated by a transparent or semitransparent intervening layer. The intervening layer includes electrically conductive pathways between the first and second conductive layers to help reduce interfacial reflections occurring between particular layers in devices incorporating the conducting film or electrode.

Abstract translation: 导电膜或器件电极包括衬底和由透明或半透明中间层隔开的两个透明或半透明导电层。 中间层包括在第一和第二导电层之间的导电通路，以帮助减少在结合导电膜或电极的器件中在特定层之间发生的界面反射。

公开(公告)号：US08927911B2

公开(公告)日：2015-01-06

申请号：US12839523

申请日：2010-07-20

Applicant: John R. Short

Inventor： John R. Short

IPC: H05B3/08 ,  H05B3/84

CPC classification number: H05K1/0274 ,  H05B3/84 ,  H05B2203/016 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2201/10272

Abstract: A bus bar system includes a non-conductive substrate having a major surface. At least one conductive bus bar is formed over at least a portion of the major surface. A conductive coating is formed over at least a portion of the bus bar and the major surface. An electrically conductive adhesive, such as an isotropically conductive tape or film, is applied over at least a portion of the film/bus bar junction. The system can optionally include a conductive metallic foil adhered to the isotropically conductive adhesive.

Abstract translation: 母线系统包括具有主表面的非导电衬底。 在主表面的至少一部分上形成至少一个导电汇流条。 在母线和主表面的至少一部分上形成导电涂层。 诸如各向异性导电带或膜之类的导电粘合剂涂覆在膜/汇流条结的至少一部分上。 该系统可以可选地包括粘附到各向同性导电粘合剂的导电金属箔。

公开(公告)号：US20140374149A1

公开(公告)日：2014-12-25

申请号：US14303790

申请日：2014-06-13

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Masaki SANADA ,  Syota MIKI

IPC: H05K1/11

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/5384 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/18 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81444 ,  H01L2224/8182 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/0338 ,  H05K2201/10515 ,  H05K2201/1053 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A pad structure includes an insulating layer; a first metal layer formed on one surface of the insulating layer and including an intermetallic compound layer of copper and tin or a tin layer; and a second metal layer formed on the first metal layer and including a gold layer.

Abstract translation: 衬垫结构包括绝缘层; 形成在所述绝缘层的一个表面上并且包括铜和锡或锡层的金属间化合物层的第一金属层; 以及形成在第一金属层上并且包括金层的第二金属层。

公开(公告)号：US20140363681A1

公开(公告)日：2014-12-11

申请号：US14288567

申请日：2014-05-28

Applicant: Heraeus Precious Metals North America Conshohocken, LLC

Inventor： Virginia C. Garcia ,  Matthew Sgriccia ,  Mark Challingsworth

IPC: H01B1/16 ,  H05K3/12

CPC classification number: H01B1/16 ,  H05K1/092 ,  H05K3/1291 ,  H05K3/246 ,  H05K2201/0338 ,  H05K2203/1126 ,  H05K2203/1476

Abstract: The invention provides an electroconductive paste comprising 50-90 wt. % of copper particle, 0.5-10 wt. % of a glass frit, 0.1-5% wt. % of adhesion promoter, which is at least one selected member from the group consisting of cuprous oxide, titanium oxide, zirconium oxide, boron resinate, zirconium resinate, amorphous boron, lithium phosphate, bismuth oxide, aluminum oxide, and zinc oxide, and 5-20 wt. % of an organic vehicle. An article comprising an aluminum nitride substrate and electroconductive paste of the invention is also provided. A method of forming an electroconductive circuit comprising is also provided.

