公开(公告)号：US20120195015A1

公开(公告)日：2012-08-02

申请号：US13016701

申请日：2011-01-28

Applicant: Eli Holzman ,  Paul Brian Hafeli ,  Robert Michael Sterns

Inventor： Eli Holzman ,  Paul Brian Hafeli ,  Robert Michael Sterns

IPC: H05K7/12 ,  H05K3/34 ,  H05K3/30

CPC classification number: H05K3/3436 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/52 ,  H05K2201/0311 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

Abstract: In accordance with the teaching of the present invention, a system and method for securing a ball grid array to a printed wire board is provided. In a particular embodiment, a ball grid array comprises one or more balls configured to attach to a spring comprising one or more turns. In addition, there is a spacer plate configured to align and separate the springs, a soldering aid configured to align solder on the printed wire board and a printed wire board configured with conductive pads to attach to the ball grid array via the springs.

Abstract translation: 根据本发明的教导，提供了一种用于将球栅阵列固定到印刷线板的系统和方法。 在特定实施例中，球栅阵列包括一个或多个球，其被配置为附接到包括一个或多个匝的弹簧。 此外，存在配置成对准和分离弹簧的间隔板，配置成将印刷线路板上的焊料对准的焊接辅助板和配置有导电焊盘的印刷线路板，以经由弹簧附接到球栅阵列。

公开(公告)号：US20120024584A1

公开(公告)日：2012-02-02

申请号：US12844109

申请日：2010-07-27

Applicant: Chang-Ming Lee ,  Wen-Fang Liu ,  Shih-Jung Huang ,  Ling-Kai Su

Inventor： Chang-Ming Lee ,  Wen-Fang Liu ,  Shih-Jung Huang ,  Ling-Kai Su

IPC: H05K1/11 ,  H01R43/16

CPC classification number: H05K3/4092 ,  H05K3/4007 ,  H05K2201/0311 ,  Y10T29/49204

Abstract: A method of manufacturing a connector is provided. Firstly, a substrate having a first surface, a second surface opposite to the first surface and a through hole is provided. Next, a first conductive layer covering the inside wall of the through hole is formed on the substrate. Then, a filler is filled in the through hole to form a filler post. Next, a conductive elastic cantilever is formed over the first surface and electrically connected to the first conductive layer. Then, a gold layer is formed on the conductive elastic cantilever and over the first surface. A solder ball electrically connected to the first conductive layer is formed over the second surface.

Abstract translation: 提供一种制造连接器的方法。 首先，提供具有第一表面，与第一表面相对的第二表面和通孔的基板。 接着，在基板上形成覆盖贯通孔的内壁的第一导电层。 然后，在通孔中填充填料以形成填料柱。 接下来，在第一表面上形成导电弹性悬臂，并电连接到第一导电层。 然后，在导电弹性悬臂上形成金层，并在第一表面上形成金层。 电连接到第一导电层的焊球形成在第二表面上。

公开(公告)号：US08102657B2

公开(公告)日：2012-01-24

申请号：US12234581

申请日：2008-09-19

Applicant: Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

Inventor： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

IPC: H05K1/14

CPC classification number: G06F1/1632 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01R12/57 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/326 ,  H05K3/4046 ,  H05K5/0278 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2203/1316 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/53209 ,  H01L2224/85 ,  H01L2924/00014

Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB device 101 includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. A single-shot molding process is used to form both an upper housing portion on the upper PCB surface that includes ribs extending between adjacent contact pads, and a lower molded housing portion that is formed over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs.

Abstract translation: 双重个性扩展USB（EUSB）系统支持使用扩展的9针EUSB插座的USB和EUSB存储卡。 每个EUSB装置101包括PCBA，PCBA具有布置在PCB的上侧上的四个标准USB金属接触垫，以及延伸通过PCB中限定的开口的多个扩展用途接触弹簧。 使用单次成型工艺来形成上PCB表面上的上壳体部分，其包括在相邻接触垫之间延伸的肋，以及形成在无源部件上的下模制壳体部分和设置在下PCB表面上的IC管芯 。 使用SMT方法安装无源部件，并使用COB方法安装IC管芯。 扩展的9针EUSB插座包括通过标准USB金属触点和接触弹簧与PCBA通信的标准USB触点和扩展使用触点。

公开(公告)号：US08076769B2

公开(公告)日：2011-12-13

申请号：US12275848

申请日：2008-11-21

Applicant: Takao Nishimura ,  Yoshikazu Kumagaya

Inventor： Takao Nishimura ,  Yoshikazu Kumagaya

IPC: H01L23/48

CPC classification number: H01L23/16 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/573 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/10152 ,  H01L2224/10165 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/8014 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0275 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/0311 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/3512 ,  H01L2924/20751

Abstract: A semiconductor device includes a semiconductor element; a plate member disposed opposite to an electronic-circuit forming portion of the semiconductor element; and an elastic body arranged in a compressed state between the semiconductor element and the plate member, wherein the elastic body includes at least one first protruding portion at one end in an extension direction of the elastic body, the first protruding portion being formed opposite to the electronic-circuit forming portion of the semiconductor element, and the semiconductor element and the plate member are fastened by an adhesive agent.

