公开(公告)号：US09666352B2

公开(公告)日：2017-05-30

申请号：US14748615

申请日：2015-06-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki Yosui ,  Noboru Kato ,  Yuki Wakabayashi ,  Bunta Okamoto ,  Naoto Ikeda ,  Takeshi Kurihara

IPC: H01F27/28 ,  H01Q9/42 ,  H01Q1/38 ,  H01Q1/50 ,  H03H7/01 ,  H01F27/40 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H01F27/29 ,  H05K3/00 ,  H01F17/00 ,  H01F27/36 ,  H04M1/02

CPC classification number: H01F38/14 ,  H01F1/34 ,  H01F27/245 ,  H01F27/2804 ,  H01F27/2885 ,  H01F27/29 ,  H01F27/36 ,  H01F27/40 ,  H01F2017/006 ,  H01F2027/2809 ,  H01F2027/295 ,  H01Q1/38 ,  H01Q1/50 ,  H01Q9/42 ,  H03H7/0115 ,  H03H7/0123 ,  H03H7/0138 ,  H03H7/1741 ,  H04M1/0277 ,  H05K1/0218 ,  H05K1/0225 ,  H05K1/0233 ,  H05K1/028 ,  H05K1/147 ,  H05K1/162 ,  H05K1/165 ,  H05K3/0061 ,  H05K2201/086 ,  H05K2201/09263 ,  H05K2201/10098 ,  H05K2201/10189

Abstract: An inductor bridge is provided with a flexible flat plate-shaped element body, a first connector, and a second connector. The element body includes therein an inductor portion. The inductor portion is configured by a spiral conductor pattern. The first connector is provided on the element body and is connected to a first circuit. The second connector is provided on the element body and is connected to a second circuit.

公开(公告)号：US20170099729A1

公开(公告)日：2017-04-06

申请号：US15198679

申请日：2016-06-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han KIM ,  Seong Hee CHOI ,  Dae Hyun PARK

IPC: H05K1/02 ,  H01P3/08

CPC classification number: H05K1/0253 ,  H01P3/08 ,  H01P3/081 ,  H01P3/085 ,  H05K1/0225 ,  H05K1/0298 ,  H05K2201/09263 ,  H05K2201/09681 ,  H05K2201/09781

Abstract: A circuit board includes a first conductive layer, a second conductive layer, and a first insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer includes a signal line, the second conductive layer includes a ground line, and the ground line of the second conductive layer includes a pattern area patterned in a meander shape.

公开(公告)号：US20170091491A1

公开(公告)日：2017-03-30

申请号：US14865551

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John R. DANGLER ,  Phillip Duane ISAACS ,  David C. LONG

IPC: G06F21/87 ,  H05K1/02 ,  H05K3/10 ,  G06F21/72

CPC classification number: H05K3/10 ,  G06F21/72 ,  G06F21/87 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/147 ,  H05K1/167 ,  H05K3/062 ,  H05K3/366 ,  H05K2201/0352 ,  H05K2201/042 ,  H05K2201/047 ,  H05K2201/055 ,  H05K2201/09036 ,  H05K2201/09263 ,  H05K2201/10151

Abstract: Tamper-respondent electronic circuit structures, electronic assembly packages, and methods of fabrication are provided which include, at least in part, a tamper-respondent sensor. The tamper-respondent sensor includes one or more formed flexible layers of, for instance, a dielectric material, having opposite first and second sides, and circuit lines defining at least one resistive network. The circuit lines are disposed on at least one of the first side or the second side of the formed flexible layer(s). The formed flexible layer(s) with the circuit lines includes curvatures, and the circuit lines overlie, at least in part, the curvatures of the formed flexible layer(s). In certain embodiments, the formed flexible layer(s) may be one or more corrugated layers or one or more flattened, folded layers.

公开(公告)号：US20170086510A1

公开(公告)日：2017-03-30

申请号：US14865440

申请日：2015-09-25

Applicant: Aleksandar Aleksov ,  Adel Elsherbini ,  Sasha Oster ,  Braxton Lathrop ,  Nadine L. Dabby ,  Feras Eid

Inventor： Aleksandar Aleksov ,  Adel Elsherbini ,  Sasha Oster ,  Braxton Lathrop ,  Nadine L. Dabby ,  Feras Eid

IPC: A41D1/00 ,  H05K1/03 ,  H05K1/02 ,  G06F1/16

CPC classification number: A41D1/002 ,  G06F1/163 ,  H05K1/0283 ,  H05K1/0296 ,  H05K1/038 ,  H05K2201/0133 ,  H05K2201/09263 ,  H05K2201/10098 ,  H05K2201/10151

Abstract: Some forms relate to an electronic system that includes a textile. The electronic system includes a stretchable body that includes an integrated circuit that is configured to compute and communicate with an external device, wherein the stretchable body further includes at least one of (i) a power source that provides power to at least one of the electronic components; (ii) at least one sensor; (iii) a sensing node that receives signals from each sensor and sends signals to the integrated circuit; and (iv) an antenna that is configured to send and receive signals to and from the integrated circuit and the external device; and a textile attached to the stretchable body.

