公开(公告)号：US20110075384A1

公开(公告)日：2011-03-31

申请号：US12569871

申请日：2009-09-29

Applicant: Kyle H. Yeates

Inventor： Kyle H. Yeates

IPC: H05K5/00 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/1461 ,  H05K1/141 ,  H05K1/147 ,  H05K1/182 ,  H05K1/189 ,  H05K3/222 ,  H05K3/4691 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/09781 ,  H05K2201/10409 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Sensitive electronic components can be mounted on a printed circuit board within an electronic device. To isolate a sensitive component from stresses that may arise during an unintended impact event, the electronic component can be isolated using a groove in the printed circuit board. The electronic component may be mounted to a component mounting region using solder balls. The component mounting region may be surrounded on some or all sides by the groove. Flex circuit structures that bridge the groove or a portion of the rigid printed circuit board may be used to hold the component mounting region in place. The flex circuit structures may be provided in the form of separate structures or may be provided as an integral portion of the printed circuit board.

Abstract translation: 敏感电子部件可以安装在电子设备内的印刷电路板上。 为了将敏感元件与在非预期的冲击事件期间可能出现的应力隔离，可以使用印刷电路板中的凹槽来隔离电子部件。 电子部件可以使用焊球安装到部件安装区域。 部件安装区域可以在一些或所有侧面被凹槽包围。 桥接凹槽或刚性印刷电路板的一部分的柔性电路结构可用于将部件安装区域保持在适当位置。 柔性电路结构可以以单独结构的形式提供，或者可以设置为印刷电路板的整体部分。

公开(公告)号：US20110048619A1

公开(公告)日：2011-03-03

申请号：US12823946

申请日：2010-06-25

Applicant: Erwin Rinaldo Meinders ,  Gerwin Hermanus Gelinck

Inventor： Erwin Rinaldo Meinders ,  Gerwin Hermanus Gelinck

IPC: B32B38/00 ,  B32B38/10

CPC classification number: H05K3/4638 ,  H05K1/0393 ,  H05K3/4069 ,  H05K3/4635 ,  H05K2201/051 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2203/0108 ,  H05K2203/0228 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T156/1039

Abstract: The invention relates to a method of aligning a flexible foil sheet having a general first foil sheet length direction to form stacked foil sheet layers on a reel having a reel diameter. The method comprises providing multiple alignment markers in the foil sheet. distanced conform the reel diameter and each having an mark length direction transverse to the first foil sheet length direction, to form protrusions and corresponding recesses on opposite faces of the foil sheet; winding the foil sheet on the reel in the first foil sheet length direction of the foil sheet; and co-aligning the alignment markers to have protrusions of one mark matching with a recess of another mark, so as to block relative movement of the stacked foil sheet layers in the first foil sheet length direction. Preferably, the foil sheet layers are provided with device functionality to form a stacked foil sheet layered device.

Abstract translation: 本发明涉及一种对准具有一般第一箔片长度方向的柔性箔片的方法，以在具有卷轴直径的卷轴上形成叠层的箔片层。 该方法包括在箔片中提供多个对准标记。 间距适应卷轴直径并且每个具有横向于第一箔片长度方向的标记长度方向，以在箔片的相对面上形成突起和相应的凹槽; 在箔片的第一箔片长度方向上将箔片卷绕在卷轴上; 并且使对准标记共同对准具有与另一标记的凹部匹配的一个标记的突起，以阻止层叠的箔片层在第一箔片长度方向上的相对移动。 优选地，箔片层具有器件功能以形成层叠的箔片层状器件。

公开(公告)号：US07897199B2

公开(公告)日：2011-03-01

申请号：US12109223

申请日：2008-04-24

Applicant: Tso-Hung Yeh ,  Hung-Yi Chang ,  Chih-Kang Yang

Inventor： Tso-Hung Yeh ,  Hung-Yi Chang ,  Chih-Kang Yang

IPC: H05K3/00

CPC classification number: H05K3/241 ,  C25D7/12 ,  C25D17/00 ,  C25D17/008 ,  H05K1/0393 ,  H05K3/242 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2203/1545

Abstract: A method for plating a FPCB base board, comprising the steps of: providing a FPCB base board comprising a sprocket region; and placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board.