Abstract translation: 半导体器件包括半导体元件; 与半导体元件的电子电路形成部分相对设置的板构件; 以及在所述半导体元件和所述板状部件之间以压缩状态配置的弹性体，其中，所述弹性体在所述弹性体的延伸方向的一端具有至少一个第一突出部，所述第一突出部与所述弹性体相对地形成 半导体元件的电子电路形成部分，并且半导体元件和板构件通过粘合剂紧固。

公开(公告)号：US20110284263A1

公开(公告)日：2011-11-24

申请号：US13145267

申请日：2010-11-04

Applicant: Hideo Yumi

Inventor： Hideo Yumi

IPC: H01B5/06

CPC classification number: H01R13/2407 ,  H01R4/64 ,  H01R12/57 ,  H01R12/718 ,  H01R13/2428 ,  H01R2101/00 ,  H05K3/34 ,  H05K7/142 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/2036 ,  Y02P70/611

Abstract: A conductive component includes a tubular body having at least one of at least one through-hole which penetrates the tubular body from outside to inside thereof; and at least one notch which is cut in from an edge of the tubular body, which are formed at least one predetermined portion on the tubular body. The tubular body includes a first portion, which includes a solder joint portion, and a second portion, which includes a contact portion. The first portion and the second portion are located on the opposite sides from one another with the at least one predetermined portion sandwiched therebetween. The tubular body further includes at least one spring portion which includes the at least one predetermined portion.

Abstract translation: 导电部件包括管状体，其具有至少一个从外部至内部穿过管状体的通孔中的至少一个; 以及从管状体的边缘切割出的至少一个凹口，其形成在管状体上的至少一个预定部分。 管体包括包括焊接部分的第一部分和包括接触部分的第二部分。 第一部分和第二部分彼此相对设置，其中至少一个预定部分夹在其间。 管状体还包括至少一个包括至少一个预定部分的弹簧部分。

公开(公告)号：US20110195598A1

公开(公告)日：2011-08-11

申请号：US13123029

申请日：2009-10-07

Applicant: Augusto P. Panella ,  Elliot C. Baines ,  Jeng-De Lin

Inventor： Augusto P. Panella ,  Elliot C. Baines ,  Jeng-De Lin

IPC: H01R13/66 ,  H01R3/00

CPC classification number: H04Q1/136 ,  H01R4/2433 ,  H01R13/2421 ,  H01R13/4538 ,  H01R13/465 ,  H01R13/6473 ,  H01R13/6616 ,  H01R13/6625 ,  H01R24/64 ,  H01R2201/04 ,  H04L41/12 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K3/326 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/09445 ,  H05K2201/10189

Abstract: A termination unit (144) for use with a system that permits the monitoring of a computer network to perform network inventories. The termination unit takes the form of a cap that engages the termination face of a network jack and has a sensing circuit (246) integrated therewith so that, once engaged with the jack, the sensing circuit is connected to two terminals of the jack. The sensing circuit may include a resistor, capacitor or inductor, any of which provide a known sensing value that is different than a sensed value of an end-user device used on the network, but less than infinity so that the system senses when an end-user device is connected to or disconnected from the network.

Abstract translation: 一种与允许监视计算机网络执行网络清单的系统一起使用的终端单元（144）。 终端单元采用与网络插座的端接面接合的帽的形式，并且具有与其一体化的感测电路（246），使得一旦与插座接合，感测电路连接到插座的两个端子。 感测电路可以包括电阻器，电容器或电感器，其中任一个提供与网络上使用的终端用户设备的感测值不同但已经小于无穷远的已知感测值，使得系统感测何时结束 用户设备连接到网络或与网络断开连接。

公开(公告)号：US07990730B2

公开(公告)日：2011-08-02

申请号：US12061913

申请日：2008-04-03

Applicant: Chun-Fang Cheng

Inventor： Chun-Fang Cheng

IPC: G02B7/02 ,  H04N1/04

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L2924/0002 ,  H05K1/183 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10121 ,  H05K2201/10727 ,  H01L2924/00

Abstract: An imaging device includes a lens module and a printed circuit board. The lens module includes a substrate with a lens unit and an imaging sensor mounted on a same side thereof. The substrate defines a groove therein. The printed circuit board defines a recessed portion accommodating the substrate therein, and includes a locking member engaging in the groove to detachably secure the lens module thereto.

