公开(公告)号：US08052430B2

公开(公告)日：2011-11-08

申请号：US12157386

申请日：2008-06-09

Applicant: Jerry Wu

Inventor： Jerry Wu

IPC: H01R12/00

CPC classification number: H01R13/6658 ,  H01R9/032 ,  H01R13/5845 ,  H01R13/6593 ,  H01R13/6594 ,  H05K1/0295 ,  H05K1/117 ,  H05K3/3405 ,  H05K3/3421 ,  H05K2201/09954 ,  H05K2201/10189 ,  H05K2201/10356

Abstract: A cable assembly includes an insulated housing (100) and a plurality of contacts (10) received therein, each contact having a tail portion extending beyond rear surface of the insulated housing; a printed circuit board (2) having a front portion and an opposite rear portion, with a plurality of conductive traces (220) arranged on the front portion and a number of conductive pads (240, 242) arranged on the rear portion. The tail portions of the contacts are soldered to the conductive traces of the front portion of the printed circuit board. The conductive pads on the rear portion of the printed circuit board are separated into at least two groups and connecting to two kinds of cables (4), selectively. A cover (9) is mold over a rear portion of the connector and a front portion of corresponding cable.

Abstract translation: 电缆组件包括绝缘壳体（100）和容纳在其中的多个触头（10），每个触头具有延伸超过绝缘壳体的后表面的尾部; 具有前部和相对的后部的印刷电路板（2），其布置在前部上的多个导电迹线（220）和布置在后部上的多个导电焊盘（240,242）。 触点的尾部焊接到印刷电路板的前部的导电迹线。 印刷电路板后部的导电焊盘被分成至少两组，并且选择性地连接到两种电缆（4）。 盖（9）在连接器的后部和相应电缆的前部部分上模制。

公开(公告)号：US08012874B2

公开(公告)日：2011-09-06

申请号：US11956434

申请日：2007-12-14

Applicant: Yue Li ,  Silqun Leung ,  Terence Cheung ,  Sally Yeung ,  Liane Martinez

Inventor： Yue Li ,  Silqun Leung ,  Terence Cheung ,  Sally Yeung ,  Liane Martinez

IPC: H01L21/44

CPC classification number: H01L23/50 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K1/0295 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09663 ,  H05K2201/099 ,  H05K2201/09954 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: Various methods and apparatus for coupling capacitors to a chip substrate are disclosed. In one aspect, a method of manufacturing is provided that includes forming a mask on a semiconductor chip substrate that has plural conductor pads. The mask has plural openings that expose selected portions of the plural conductor pads. Each of the plural openings has a footprint corresponding to a footprint of a smallest size terminal of a capacitor adapted to be coupled to the semiconductor chip substrate. A conductor material is placed in the plural openings to establish plural capacitor pads.

Abstract translation: 公开了用于将电容器耦合到芯片衬底的各种方法和装置。 一方面，提供一种制造方法，其包括在具有多个导体焊盘的半导体芯片基板上形成掩模。 该掩模具有多个露出多个导体焊盘的选定部分的开口。 多个开口中的每一个具有对应于适于耦合到半导体芯片衬底的电容器的最小尺寸端子的覆盖区的覆盖区。 将导体材料放置在多个开口中以建立多个电容器焊盘。

公开(公告)号：US20110205714A1

公开(公告)日：2011-08-25

申请号：US13103788

申请日：2011-05-09

Applicant: Masahiko Takakusaki ,  Minoru Enomoto

Inventor： Masahiko Takakusaki ,  Minoru Enomoto

IPC: H05K1/18

CPC classification number: H05K1/141 ,  G06F1/1616 ,  G06F1/1658 ,  G06F1/185 ,  G06F1/203 ,  H05K1/144 ,  H05K2201/045 ,  H05K2201/09954 ,  H05K2201/10189

Abstract: A daughterboard to be attached to a motherboard on which a host controller is mounted includes a first connector electrically connected to the host controller, a bridge controller electrically connected to the first connector, a chip electrically connected to the bridge controller, and a second connector electrically connected to the bridge controller and configured to electrically connect to other daughterboards.