Abstract translation: 一种用于电镀FPCB基板的方法，包括以下步骤：提供包括链轮区域的FPCB基板; 并且在与FPCB基板的链轮区域空间相对的绝缘屏蔽板上，限制形成在FPCB基板的链轮区域上的镀层的厚度。

公开(公告)号：US07896692B2

公开(公告)日：2011-03-01

申请号：US12467185

申请日：2009-05-15

Applicant: Adam W. Gibson ,  Jeffrey Alan Poulsen

Inventor： Adam W. Gibson ,  Jeffrey Alan Poulsen

IPC: H01R13/60

CPC classification number: H05K1/0225 ,  H05K1/0216 ,  H05K1/0228 ,  H05K1/024 ,  H05K3/0044 ,  H05K2201/0792 ,  H05K2201/09063 ,  H05K2201/10189 ,  Y10T29/49124

Abstract: A method of improving electrical isolation between a first circuit and a second circuit sharing a common substrate having an effective dielectric constant greater than that of air. The first and second circuits are spaced apart and separated from one another by an intermediate portion of the substrate. The method includes removing a portion of the intermediate portion to replace the portion removed with air thereby reducing the effective dielectric constant of the intermediate portion. By reducing the effective dielectric constant of the intermediate portion, electrical isolation between the first and second circuits is improved thereby reducing crosstalk between the first and second circuits. In particular implementations, the method may be used to reduce alien crosstalk between adjacent communication outlets in a patch panel.

Abstract translation: 一种改善第一电路和共享具有大于空气的有效介电常数的公共衬底的第二电路之间的电隔离的方法。 第一和第二电路间隔开并且通过衬底的中间部分彼此分离。 该方法包括去除中间部分的一部分以取代用空气除去的部分，从而降低中间部分的有效介电常数。 通过降低中间部分的有效介电常数，改善第一和第二电路之间的电隔离，从而减少第一和第二电路之间的串扰。 在具体的实现中，该方法可以用于减少接线板中的相邻通信插座之间的外来串扰。

公开(公告)号：US20110024165A1

公开(公告)日：2011-02-03

申请号：US12606462

申请日：2009-10-27

Applicant: Thomas A. Olden ,  Walter Wrigglesworth

Inventor： Thomas A. Olden ,  Walter Wrigglesworth

IPC: H05K1/09 ,  H05K3/00 ,  H05K1/16

CPC classification number: H05K1/0366 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0014 ,  H05K3/4632 ,  H05K3/465 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2203/302 ,  Y10T29/49124

Abstract: A composite interconnect assembly includes a body structure formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions are provided such that the conductive traces are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like.

Abstract translation: 复合互连组件包括由其中嵌入有一个或多个导电迹线（例如铜或铜合金）的复合材料（例如，碳石墨材料）形成的主体结构。 提供一个或多个接触区域，使得导电迹线被暴露并且被配置为机械地和电连接到一个或多个电子部件。 身体结构可以具有各种形状，包括平面，圆柱形，圆锥形等。

公开(公告)号：US07872702B2

公开(公告)日：2011-01-18

申请号：US11798213

申请日：2007-05-11

Applicant: Chih-Hsien Lien ,  Chin-Wen Lo ,  Yu-Jen Tsai

Inventor： Chih-Hsien Lien ,  Chin-Wen Lo ,  Yu-Jen Tsai

IPC: G02F1/1333

CPC classification number: H05K1/189 ,  G02F1/13452 ,  H05K1/0393 ,  H05K2201/046 ,  H05K2201/09063

Abstract: The present invention provides a liquid crystal display module including housing, a flexible printed circuit board and a plurality of electric devices. The housing has at least a receiving notch. The flexible printed circuit board has a flexible substrate and at least an extension substrate projected from the flexible substrate to mount electric devices thereon. The extension substrate may be bent and received in the receiving notch of the housing to achieve the purpose of mounting more electric device on the flexible printed circuit board without having to increase the size of module.

