公开(公告)号：US20130033842A1

公开(公告)日：2013-02-07

申请号：US13649517

申请日：2012-10-11

Applicant: FURUKAWA ELECTRIC CO. LTD. ,  FURUKAWA AUTOMOTIVE SYSTEMS, INC.

Inventor： Toshitaka HARA ,  Kyosuke HASHIMOTO ,  Kiyonobu NOJI ,  Kyutaro ABE ,  Hiroyuki FUKAI ,  Naomi TAKAHASHI

IPC: H05K1/14 ,  B23K31/02 ,  B32B37/24

CPC classification number: H05K1/183 ,  H05K1/0271 ,  H05K1/141 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/1003

Abstract: The board has a transformer, choke coil and, for example, is used for a DC-DC converter such as for an automobile. At the board, a circuit conductor therein is exposed to outside at an electronic component mounting part, a printed board mounting part and a conductor part, and other portions are covered with resin to form an injection molded board, which installs an electronic component, etc. The printed board mounting part is a section that is provided for installing a printed board. A conductor part of the printed board and the conductor part of the printed board mounting part are joined via an electronic component by soldering, etc.

Abstract translation: 该板具有变压器，扼流线圈，例如用于汽车等DC-DC转换器。 在电路板上，其中的电路导体在电子部件安装部分，印刷电路板安装部分和导体部分暴露于外部，并且其它部分被树脂覆盖以形成安装电子部件等的注塑板 印刷电路板安装部分是用于安装印刷电路板的部分。 印刷电路板的导体部分和印刷电路板安装部分的导体部分通过焊接等电子部件接合。

公开(公告)号：US20130025925A1

公开(公告)日：2013-01-31

申请号：US13483830

申请日：2012-05-30

Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi

Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi

IPC: H05K1/11 ,  H05K3/36

CPC classification number: H05K3/4694 ,  H05K3/42 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/09145 ,  H05K2201/2072 ,  Y10T29/49126

Abstract: A wiring board has a first rigid wiring board having an accommodation portion, a second rigid wiring board accommodated in the accommodation portion, an insulation layer formed over the first rigid wiring board and the second rigid wiring board, and a joint conductor extending in a direction from a first surface of the first rigid wiring board to a second surface of the first rigid wiring board on the opposite side of the first surface of the first rigid wiring board such that the joint conductor is penetrating through the boundary between the first rigid wiring board and the second rigid wiring board and joining the first rigid wiring board and the second rigid wiring board.

Abstract translation: 布线基板具有容纳部的第一刚性布线板，容纳在容纳部中的第二刚性布线基板，形成在第一刚性布线基板和第二刚性布线基板上的绝缘层，以及沿着方向 从第一刚性布线板的第一表面到第一刚性布线板的与第一刚性布线板的第一表面相反的一侧的第二表面，使得接合导体穿过第一刚性布线板 和第二刚性布线板，并且连接第一刚性布线板和第二刚性布线板。

公开(公告)号：US20120195024A1

公开(公告)日：2012-08-02

申请号：US13501146

申请日：2010-09-09

Applicant: Hiroshi Kawaguchi ,  Isao Kajima

Inventor： Hiroshi Kawaguchi ,  Isao Kajima

IPC: G09F13/04 ,  H05K1/14

CPC classification number: H05K3/363 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09709

Abstract: Disclosed is a flexible circuit board connection structure that has a simple configuration, is inexpensive, and has superior connection reliability. The connection structure is a structure connecting a first flexible circuit board 40 and a second flexible circuit board 50 and is characterized in that a first through-hole 45 and a second through-hole 46 are formed in the first flexible circuit board 40, the second flexible circuit board 50 is inserted through the first through-hole 45 from the first surface 48 side of the first flexible circuit board 40 to the second surface 49 side of the same, and the second flexible circuit board 50, which has been inserted through to the second surface 49 side of the first flexible circuit board 40, is soldered to the first flexible circuit board 40 from the first surface 48 side of the first flexible circuit board 40 via the second through-hole 46.

Abstract translation: 公开了一种柔性电路板连接结构，其结构简单，价格便宜，连接可靠性优异。 连接结构是连接第一柔性电路板40和第二柔性电路板50的结构，其特征在于，第一柔性电路板40中形成有第一通孔45和第二通孔46，第二通孔 柔性电路板50通过第一通孔45从第一柔性电路板40的第一表面48侧插入到第二柔性电路板40的第二表面49侧，并且将第二柔性电路板50插入到 第一柔性电路板40的第二表面49侧经由第二通孔46从第一柔性电路板40的第一表面48侧被焊接到第一柔性电路板40。

公开(公告)号：US08027570B2

公开(公告)日：2011-09-27

申请号：US11642863

申请日：2006-12-21

Applicant: Tomokazu Sugamura ,  Masuo Ogawa

Inventor： Tomokazu Sugamura ,  Masuo Ogawa

IPC: H04N5/77

CPC classification number: H04N5/64 ,  B82Y20/00 ,  G11B31/00 ,  G11B33/10 ,  G11B33/12 ,  H04N21/42646 ,  H05K1/14 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0052 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/048

Abstract: A disk unit-integrated display capable of increase in conveyance efficiency and reduce in conveyance cost of a disk unit, a holding member and a first circuit board unitized with each other can be obtained. This disk unit-integrated display includes the disk unit having a drive portion, the holding member for supporting the disk unit, the first circuit board arranged between the disk unit and the holding member and having an opening at a position corresponding to the drive portion of the disk unit.