Abstract translation: 成像装置包括透镜模块和印刷电路板。 透镜模块包括具有透镜单元的基板和安装在其同一侧上的成像传感器。 衬底在其中限定凹槽。 印刷电路板限定在其中容纳基板的凹部，并且包括接合在凹槽中的锁定构件，以可拆卸地将透镜模块固定到其上。

公开(公告)号：US20110090691A1

公开(公告)日：2011-04-21

申请号：US12579946

申请日：2009-10-15

Applicant: Joshua Josiah Markle ,  Robert Edward Higley

Inventor： Joshua Josiah Markle ,  Robert Edward Higley

IPC: F21S4/00 ,  F21V1/00 ,  H01J9/24

CPC classification number: F21K9/00 ,  F21V19/0055 ,  F21V29/76 ,  F21V29/763 ,  F21V29/85 ,  H01L25/0753 ,  H01L2224/48227 ,  H01L2924/19107 ,  H05K1/021 ,  H05K3/0058 ,  H05K3/32 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09163 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10409

Abstract: Lamp assemblies and methods of making the same are provided. Such a lamp assembly can include a heat sink and a light-emitting diode package that can be mounted to the heat sink. The light-emitting diode package can include a substrate with a top surface and bottom surface, a lens, and electrical contacts on the surface of the substrate. The lamp assembly can also include a printed circuit board with a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface. The printed circuit board can have electrical contacts thereon for electrical connection with the electrical contacts of the light-emitting diode package. The substrate of the light-emitting diode package can engage the opening of the printed circuit board to mechanically couple the light-emitting diode package to the printed circuit board. When assembled, a bottom surface of the substrate can be flush and aligned with a rear surface of the printed circuit board.

Abstract translation: 提供灯组件及其制造方法。 这种灯组件可以包括可以安装到散热器的散热器和发光二极管封装。 发光二极管封装可以包括具有顶表面和底表面的基板，透镜以及在基板表面上的电触点。 灯组件还可以包括具有面表面的印刷电路板，与表面相对的后表面和从表面延伸到后表面的开口。 印刷电路板可以在其上具有电接触以与发光二极管封装的电触点电连接。 发光二极管封装的基板可以接合印刷电路板的开口以将发光二极管封装机械耦合到印刷电路板。 当组装时，衬底的底表面可以与印刷电路板的后表面齐平并对齐。

公开(公告)号：US20110050386A1

公开(公告)日：2011-03-03

申请号：US12899941

申请日：2010-10-07

Applicant: Roberto SCHLENKER ,  Michael NAGEL ,  Juergen MARTIN

Inventor： Roberto SCHLENKER ,  Michael NAGEL ,  Juergen MARTIN

IPC: H01H37/76

CPC classification number: H01H37/761 ,  H05K1/0201 ,  H05K1/0263 ,  H05K3/222 ,  H05K3/341 ,  H05K3/3415 ,  H05K2201/0311 ,  H05K2201/10181 ,  H05K2201/10265

Abstract: An electronic circuit includes a conductor path on a circuit board, and at least one SMD component, electronic component and/or electromechanical component mounted on the circuit board and connected to the conductor path. A circuit connection is established via a soldered joint and a spring-loaded or stressed springy contact bridge that provides fuse protection. In the event of excessive power dissipation or high temperature, the soldered joint melts or softens and the contact bridge springs open to interrupt the circuit.

Abstract translation: 电子电路包括电路板上的导体路径和安装在电路板上并连接到导体路径的至少一个SMD组件，电子组件和/或机电组件。 通过焊接接头和弹簧加载或应力弹性接触桥建立电路连接，提供保险丝保护。 在功耗过高或温度过高的情况下，焊接接头熔化或软化，接触桥弹簧打开以中断电路。

公开(公告)号：US07869675B2

公开(公告)日：2011-01-11

申请号：US12733400

申请日：2008-08-28

Applicant: Youji Urano

Inventor： Youji Urano

IPC: G02B6/26

CPC classification number: H01L33/507 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/505 ,  H01L33/52 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/141 ,  H05K1/184 ,  H05K3/0061 ,  H05K2201/0311 ,  H05K2201/048 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10962 ,  Y10S385/901 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device, in which an encapsulation resin is disposed at a space confined between an optical member and a mounting substrate. This encapsulation resin is possibly made free from a void-generation therein. In this light emitting device, the optical member can be precisely positioned. An electrode disposed outside a color conversion member is possibly free from an improper solder connection. A ring gate is formed on the top surface of the mounting substrate outside of the optical member, and acts to position the color conversion member. The ring gate acts to prevent an overflowing liquid encapsulation resin from flowing to the electrode provided. The ring gate is provided with a plurality of centering projections which are spaced circumferentially along its inner circumference to position the color conversion member.

Abstract translation: 一种发光器件，其中密封树脂设置在限制在光学构件和安装衬底之间的空间。 这种封装树脂可能没有其中的空隙产生。 在该发光装置中，可以精确地定位光学构件。 设置在颜色转换构件外侧的电极可能没有不正确的焊接连接。 环形门形成在安装基板的顶面上，在光学构件的外部，并且用于定位颜色转换构件。 环形栅极用于防止溢出的液体封装树脂流到所提供的电极。 环形门设置有多个定心突起，沿着其内圆周沿圆周间隔定位，以定位颜色转换构件。