Abstract translation: 本发明提供一种液晶显示模块，包括壳体，柔性印刷电路板和多个电气装置。 外壳至少有一个接收口。 柔性印刷电路板具有柔性基板和至少一个从柔性基板突出的延伸基板，以在其上安装电气设备。 延伸基板可以弯曲并容纳在壳体的接收凹口中，以实现将更多电气装置安装在柔性印刷电路板上的目的，而不必增加模块的尺寸。

公开(公告)号：US20100328638A1

公开(公告)日：2010-12-30

申请号：US12815222

申请日：2010-06-14

Applicant: SUSUMU ISHIDA ,  Shohei Hata

Inventor： SUSUMU ISHIDA ,  Shohei Hata

IPC: G03B27/54 ,  H01L33/62 ,  H01L33/64 ,  H01L33/48

CPC classification number: H01L33/64 ,  G03F7/7005 ,  G03F7/70858 ,  H01L25/13 ,  H01L33/641 ,  H01L2224/48091 ,  H05B3/0038 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/0061 ,  H05K2201/0209 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10977 ,  H01L2924/00014

Abstract: This invention provides a structurally-simple LED light source that is capable of preventing temperature variations among its multiple LED elements arranged densely on its LED-mounting substrate and also improving the heat release capabilities of the substrate by comprising an LED light source with: a plurality of LED elements each of which is formed by connecting an LED chip to electrodes formed on a ceramic substrate; an LED-mounting substrate on which to mount the plurality of LED elements, the LED-mounting substrate having through holes therein; and a heat sink plate for releasing heat from the LED-mounting substrate, wherein a thermally conductive resin is present between the LED-mounting substrate and the heat sink plate and wherein part of the thermally conductive resin protrudes from the through holes of the LED-mounting substrate and covers the top surface of the LED-mounting substrate on which the plurality of LED elements are mounted, so that the part of the thermally conductive resin is in contact with the plurality of LED elements.

Abstract translation: 本发明提供一种结构简单的LED光源，其能够防止在其LED安装基板上密集布置的多个LED元件之间的温度变化，并且还通过包括具有多个LED的LED光源来提高基板的散热能力 的LED元件，每个LED元件通过将LED芯片连接到形成在陶瓷基板上的电极而形成; 在其上安装多个LED元件的LED安装基板，其中具有通孔的LED安装基板; 以及用于从LED安装基板释放热量的散热板，其中在LED安装基板和散热板之间存在导热树脂，并且其中部分导热树脂从LED-安装基板的通孔突出， 安装基板并覆盖其上安装有多个LED元件的LED安装基板的顶表面，使得导热树脂的一部分与多个LED元件接触。

公开(公告)号：US07859851B2

公开(公告)日：2010-12-28

申请号：US11296265

申请日：2005-12-08

Applicant: Sang-chul Shin ,  Byoung-gyou Choi ,  Jeong-seon Kim ,  Jun-young Lee

Inventor： Sang-chul Shin ,  Byoung-gyou Choi ,  Jeong-seon Kim ,  Jun-young Lee

IPC: H05K1/00

CPC classification number: H05K1/0272 ,  G11B33/121 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/0061 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/09063

Abstract: A flexible printed circuit board and a bracket structure for the hard disk drive. The flexible printed circuit board includes a base layer, a circuit layer provided on the base layer, a cover layer provided on the circuit layer, and a filter layer interposed between the base layer and the circuit layer. Also, the bracket structure includes a flexible printed circuit board for driving an actuator, a bracket connected to the flexible printed circuit board, and a filter interposed between the flexible printed circuit board and the bracket. Thermal asperity caused by fine particles in the hard disk drive is prevented so that performance deterioration of the hard disk drive is prevented and reliability thereof is improved.