公开(公告)号：US09564870B2

公开(公告)日：2017-02-07

申请号：US14412311

申请日：2013-03-28

Applicant: NEC CORPORATION

Inventor： Yoshiaki Kasahara ,  Hiroshi Toyao

IPC: H01P1/203 ,  H01P3/08 ,  H03H7/01 ,  H01P1/20 ,  H01Q15/00 ,  H05K1/02 ,  H05K1/16

CPC classification number: H03H7/0161 ,  H01P1/2005 ,  H01P1/203 ,  H01P3/08 ,  H01Q15/0066 ,  H01Q15/008 ,  H03H7/0115 ,  H05K1/0236 ,  H05K1/162 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2201/09781

Abstract: A second conductor plane (102) is formed in a layer different from a layer in which a first conductor plane (101) is formed, and faces the first conductor plane (101). A first transmission line (104) is formed in a layer different from the layers in which the first conductor plane (101) and the second conductor plane (102) are formed, and faces the second conductor plane (102), and one end thereof is an open end. A conductor via (106) connects the other end of the first transmission line (104) and the first conductor plane (101). An insular conductor (112) is connected to a portion of the first transmission line (104) other than a portion thereof at which the transmission line (104) is attached to the conductor via (106), is located in a layer different from the layer in which the second conductor plane (102) is located, and faces the second conductor plane (102).

Abstract translation: 第二导体平面（102）形成在与形成第一导体平面（101）的层不同的层中，并且面向第一导体平面（101）。 第一传输线（104）形成在与形成第一导体平面（101）和第二导体平面（102）的层不同的层中，并且面向第二导体平面（102），并且其一端 是一个开放的结局。 导体通孔（106）连接第一传输线（104）的另一端和第一导体平面（101）。 绝缘导体（112）连接到第一传输线（104）的除了传输线（104）附接到导体通孔（106）的部分之外的部分，位于不同于 层，其中第二导体平面（102）所在，并面向第二导体平面（102）。

公开(公告)号：US09484612B2

公开(公告)日：2016-11-01

申请号：US14532126

申请日：2014-11-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Satoshi Sasaki ,  Yuki Wakabayashi

IPC: H01P3/08 ,  H05K1/02 ,  H05K1/14

CPC classification number: H01P3/082 ,  H01P3/085 ,  H01P3/088 ,  H05K1/0225 ,  H05K1/0253 ,  H05K1/028 ,  H05K1/147 ,  H05K2201/09263 ,  H05K2201/09618 ,  H05K2201/09727

Abstract: A high-frequency signal line includes a dielectric body including flexible dielectric sheets laminated in a direction of lamination and also including a first line portion, a second line portion extending along the first line portion, and a third line portion connecting ends in a specified direction of the first and second line portions. In the dielectric body, a signal line extends through the first, second and third line portions, and a first ground conductor and a second ground conductor face the signal line from both sides in the direction of lamination. One or more interlayer connection conductors are pierced in the dielectric sheets to connect the first ground conductor and the second ground conductor. None of the interlayer connection conductors is provided in a portion of the third line portion that is farther in a direction opposite to the specified direction than the signal line when viewed from the direction of lamination.

Abstract translation: 高频信号线包括：电介质体，其包括沿层叠方向层叠的柔性电介质片，并且还包括第一线部分，沿着第一线部分延伸的第二线部分和沿指定方向连接端部的第三线部分 的第一和第二线部分。 在电介质体中，信号线延伸穿过第一，第二和第三线部分，并且第一接地导体和第二接地导体在层叠方向上从两侧面对信号线。 在电介质片中刺穿一个或多个层间连接导体，以连接第一接地导体和第二接地导体。 当从层叠方向观察时，层间连接导体中没有一个设置在第三线部分的比与信号线相反的方向相反的方向上的部分中。

公开(公告)号：US09456499B2

公开(公告)日：2016-09-27

申请号：US13816690

申请日：2011-07-20

Applicant: Hiroshi Toyao ,  Toru Taura

Inventor： Hiroshi Toyao ,  Toru Taura

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/02 ,  H01P1/04 ,  H05K1/16

CPC classification number: H05K1/18 ,  H01P1/047 ,  H05K1/0236 ,  H05K1/115 ,  H05K1/165 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09972

Abstract: A structural body includes a first conductor having a first opening; a second conductor, having a second opening, which is opposite to at least a portion of the first conductor; a conductor via, passing through the first opening and the second opening, which is insulated from the first conductor and the second conductor; a first interconnect, provided in the inside of the first opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end and which is opposite to the second conductor; and a second interconnect, provided in the inside of the second opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end, and which is opposite to the first conductor.