Abstract translation: 可以获得能够提高输送效率并降低盘单元，保持构件和彼此组合的第一电路板的输送成本的盘单元集成显示器。 该盘单元集成显示器包括具有驱动部分的盘单元，用于支撑盘单元的保持构件，布置在盘单元和保持构件之间的第一电路板，并且在与驱动部分的驱动部分相对应的位置处具有开口 磁盘单元。

公开(公告)号：US07972143B2

公开(公告)日：2011-07-05

申请号：US12364333

申请日：2009-02-02

Applicant: Dalibor Smejtek

Inventor： Dalibor Smejtek

IPC: H01R12/00

CPC classification number: H05K3/366 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/048 ,  H05K2201/09036 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2201/10484

Abstract: A printed circuit assembly includes a base printed circuit having a printed circuit receiving area and a plurality of electrical contacts provided on the printed circuit receiving area. The printed circuit assembly also includes a secondary printed circuit having a secondary substrate including a mating edge and a plurality of secondary contacts provided along the mating edge. The secondary printed circuit is mounted on the base printed circuit such that the mating edge of the secondary printed circuit is directly engaged with the base printed circuit at the printed circuit receiving area. Each of the secondary contacts is electrically connected to a corresponding one of the electrical contacts of the base printed circuit.

Abstract translation: 印刷电路组件包括具有印刷电路接收区域的基本印刷电路和设置在印刷电路接收区域上的多个电触点。 印刷电路组件还包括二次印刷电路，其具有包括配合边缘的辅助基板和沿着配合边缘设置的多个辅助触点。 二次印刷电路安装在基板印刷电路上，使得二次印刷电路的配合边缘与印刷电路接收区域的基本印刷电路直接接合。 每个次级触点电连接到基本印刷电路的相应的一个电触点。

公开(公告)号：US07869675B2

公开(公告)日：2011-01-11

申请号：US12733400

申请日：2008-08-28

Applicant: Youji Urano

Inventor： Youji Urano

IPC: G02B6/26

CPC classification number: H01L33/507 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/505 ,  H01L33/52 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/141 ,  H05K1/184 ,  H05K3/0061 ,  H05K2201/0311 ,  H05K2201/048 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10962 ,  Y10S385/901 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device, in which an encapsulation resin is disposed at a space confined between an optical member and a mounting substrate. This encapsulation resin is possibly made free from a void-generation therein. In this light emitting device, the optical member can be precisely positioned. An electrode disposed outside a color conversion member is possibly free from an improper solder connection. A ring gate is formed on the top surface of the mounting substrate outside of the optical member, and acts to position the color conversion member. The ring gate acts to prevent an overflowing liquid encapsulation resin from flowing to the electrode provided. The ring gate is provided with a plurality of centering projections which are spaced circumferentially along its inner circumference to position the color conversion member.

Abstract translation: 一种发光器件，其中密封树脂设置在限制在光学构件和安装衬底之间的空间。 这种封装树脂可能没有其中的空隙产生。 在该发光装置中，可以精确地定位光学构件。 设置在颜色转换构件外侧的电极可能没有不正确的焊接连接。 环形门形成在安装基板的顶面上，在光学构件的外部，并且用于定位颜色转换构件。 环形栅极用于防止溢出的液体封装树脂流到所提供的电极。 环形门设置有多个定心突起，沿着其内圆周沿圆周间隔定位，以定位颜色转换构件。

公开(公告)号：US07804695B2

公开(公告)日：2010-09-28

申请号：US12322924

申请日：2009-02-09

Applicant: Julian Thevenard ,  Dominique Lo Hine Tong ,  Ali Louzir ,  Corinne Nicolas ,  Christian Person ,  Jean-Philippe Coupez

Inventor： Julian Thevenard ,  Dominique Lo Hine Tong ,  Ali Louzir ,  Corinne Nicolas ,  Christian Person ,  Jean-Philippe Coupez

IPC: H05K1/11 ,  H01R12/16 ,  H01R12/04

CPC classification number: H01Q1/38 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/366 ,  H05K3/429 ,  H05K2201/048 ,  H05K2201/09336 ,  H05K2201/09781 ,  H05K2201/09854

Abstract: The present invention relates to an interconnection system of a first substrate (1) comprising at least one first transmission line (3) with a second substrate (10) comprising at least one second transmission line (11), the orientation of the first substrate with respect to the second substrate being arbitrary. The first substrate (1) comprises at least one metallized hole at one extremity of said first line and the second substrate (10) comprises a projecting element extending said second line and a ground saving, said projecting element being inserted into the metallized hole. The invention notably applies in the domain of microwaves and can interconnect a substrate comprising a printed antenna with a substrate receiving the processing circuits of the signal.

