公开(公告)号：US20110110047A1

公开(公告)日：2011-05-12

申请号：US12939915

申请日：2010-11-04

Applicant: Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

Inventor： Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

IPC: H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/144 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/2018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.

Abstract translation: 模块可电连接到计算机系统。 模块包括耦合到第一表面的第一表面和第一多个电路封装。 该模块还包括耦合到第二表面的第二表面和第二多个电路封装。 第二表面面向第一表面。 模块还包括位于第一表面和第二表面之间的至少一个热导管。 所述至少一个热导管与所述第一多个电路封装件和所述第二多个电路封装体热连通。

公开(公告)号：US07940532B2

公开(公告)日：2011-05-10

申请号：US12114255

申请日：2008-05-02

Applicant: Steven Lee Willing ,  Kent Carlson ,  Robert E. Campbell ,  Alberto Avendano

Inventor： Steven Lee Willing ,  Kent Carlson ,  Robert E. Campbell ,  Alberto Avendano

IPC: H05K7/14

CPC classification number: H05K1/0263 ,  H02M7/003 ,  H05K2201/09954 ,  H05K2201/10424 ,  H05K2201/1059 ,  H05K2201/2018

Abstract: The present invention relates, generally, to electrical power conversion devices and to the universal packaging of those devices for a wide range of applications yielding cost efficient inventory management of product lines consisting of a group of power conversion devices each with minor variations. More specifically, the present invention relates to a universal mounting frame for receiving a printed circuit board in a switch mode power supply. The universal frame is adapted for receiving an open frame or printed circuit board and securing the open frame within a plurality of known packaging configurations. To this end, only a single size printed circuit board is necessary for any type of switch mode power supply configurations, thereby, reducing costs associated with manufacture and testing.

Abstract translation: 本发明一般涉及电力转换装置以及用于各种应用的这些装置的通用封装，从而对由各种各样的变化的一组电力转换装置组成的产品线进行成本效益的库存管理。 更具体地，本发明涉及一种用于在开关模式电源中接收印刷电路板的通用安装框架。 通用框架适于接收开放框架或印刷电路板，并将开放框架固定在多个已知的包装结构内。 为此，对于任何类型的开关模式电源配置，仅需要单一尺寸的印刷电路板，从而降低与制造和测试相关的成本。

公开(公告)号：US20110096506A1

公开(公告)日：2011-04-28

申请号：US12685723

申请日：2010-01-12

Applicant: Chun-Ming Huang ,  Chien-Ming Wu ,  Chih-Chyau Yang ,  Shih-Lun Chen ,  Chin-Long Wey ,  Chi-Shi Chen ,  Chi-Sheng Lin

Inventor： Chun-Ming Huang ,  Chien-Ming Wu ,  Chih-Chyau Yang ,  Shih-Lun Chen ,  Chin-Long Wey ,  Chi-Shi Chen ,  Chi-Sheng Lin

IPC: H05K7/20 ,  H05K7/00

CPC classification number: H05K7/20 ,  H01L23/49833 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2225/1094 ,  H05K1/0272 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/064 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/2018 ,  H05K2203/1572

Abstract: A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.

Abstract translation: 提供了多层片上系统（SoC）模块结构。 多层SoC模块结构包括至少两个电路板模块层和至少一个连接器模块层。 每个连接器模块层夹在两个电路板模块层之间并由此电连接，使得SoC模块结构通过堆叠形成。 每个电路板模块层由至少一个电路板模块组成，而每个连接器模块层由至少一个连接器模块组成。 因此，SoC模块结构可以制造为三维结构，从而允许SoC模块结构内的高度灵活的连接。

公开(公告)号：US20110061922A1

公开(公告)日：2011-03-17

申请号：US12610166

申请日：2009-10-30

Applicant: Jae Joon LEE ,  Jin Yong Ahn ,  Jin Ho Kim ,  Dong Ju Jeon

Inventor： Jae Joon LEE ,  Jin Yong Ahn ,  Jin Ho Kim ,  Dong Ju Jeon

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K1/0271 ,  H01L23/13 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/20 ,  H05K3/4682 ,  H05K2201/0187 ,  H05K2201/068 ,  H05K2201/09136 ,  H05K2201/2018 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Disclosed is a package substrate, which includes an insulating layer including a circuit layer having a via for connecting layers and an insulating member formed in the insulating layer so as to separate the insulating layer, thus preventing the package substrate from warping and reducing land co-planarity of the substrate. A method of fabricating the package substrate is also provided, including (a) forming a first circuit layer on a carrier, (b) forming an insulating layer on the carrier having the first circuit layer, (c) forming an insulating member in the insulating layer so as to separate the insulating layer, (d) forming a second circuit layer including a via on the insulating layer and the insulating member, and (e) removing the carrier.

