公开(公告)号：US09444021B2

公开(公告)日：2016-09-13

申请号：US14406710

申请日：2013-05-10

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Yuhsuke Fujita ,  Kenichi Akamatsu

IPC: H01J1/02 ,  H01L33/48 ,  H01L33/62 ,  H01L33/50 ,  H01L33/52 ,  H05K1/02 ,  H05K1/09 ,  H05K1/18

CPC classification number: H01L33/486 ,  H01L33/507 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/09 ,  H05K1/189 ,  H05K2201/0355 ,  H05K2201/09136 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2201/2009 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The folding along the disposed direction of wiring patterns is prevented. Concave-convex shapes in a plan view for preventing the folding of a device as step portions in a plan view are provided on opposing sides of two conductive regions. A front edge side 3a1 of a convex shape in a plan view of a Cu foil layer 3a, which is one of the two conductive regions, is disposed to enter into a concave portion (on the side of a bottom side 3b2) of a concave shape in a plan view of a Cu foil layer 3b, which is the other conductive region, to prevent the folding along the disposed direction of wiring patterns.

Abstract translation: 防止沿布线图案的布置方向的折叠。 在两个导电区域的相对侧设置有用于防止在平面图中作为台阶部分折叠的装置的平面图中的凹凸形状。 在作为两个导电区域中的一个的Cu箔层3a的俯视图中的凸形的前边缘侧3a1被设置成进入凹部（底侧3b2侧）的凹部 在作为另一个导电区域的Cu箔层3b的平面图中形成为防止沿布线图案的布置方向折叠的形状。

公开(公告)号：US09427582B2

公开(公告)日：2016-08-30

申请号：US14532982

申请日：2014-11-04

Applicant: Second Sight Medical Products, Inc.

Inventor： Robert J Greenberg ,  Matthew J McMahon ,  Jordan Matthew Neysmith ,  James S Little ,  Neil Hamilton Talbot ,  Kelly H McClure ,  Brian V Mech

IPC: A61N1/36 ,  A61N1/05 ,  A61N1/372 ,  H05K1/02 ,  H05K3/00 ,  H05K1/11 ,  H05K3/28

CPC classification number: A61N1/36046 ,  A61N1/0543 ,  A61N1/37223 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/0014 ,  H05K3/28 ,  H05K2201/0133 ,  H05K2201/09018 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/302 ,  Y10T29/49158

Abstract: Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. It is advantageous that the array edges not contact tissue.

Abstract translation: 聚合物材料可用作神经刺激的电极阵列体。 它们特别有用于视网膜刺激以产生人造视觉，耳蜗刺激以产生人造听觉和皮质刺激以及许多相关目的。 通过电极阵列对视网膜或其他神经组织施加的压力是至关重要的。 太小的压力会导致电阻增加以及电场分散。 太大的压力可能会阻止血液流动。 通常的柔性电路制造技术通常需要使柔性电路电极阵列平坦。 由于神经组织几乎从不平坦，平面阵列必然会施加不均匀的压力。 此外，柔性电路聚合物阵列的边缘可以是尖锐的并切割精细的神经组织。 阵列边缘不接触组织是有利的。

公开(公告)号：US09408305B2

公开(公告)日：2016-08-02

申请号：US14947558

申请日：2015-11-20

Applicant: MC10, Inc.

Inventor： Yung-Yu Hsu

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/16 ,  H01R9/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

公开(公告)号：US09408300B2

公开(公告)日：2016-08-02

申请号：US14620214

申请日：2015-02-12

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Che Wu ,  Chen-Chu Tsai ,  Chien-Jung Huang ,  Yung-Hui Yeh ,  Heng-Yin Chen

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K1/0281 ,  H05K3/0032 ,  H05K3/007 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/1178

Abstract: According to embodiments of the disclosure, a flexible device and a fabrication method thereof are provided. The flexible device has a first area and a second area, and the stiffness of a portion of the first area is greater than the stiffness of the second area. The flexible device may include a flexible substrate and a rigid element. The flexible substrate includes a first surface and a second surface opposite to each other. The second surface has a coarse structure. The surface roughness of the second surface is greater in the first area than in the second area. The rigid element is disposed on the first surface of the flexible substrate and located in the first area. The stiffness of the rigid element is greater than the stiffness of the flexible substrate. A projection area of the coarse structure on the flexible substrate overlaps an area of the rigid element.