Abstract translation: 用于硬盘驱动器的柔性印刷电路板和支架结构。 柔性印刷电路板包括基底层，设置在基底层上的电路层，设置在电路层上的覆盖层，以及插入在基底层和电路层之间的滤色层。 此外，支架结构包括用于驱动致动器的柔性印刷电路板，连接到柔性印刷电路板的支架以及插在柔性印刷电路板和支架之间的滤光器。 防止由硬盘驱动器中的微粒导致的热不均匀性，从而防止硬盘驱动器的性能恶化并提高其可靠性。

公开(公告)号：US20100315791A1

公开(公告)日：2010-12-16

申请号：US12758661

申请日：2010-04-12

Applicant: Hidetoshi Hatakeyama

Inventor： Hidetoshi Hatakeyama

IPC: H05K1/18 ,  H05K5/00

CPC classification number: H05K3/0052 ,  H05K1/0269 ,  H05K3/28 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/0989 ,  H05K2201/09909

Abstract: According to an aspect of the present invention, there is provided a printed wiring board having a first surface and a second surface provided on a side opposite to the first surface, the printed wiring board including: a product portion on which electronic components are mounted; an end portion provided to have a gap with respect to the product portion; and a connection portion which connects the product portion and the end portion to each other; a first coating composition applied on the first surface of the product portion; and a second coating composition applied on the first surface of the end portion and the first surface of the connection portion so as to be separated from the first coating composition.

Abstract translation: 根据本发明的一个方面，提供了一种印刷线路板，其具有设置在与第一表面相对的一侧上的第一表面和第二表面，印刷线路板包括：产品部分，其上安装电子部件; 设置成相对于所述产品部分具有间隙的端部; 以及将产品部分和端部部分彼此连接的连接部分; 施加在产品部分的第一表面上的第一涂料组合物; 以及施加在所述端部的所述第一表面和所述连接部的所述第一表面上以与所述第一涂料组合物分离的第二涂料组合物。

公开(公告)号：US20100294556A1

公开(公告)日：2010-11-25

申请号：US12458902

申请日：2009-07-27

Applicant: Chih-Heng Chuo ,  Gwun-Jin Lin ,  Kuo-Fu Su

Inventor： Chih-Heng Chuo ,  Gwun-Jin Lin ,  Kuo-Fu Su

IPC: H05K1/00

CPC classification number: H05K1/028 ,  H05K2201/052 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/10598

Abstract: Disclosed is a flexible-circuit flat cable with cluster section, including at least one cluster section, at least one slip section, a first connection section, and a second connection section. The first connection section is set at a first end of the cluster section. The slip section has a first end connected to a second end of the cluster section and a second end at which the second connection section is set. The four sections are all provided with a plurality of signal transmission lines corresponding to and connecting each other. The first connection section and the second connection section are selectively provided with a connector or a plugging end. Further, the cluster section includes a cluster structure composed of a plurality of clustered flat cable components that are formed by slitting in a direction parallel to extension direction of a flexible circuit board to impose free and independent flexibility for bending to each clustered flat cable component.

Abstract translation: 公开了一种具有集束部分的柔性电路扁平电缆，包括至少一个集束部分，至少一个滑动部分，第一连接部分和第二连接部分。 第一连接部分设置在集群部分的第一端。 滑动部分具有连接到集束部分的第二端的第一端和设置第二连接部分的第二端。 这四个部分都具有对应于并彼此连接的多个信号传输线。 第一连接部分和第二连接部分选择性地设置有连接器或插塞端。 此外，集群部包括由多个群集扁平电缆部件组成的集束结构，该多个集束扁平电缆部件通过沿与柔性电路板的延伸方向平行的方向分切形成，以对每个集束扁平电缆部件施加自由且独立的弯曲。