Abstract translation: 结构体包括具有第一开口的第一导体; 第二导体，具有与所述第一导体的至少一部分相对的第二开口; 导体通孔，穿过与第一导体和第二导体绝缘的第一开口和第二开口; 第一互连件，设置在第一开口的内部，其一端连接到导体通孔，另一端形成为开口端，并与第二导体相对; 以及第二互连件，设置在第二开口的内部，其一端连接到导体通孔，并且其另一端形成为开口端，并且与第一导体相对。

公开(公告)号：US20160255719A1

公开(公告)日：2016-09-01

申请号：US14763074

申请日：2014-12-03

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Song SONG ,  Kazuyoshi NAGAYAMA

IPC: H05K1/03 ,  H05K3/06 ,  H05K1/11 ,  H05K1/09 ,  H05K1/02

CPC classification number: H05K1/0393 ,  G02F1/13452 ,  H05K1/0248 ,  H05K1/0296 ,  H05K1/09 ,  H05K1/115 ,  H05K3/06 ,  H05K2201/0391 ,  H05K2201/09227 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09272 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: The present disclosure discloses a wiring board used to connect a driving chip and a display panel, a flexible display panel and a display device. Signal output ends on the driving chip and signal input ends on the display panel may be arranged in pairs; and the wiring board may include fanout lines each of which is configured to connect a pair of signal output end and the signal input end. The wiring board may include a substrate; a plurality of segments of first connection lines having first resistivity is arranged on a first surface of the substrate; a plurality of segments of second connection lines having second resistivity is arranged on a second surface of the substrate opposite to the first surface. At least parts of the fanout lines are formed by connecting the first connection lines and the second connection lines.

Abstract translation: 本公开公开了一种用于连接驱动芯片和显示面板的接线板，柔性显示面板和显示装置。 驱动芯片上的信号输出结束，显示面板上的信号输入端可以成对布置; 并且布线板可以包括扇出线，每个扇出线被配置为连接一对信号输出端和信号输入端。 布线基板可以包括基板; 在基板的第一表面上布置有具有第一电阻率的第一连接线的多个段; 具有第二电阻率的第二连接线的多个段布置在与第一表面相对的基板的第二表面上。 扇出线的至少一部分通过连接第一连接线和第二连接线而形成。

公开(公告)号：US20160233616A1

公开(公告)日：2016-08-11

申请号：US15099229

申请日：2016-04-14

Applicant: Molex, LLC

Inventor： Kent E. Regnier

IPC: H01R13/6466 ,  H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  H01R13/66 ,  H05K1/02

CPC classification number: H05K1/0227 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/6625 ,  H01R13/6633 ,  H01R2107/00 ,  H03H7/09 ,  H05K1/0233 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/115 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09263 ,  H05K2201/09309 ,  H05K2201/09336 ,  H05K2201/09663 ,  H05K2201/1006 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2203/0307

Abstract: A cable assembly includes multi-layer circuit member with a conductive reference plane with first and second electrically connected regions. A pair of signal conductors are in proximity to the first region and a circuit component is in proximity to the second region. An area of increased impedance exists between the first and second electrically connected regions.

Abstract translation: 电缆组件包括具有导电参考平面的多层电路构件，其具有第一和第二电连接区域。 一对信号导体靠近第一区域，电路部件接近第二区域。 在第一和第二电连接区域之间存在增加阻抗的区域。

公开(公告)号：US20160190076A1

公开(公告)日：2016-06-30

申请号：US14980404

申请日：2015-12-28

Applicant: ROHM CO., LTD.

Inventor： Takuma SHIMOICHI ,  Yasuhiro KONDO

IPC: H01L23/66 ,  H01L49/02

CPC classification number: H01L23/66 ,  H01L27/016 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L2223/6672 ,  H01L2924/0002 ,  H05K1/0289 ,  H05K1/029 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/107 ,  H05K3/146 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/0376 ,  H05K2201/0391 ,  H05K2201/09263 ,  H05K2201/09981 ,  H05K2201/10181 ,  H05K2203/0353 ,  H05K2203/1338 ,  H01L2924/00

Abstract: A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.

Abstract translation: 芯片部分包括在基板上彼此分开形成的基板，第一电极和第二电极以及形成在第一电极和第二电极之间的电路网络。 电路网络包括第一无源元件，第一无源元件包括嵌入在衬底中形成的第一沟槽中的第一导电构件和第二无源元件，第二无源元件包括形成在第一沟槽外部的衬底上的第二导电构件。