Abstract translation: 公开了一种封装基板，其包括绝缘层，该绝缘层包括具有用于连接层的通孔的电路层和形成在绝缘层中的绝缘构件，以分离绝缘层，从而防止封装基板翘曲并减少焊盘共面， 基底的平面度。 还提供了一种制造封装衬底的方法，包括：（a）在载体上形成第一电路层，（b）在具有第一电路层的载体上形成绝缘层，（c）在绝缘层中形成绝缘构件 层，以分离绝缘层，（d）在绝缘层和绝缘构件上形成包括通孔的第二电路层，以及（e）去除载体。

公开(公告)号：US20100325882A1

公开(公告)日：2010-12-30

申请号：US12827732

申请日：2010-06-30

Applicant: Joseph Ted DiBene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

Inventor： Joseph Ted DiBene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

IPC: H05K3/00

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  G06F1/20 ,  H01L23/427 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/15312 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  Y10T29/49124

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

Abstract translation: 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并允许大量的电流从静电或动态从一个衬底传递到下一个衬底。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于占用两个基板之间的机械公差，同时提供低阻抗互连。

公开(公告)号：US07859852B2

公开(公告)日：2010-12-28

申请号：US11720801

申请日：2006-08-09

Applicant: Gerhard Wetzel ,  Peter Sprafke ,  Ulrich Trescher

Inventor： Gerhard Wetzel ,  Peter Sprafke ,  Ulrich Trescher

IPC: H05K1/00

CPC classification number: H05K1/147 ,  F16H61/0006 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/49175 ,  H05K1/142 ,  H05K3/0061 ,  H05K5/0082 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2203/049 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In a controller, in particular for motor vehicle transmissions, having a holder (1) on which an electronic circuit component (2) and at least one flexible printed-circuit film (3) connected to the electronic circuit component (2) by means of electric connection means (7) are arranged, it is proposed to arrange on the holder (1) a frame component (5) which surrounds the electronic circuit component (2), and to connect the electric connection means (7) connected to the electronic circuit component electrically to the at least one flexible printed-circuit film (3), through at least one opening (15) in the frame component (5).

Abstract translation: 在控制器中，特别是对于机动车辆变速器，具有一个保持器（1），电子电路部件（2）和至少一个柔性印刷电路膜（3）通过以下方式连接到电子电路部件（2） 设置有电连接装置（7），在保持器（1）上布置围绕电子电路部件（2）的框架部件（5），并且连接电子连接装置（7） 电路部件通过框架部件（5）中的至少一个开口（15）与至少一个柔性印刷电路膜（3）电连接。

公开(公告)号：US20100284161A1

公开(公告)日：2010-11-11

申请号：US12840432

申请日：2010-07-21

Applicant: Hiroyuki MOTOHARA

Inventor： Hiroyuki MOTOHARA

IPC: H05K1/14

CPC classification number: H05K1/144 ,  G01R31/2818 ,  H01L2924/0002 ,  H05K1/0268 ,  H05K3/403 ,  H05K2201/042 ,  H05K2201/09181 ,  H05K2201/10378 ,  H05K2201/2018 ,  H05K2203/162 ,  H01L2924/00

Abstract: There is provided a stacked mounting structure in which, it is possible to carry out testing of each substrate after the formation of (after manufacturing) the stacked mounting structure.The stacked mounting structure includes a first substrate (10) which includes a first electronic component, a second substrate (20) which is disposed facing the first substrate (10), and which includes a second electronic component, an intermediate member (40) which has a space for accommodating the second electronic component, an electroconductive member (7) which is provided to the intermediate member (40), a first electrode for testing (11a) which is electrically connected to the first electronic component, as an electrode for testing an operation of the first electronic component, a connecting electrode toward the second substrate (22a) which is electrically connected to the second electronic component, as an electrode for electrically connecting to the electroconductive member (7), and a second electrode for testing (12a) which is provided to the first substrate as an electrode for testing an operation of the second electronic component, and which is electrically connected to the second electronic component via the electroconductive member (7) and the connecting electrode toward the second substrate (22a).

Abstract translation: 提供了一种堆叠的安装结构，其中可以在（制造之后）层叠的安装结构之后对每个基板进行测试。 堆叠的安装结构包括第一基板（10），其包括第一电子部件，第二基板（20），其面对第一基板（10）设置，并且包括第二电子部件，中间部件（40） 具有用于容纳第二电子部件的空间，设置在中间部件（40）上的导电部件（7），与第一电子部件电连接的第一测试用电极（11a），作为测试电极 第一电子部件的操作，朝向与第二电子部件电连接的第二基板（22a）的连接电极作为用于电连接到导电部件（7）的电极和用于测试的第二电极（12a ），其被提供给作为用于测试第二电子部件的操作的电极的第一基板，并且与第二基板电连接 第二电子部件经由导电部件（7）和连接电极朝向第二基板（22a）。