Abstract translation: 根据本公开的实施例，提供了柔性装置及其制造方法。 柔性装置具有第一区域和第二区域，并且第一区域的一部分的刚度大于第二区域的刚度。 柔性装置可以包括柔性基底和刚性元件。 柔性基板包括彼此相对的第一表面和第二表面。 第二表面具有粗糙的结构。 在第一区域中第二表面的表面粗糙度大于第二区域中的表面粗糙度。 刚性元件设置在柔性基板的第一表面上并且位于第一区域中。 刚性元件的刚度大于柔性基板的刚度。 柔性基板上的粗糙结构的投影区域与刚性元件的区域重叠。

公开(公告)号：US20160216464A1

公开(公告)日：2016-07-28

申请号：US15023768

申请日：2014-06-24

Applicant: NITTO DENKO CORPORATION

Inventor： Yuichi Tsujita ,  Naoki Shibata

IPC: G02B6/42 ,  H05K3/24 ,  G02B6/13 ,  H05K1/18 ,  H05K3/30 ,  G02B6/122 ,  H05K1/02 ,  H05K3/10

CPC classification number: G02B6/428 ,  G02B6/122 ,  G02B6/13 ,  G02B6/4214 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/43 ,  H05K1/0274 ,  H05K1/0281 ,  H05K1/181 ,  H05K3/10 ,  H05K3/24 ,  H05K3/301 ,  H05K2201/10121 ,  H05K2201/2009

Abstract: An inventive opto-electric hybrid board includes: opto-electric module portions respectively provided on opposite end portions of an elongated insulation layer and including a first electric wiring of a first electrically conductive pattern and an optical element provided on a front surface of the insulation layer; and an interconnection portion provided on a portion of the insulation layer extending from the opto-electric module portions, and including an elongated optical waveguide on a back surface of the insulation layer optically coupled with the optical elements, and having a light signal transmission core. Further, an electrically conductive dummy pattern is provided on the front surface of the insulation layer in the interconnection portion for reinforcing the interconnection portion. The electrically conductive dummy pattern reinforces the interconnection portion to protect the waveguide from bending and twisting, while ensuring the flexibility of the interconnection portion. This suppresses increase in light transmission loss.

Abstract translation: 本发明的光电混合基板包括：分别设置在细长绝缘层的相对端部上的光电模块部分，并且包括第一导电图案的第一电布线和设置在绝缘层的前表面上的光学元件 ; 以及设置在从光电模块部分延伸的绝缘层的一部分上的互连部分，并且在与光学元件光耦合的绝缘层的背面上包括细长光波导，并具有光信号传输芯。 此外，在互连部分中的绝缘层的前表面上设置导电虚设图案，用于加强互连部分。 导电虚设图案加强了互连部分，以保护波导不弯曲和扭转，同时确保互连部分的柔性。 这抑制了光传输损耗的增加。

公开(公告)号：US09398686B2

公开(公告)日：2016-07-19

申请号：US14454850

申请日：2014-08-08

Applicant: Samsung Display Co., LTD.

Inventor： Ki-Hae Shin ,  Jeong-Hun Go ,  Hee-Un Ku ,  Young-Sun Kim ,  Hoe-Seok Na

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/36 ,  H01L23/498 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32

CPC classification number: H05K1/028 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/189 ,  H05K3/282 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/053 ,  H05K2201/09154 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/09727 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/1147 ,  H01L2924/00

Abstract: A tape package includes a base substrate including a signal transmitting area and a protruding area protruded from the signal transmitting area, an integrated circuit chip mounted on the base substrate, and a lead line disposed on the base substrate and including a first portion electrically connected with the integrated circuit chip, a second portion electrically connected with the first portion and extending in a first direction, and a third portion electrically connected with the second portion and extending in a second direction crossing the first direction.

Abstract translation: 一种带包装，包括：基底基板，包括信号传输区域和从信号传输区域突出的突出区域;安装在基底基板上的集成电路芯片;以及设置在基底基板上的引线， 集成电路芯片，与第一部分电连接并沿第一方向延伸的第二部分，以及与第二部分电连接并沿与​​第一方向交叉的第二方向延伸的第三部分。

公开(公告)号：US20160192478A1

公开(公告)日：2016-06-30

申请号：US14583235

申请日：2014-12-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Shu-Wei KUO ,  Kuo-Lung LO ,  Cheng-Che WU ,  Chen-Chu TSAI

IPC: H05K1/02

CPC classification number: H05K1/0281 ,  H05K1/189 ,  H05K3/007 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/2009 ,  H05K2203/1316

Abstract: According to embodiments of the disclosure, a flexible electronic device is provided. The flexible electronic device includes a flexible substrate, at least one component and at least one stress buffer. The component may be disposed on the flexible substrate and having a lateral surface. The stress buffer may be disposed adjacent to the lateral surface of the component and has a stiffness which is getting larger toward the component.