Abstract translation: 本发明提供一种包含50-90wt。 铜颗粒％，0.5-10wt。 百分比的玻璃料，0.1-5重量％ 粘合促进剂的％，其为氧化亚铜，氧化钛，氧化锆，硼酸树脂，锆树脂酸锆，无定形硼，磷酸锂，氧化铋，氧化铝和氧化锌中的至少一种选择的成员，以及5 -20wt。 有机车辆的百分比。 还提供了包含本发明的氮化铝衬底和导电膏的制品。 还提供了形成导电电路的方法。

公开(公告)号：US20140218909A1

公开(公告)日：2014-08-07

申请号：US14133822

申请日：2013-12-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ariyoshi TETSUO ,  Cheon Ho PARK ,  Jong Pil WON ,  Ji Hoon YUN ,  Jun Ho JUNG

IPC: F21K99/00 ,  H01L33/58 ,  H01L27/15

CPC classification number: F21K9/64 ,  F21K9/27 ,  F21K9/65 ,  F21K9/69 ,  F21V5/02 ,  F21V5/043 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/38 ,  H01L33/44 ,  H01L2224/13 ,  H01L2224/48091 ,  H05K1/021 ,  H05K1/0256 ,  H05K1/189 ,  H05K3/107 ,  H05K3/305 ,  H05K3/44 ,  H05K2201/0338 ,  H05K2201/0358 ,  H05K2201/0376 ,  H05K2201/09154 ,  H05K2201/098 ,  H05K2201/10106 ,  H05K2203/0139 ,  H05K2203/025 ,  H01L2924/00014

Abstract: A light source module including a substrate, a plurality of light emitting devices installed on the substrate, and a plurality of lenses installed on the substrate to cover the plurality of light emitting devices, respectively, and each of the plurality of lenses having a pair of open end portions facing one another, the plurality of lenses arranged such that an open end portion of one lens faces an opened end portion of an adjacent lens is provided.

Abstract translation: 一种光源模块，包括基板，安装在基板上的多个发光装置，以及分别安装在基板上以覆盖多个发光装置的多个透镜，并且多个透镜中的每一个具有一对 所述多个透镜被设置为使得一个透镜的开口端部面向相邻透镜的开口端部。

公开(公告)号：US20140160708A1

公开(公告)日：2014-06-12

申请号：US14103850

申请日：2013-12-12

Applicant: Kuan-Yu Chu ,  Chen-Fu Huang ,  Chiu-Mei Liu ,  Ming-Wu Chen ,  Chin-Pei Hwang ,  Chun-Cheng Huang ,  Yu-Ching Wang ,  Chung-Hsien Li ,  Kuo-Hsing Chen ,  Yu-Ting Chen ,  Chen-Hao Su

Inventor： Kuan-Yu Chu ,  Chen-Fu Huang ,  Chiu-Mei Liu ,  Ming-Wu Chen ,  Chin-Pei Hwang ,  Chun-Cheng Huang ,  Yu-Ching Wang ,  Chung-Hsien Li ,  Kuo-Hsing Chen ,  Yu-Ting Chen ,  Chen-Hao Su

IPC: H02H9/02

CPC classification number: H02H9/02 ,  G06F3/0416 ,  G06F3/044 ,  G06F2203/04107 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K1/117 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/09354 ,  H05K2201/09727 ,  H01L2924/00

Abstract: A lead structure disposed on a substrate is provided. The substrate includes a display area disposed with a device and a peripheral area disposed with a lead structure including first pads, a second pad, first traces and a second trace. The first traces are connected to the device. Each first trace has a first linear portion and a first bonding portion connected together. Each first trace is electrically connected to one of the first pads through the first bonding portion. The second trace has a second linear portion and a second bonding portion connected together. The second trace is electrically connected to the second pad through the second bonding portion. A width of the first linear portion is smaller than a width of the first bonding portion, and a width of the second linear portion is smaller than a width of the second bonding portion.

Abstract translation: 设置在基板上的引线结构。 衬底包括布置有器件的显示区域和设置有包括第一焊盘，第二焊盘，第一迹线和第二迹线的引线结构的周边区域。 第一条迹线连接到设备。 每个第一迹线具有连接在一起的第一直线部分和第一接合部分。 每个第一迹线通过第一接合部分电连接到第一焊盘之一。 第二迹线具有连接在一起的第二直线部分和第二接合部分。 第二迹线通过第二接合部电连接到第二焊盘。 第一直线部分的宽度小于第一接合部分的宽度，并且第二直线部分的宽度小于第二接合部分的宽度。