公开(公告)号：US20100276711A1

公开(公告)日：2010-11-04

申请号：US12434242

申请日：2009-05-01

Applicant: Mark Anthony Hand ,  Daniel Sekowski ,  Frederick Lloyd Carpenter ,  Bernhard Bachl ,  Bernd Bienek ,  Olaf Cladders ,  Henning Dieker ,  Christian Miesner ,  Peter Schopper ,  Lothar Schopmann ,  Herfried Zimmer

Inventor： Mark Anthony Hand ,  Daniel Sekowski ,  Frederick Lloyd Carpenter ,  Bernhard Bachl ,  Bernd Bienek ,  Olaf Cladders ,  Henning Dieker ,  Christian Miesner ,  Peter Schopper ,  Lothar Schopmann ,  Herfried Zimmer

IPC: H01L33/00

CPC classification number: H05K3/284 ,  F21K9/00 ,  H05K1/0256 ,  H05K3/301 ,  H05K3/3421 ,  H05K2201/012 ,  H05K2201/10977 ,  H05K2201/2018

Abstract: In a light emitting diode arrangement for lighting purposes, comprising a circuit board with at least one light generating semiconductor element disposed on the circuit board and conductors extending on the circuit board to the semiconductor element and being electrically connected to terminals of the semiconductor element, a light transmissive element is disposed on the circuit board and covers the semiconductor element and a flame resistant cover element is disposed below the light transmissive element and on top of the terminals to cover the terminals to provide for electrical and flame insulation thereof.

Abstract translation: 在用于照明目的的发光二极管装置中，包括具有设置在电路板上的至少一个光产生半导体元件的电路板和在电路板上延伸到半导体元件并与半导体元件的端子电连接的导体， 透光元件设置在电路板上并覆盖半导体元件，并且阻燃覆盖元件设置在透光元件下方并且在端子的顶部上以覆盖端子以提供其电气和火焰绝缘。

公开(公告)号：US07807934B2

公开(公告)日：2010-10-05

申请号：US11430335

申请日：2006-05-09

Applicant: Peter Ford ,  Colin Fuller

Inventor： Peter Ford ,  Colin Fuller

IPC: H01L23/28 ,  H05K3/36

CPC classification number: H05K3/301 ,  H05K3/284 ,  H05K2201/2018 ,  H05K2203/304 ,  Y10T29/49126

Abstract: A printed circuit board is provided with protection means for protecting one or more components of the printed circuit board (PCB). The protection means includes a sleeve member located on the PCB around at least one component of the PCB. The protection means further includes cover means for covering a whole or substantial part of an opening of said sleeve member. The cover means is formed from or includes mica.

Abstract translation: 印刷电路板设置有用于保护印刷电路板（PCB）的一个或多个部件的保护装置。 保护装置包括位于PCB周围的PCB的至少一个部件上的套筒构件。 保护装置还包括用于覆盖所述套筒构件的开口的整个或大部分的盖装置。 覆盖装置由云母形成或包括云母。

公开(公告)号：US07777313B2

公开(公告)日：2010-08-17

申请号：US11345147

申请日：2006-01-31

Applicant: Roy Vesper Buck, Jr. ,  Joseph Samuel Bergeron

Inventor： Roy Vesper Buck, Jr. ,  Joseph Samuel Bergeron

IPC: H01L23/02

CPC classification number: H05K3/3405 ,  H01L24/16 ,  H01L24/97 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/181 ,  H05K2201/10371 ,  H05K2201/2018 ,  H05K2203/0173 ,  H05K2203/1572

Abstract: Electronics packages are provided with structure that provides a significantly-reduced package footprint and also facilitates substantial reduction of package fabrication time and cost. The footprint reduction is realized with a frame that defines an aperture wall which surrounds first sets of components on the first side of a printed circuit board and also extends away from the printed circuit board to provide package input/output access along the perimeter of the package footprint. The second side of the printed circuit board receives a second set of components and this set is protected by a board fill. The frame and printed circuit board are configured for realization from frame and board panels whose planar forms substantially reduce package fabrication time and cost because they facilitate the use of modern high-speed printed circuit board (PCB) fabrication processes.

Abstract translation: 电子封装具有提供显着减小的封装占地面积的结构，并且还有助于显着减少封装制造时间和成本。 通过框架来实现占地面积减小，该框架限定了围绕印刷电路板的第一侧上的第一组元件的孔壁，并且还延伸离开印刷电路板，以沿着封装的周边提供封装输入/输出访问 脚印。 印刷电路板的第二面接收第二组组件，并且该组由板填充保护。 框架和印刷电路板被配置为从框架和板面板实现，其平面形式基本上减少了封装制造时间和成本，因为它们有助于使用现代高速印刷电路板（PCB）制造工艺。