Abstract translation: 根据本公开的实施例，提供了一种灵活的电子设备。 柔性电子器件包括柔性衬底，至少一个部件和至少一个应力缓冲器。 该部件可以设置在柔性基板上并且具有侧面。 应力缓冲器可以布置成与部件的侧表面相邻，并且具有朝向部件越来越大的刚度。

公开(公告)号：US09351409B2

公开(公告)日：2016-05-24

申请号：US13960123

申请日：2013-08-06

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Hsueh-Ping Chien ,  Jun-Chung Hsu

IPC: H05K3/00 ,  H05K3/40 ,  H05K3/46 ,  H05K3/22

CPC classification number: H05K3/4682 ,  H05K3/007 ,  H05K3/22 ,  H05K2201/2009 ,  H05K2203/0165 ,  H05K2203/0169 ,  H05K2203/162

Abstract: A method of manufacturing a thin support package structure includes the steps of: preparing a support plate formed with a plurality of grooves adjacent to an outer rim thereof, forming a releasing material layer on the support plate; forming a first circuit layer on the releasing material layer so as to form a thin circuit board; forming a dielectric layer on the releasing material layer; forming a plurality of openings in the dielectric layer; forming a second circuit layer on the dielectric layer; forming connection plugs by filling the openings; forming a solder mask on the dielectric layer; forming a plurality of notches on the lower surface of the support plate to communicate with the grooves, respectively; and removing the central part of the support plate between the notches and the central part of the releasing material layer on the support plate.

Abstract translation: 制造薄支撑包装结构的方法包括以下步骤：制备形成有与其外缘相邻的多个槽的支撑板，在支撑板上形成释放材料层; 在所述释放材料层上形成第一电路层以形成薄电路板; 在释放材料层上形成介电层; 在介电层中形成多个开口; 在所述电介质层上形成第二电路层; 通过填充开口形成连接插头; 在电介质层上形成焊料掩模; 在所述支撑板的下表面上分别形成多个凹槽以与所述凹槽连通; 并且在支撑板上的切口和释放材料层的中心部分之间移除支撑板的中心部分。

公开(公告)号：US09332643B2

公开(公告)日：2016-05-03

申请号：US13844501

申请日：2013-03-15

Applicant: INTEL CORPORATION

Inventor： Sanka Ganesan ,  Timothy M. Swettlen ,  Gary B. Long ,  Donald T. Tran ,  Jill D. Murfin ,  David I. Amir

IPC: H05K1/00 ,  H05K1/14 ,  H05K3/36

CPC classification number: H01R43/0249 ,  H01R43/205 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/144 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K2201/2009

Abstract: Stacked flex cable assemblies and their manufacture are described. One assembly includes a first flex cable and a second flex cable electrically coupled to the first flex cable. The assembly also includes a connector electrically coupled to the first flex cable. The first flex cable is positioned between the connector and the second flex cable. Other embodiments are described and claimed.

Abstract translation: 描述了堆叠的柔性电缆组件及其制造。 一个组件包括电耦合到第一柔性电缆的第一柔性电缆和第二柔性电缆。 组件还包括电连接到第一柔性电缆的连接器。 第一柔性电缆位于连接器和第二柔性电缆之间。 描述和要求保护其他实施例。

公开(公告)号：US09324678B2

公开(公告)日：2016-04-26

申请号：US13996498

申请日：2011-12-20

Applicant: Sanka Ganesan ,  Ram S. Viswanath

Inventor： Sanka Ganesan ,  Ram S. Viswanath

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/40 ,  H01L23/00 ,  H01R12/62 ,  H05K3/36 ,  H01L23/498 ,  H01B7/04 ,  H05K1/14

CPC classification number: H01R12/79 ,  H01B7/04 ,  H01L23/3675 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/72 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01R12/62 ,  H05K1/142 ,  H05K1/147 ,  H05K3/361 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2201/10681 ,  H05K2201/2009 ,  H01L2224/0401

Abstract: An integrated circuit package is presented. In an embodiment, the integrated circuit package has contact pads formed on the top side of a package substrate, a die electrically attached to the contact pads, and input/output (I/O) pads formed on the top side of the package substrate. The I/O pads are electrically connected to the contact pads. The integrated circuit package also includes a flex cable receptacle electrically connected to the I/O pads on the top side of the package substrate. The flex cable receptacle is non-compressively attachable to a flex cable connector and includes receptacle connection pins electrically connected to the I/O pads.

Abstract translation: 介绍了一种集成电路封装。 在一个实施例中，集成电路封装具有形成在封装基板的顶侧上的接触焊盘，电连接到接触焊盘的管芯，以及形成在封装基板的顶侧上的输入/输出（I / O）焊盘。 I / O焊盘电连接到接触焊盘。 集成电路封装还包括电连接到封装衬底的顶侧上的I / O焊盘的挠性电缆插座。 柔性电缆插座不可压缩地附接到柔性电缆连接器，并且包括电连接到I / O焊盘的插座连接引脚。