Abstract translation: 本发明涉及第一衬底（1）的互连系统，其包括至少一个第一传输线（3），第一传输线（3）和第二衬底（10）包括至少一个第二传输线（11），第一衬底的取向与 相对于第二基板是任意的。 第一衬底（1）包括在所述第一线的一个末端处的至少一个金属化孔，并且第二衬底（10）包括延伸所述第二线的突出元件和节省地面的所述突出元件，所述突出元件插入到金属化孔中。 本发明特别适用于微波领域，并且可以将包括印刷天线的基板与接收信号的处理电路的基板互连。

公开(公告)号：US07798823B2

公开(公告)日：2010-09-21

申请号：US12230325

申请日：2008-08-27

Applicant: Hideyuki Fujikawa ,  Hiromitsu Hagimoto

Inventor： Hideyuki Fujikawa ,  Hiromitsu Hagimoto

IPC: H01R12/00

CPC classification number: H05K1/147 ,  H01R12/772 ,  H01R13/5833 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10356

Abstract: The invention provides a printed circuit board including a first surface, a second surface which is a rear surface to the first surface, a connector installed on the first surface, and, formed between the first surface and the second surface, one of a through hole piercing the printed circuit board and a recess formed in an edge section of the printed circuit board; a cable including a first terminal that is removably fitted to the connector and a connecting wire portion located between the first terminal and a second terminal, the connecting wire portion extending from the first surface to the second surface of the printed circuit board through the one of the through hole and the recess when the first terminal is in a state of being fitted to the connector; and a casing for containing the printed circuit board and the cable.

Abstract translation: 本发明提供了一种印刷电路板，其包括第一表面，第二表面，其是第一表面的后表面，安装在第一表面上的连接器，并且在第一表面和第二表面之间形成有通孔 刺穿印刷电路板和形成在印刷电路板的边缘部分中的凹部; 电缆，其包括可拆卸地装配到所述连接器的第一端子和位于所述第一端子和第二端子之间的连接线部分，所述连接线部分通过所述第一端子从所述第一表面延伸到所述印刷电路板的第二表面， 所述通孔和所述凹部当所述第一端子处于与所述连接器配合的状态时; 以及用于容纳印刷电路板和电缆的外壳。

公开(公告)号：US07748110B2

公开(公告)日：2010-07-06

申请号：US11826758

申请日：2007-07-18

Applicant: Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama ,  Koichi Hirano ,  Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

Inventor： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama ,  Koichi Hirano ,  Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

IPC: H05K3/36

CPC classification number: H05K3/403 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H01R13/2414 ,  H05K1/0218 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/145 ,  H05K1/182 ,  H05K3/20 ,  H05K3/3442 ,  H05K3/361 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/043 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09036 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2203/302 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49208 ,  H01L2924/00

Abstract: A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.

Abstract translation: 可以在没有通孔形成步骤的情况下制造连接构件。 连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

公开(公告)号：US07744264B2

公开(公告)日：2010-06-29

申请号：US12202557

申请日：2008-09-02

Applicant: Chih-Chung Tsao ,  Chih-Peng Hsu ,  Wen-Jang Jiang ,  Chun-Wei Wang ,  Chih-Ming Lai ,  Hung-Kuang Hsu

Inventor： Chih-Chung Tsao ,  Chih-Peng Hsu ,  Wen-Jang Jiang ,  Chun-Wei Wang ,  Chih-Ming Lai ,  Hung-Kuang Hsu

IPC: F21V7/04

CPC classification number: F21S2/005 ,  F21V19/001 ,  F21V19/045 ,  F21V23/06 ,  F21Y2115/10 ,  G02B6/0068 ,  G02B6/0073 ,  H05K1/14 ,  H05K2201/048 ,  H05K2201/09963 ,  H05K2201/10106

Abstract: An exemplary semiconductor solid-state light-source module includes a printed circuit board, at least one semiconductor solid state light source mounted on the printed circuit board and a light guide plate optically coupled to the semiconductor solid state light source. The printed circuit board includes a protrusion and a recess. The protrusion is configured for engaging with a recess of the printed circuit board of another similar semiconductor solid-state light-source module.

Abstract translation: 示例性的半导体固态光源模块包括印刷电路板，安装在印刷电路板上的至少一个半导体固态光源和与半导体固态光源光学耦合的导光板。 印刷电路板包括突起和凹部。 该突出部构造成用于与另一个类似的半导体固态光源模块的印刷电路板的凹部接合。