Abstract translation: 要连接到安装有主机控制器的母板的子板包括电连接到主机控制器的第一连接器，电连接到第一连接器的桥接控制器，电连接到桥接控制器的芯片和电连接到桥接控制器的第二连接器 连接到桥控制器并且被配置为电连接到其他子板。

公开(公告)号：US07996987B2

公开(公告)日：2011-08-16

申请号：US11581354

申请日：2006-10-17

Applicant: Wael William Diab ,  Shimon Elkayam

Inventor： Wael William Diab ,  Shimon Elkayam

IPC: H05K3/30 ,  H01S4/00

CPC classification number: H01L23/50 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0295 ,  H05K1/181 ,  H05K2201/09954 ,  H05K2201/10689 ,  Y02P70/611 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/4913 ,  Y10T29/49137 ,  H01L2924/00

Abstract: A system and method for producing a family of power modules having a common footprint that enables the customer to flexibly choose a power module size without incurring the costs of a relayout of a system design. In one embodiment, a board layout can be designed using a selected power module footprint size that supports an installation of any of a plurality of power modules. The power module that is used in a board layout can be selected based on a measurement of an amount of power consumed by the one or more loads.

Abstract translation: 一种用于生产具有公共覆盖区的功率模块系列的系统和方法，其使得客户能够灵活地选择功率模块尺寸，而不会导致系统设计的重新布线的成本。 在一个实施例中，可以使用支持多个功率模块中的任何一个的安装的所选功率模块占用空间大小来设计板布局。 可以基于对一个或多个负载消耗的功率量的测量来选择用于电路板布局的功率模块。

公开(公告)号：US20110119425A1

公开(公告)日：2011-05-19

申请号：US12675105

申请日：2008-06-30

Applicant: Ravindranath Kollipara ,  Xingchao Yuan ,  Frank Lambrecht ,  Ming Li ,  Richard E. Perego ,  Qi Lin ,  David Nguyen ,  Kyung Suk Oh

Inventor： Ravindranath Kollipara ,  Xingchao Yuan ,  Frank Lambrecht ,  Ming Li ,  Richard E. Perego ,  Qi Lin ,  David Nguyen ,  Kyung Suk Oh

IPC: G06F13/40 ,  G06F13/20

CPC classification number: G06F13/1668 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0237 ,  H05K1/0295 ,  H05K1/14 ,  H05K1/141 ,  H05K1/147 ,  H05K3/222 ,  H05K2201/044 ,  H05K2201/09954 ,  H05K2201/10159 ,  H05K2201/10356

Abstract: The disclosure relates to a detachable signalling interconnect apparatus that provides connectivity between two or more components of a memory system in conjunction with different modes of operation of the components. The memory system comprises: a first socket to receive a first memory module; a second socket to receive a second memory module; a detachable signal-interconnect; and a memory controller coupled to the detachable signal-interconnect and configured to define a first mode of operation and a second mode of operation, wherein in the first mode of operation the detachable signal-interconnect is to couple the memory-controller to the first memory module and in the second mode of operation the detachable signal-interconnect is to couple the memory controller to the first memory module and the second memory module.

Abstract translation: 本公开涉及一种可拆卸信令互连装置，其提供存储器系统的两个或更多个组件与组件的不同操作模式之间的连接。 存储器系统包括：第一插座，用于接收第一存储器模块; 用于接收第二存储器模块的第二插座; 可拆卸的信号互连; 以及存储器控制器，其耦合到所述可拆卸信号互连并且被配置为限定第一操作模式和第二操作模式，其中在所述第一操作模式中，所述可拆卸信号互连将所述存储器控制器耦合到所述第一存储器 模块，并且在第二操作模式中，可拆卸信号互连将存储器控制器耦合到第一存储器模块和第二存储器模块。

公开(公告)号：US20110043969A1

公开(公告)日：2011-02-24

申请号：US12735195

申请日：2008-12-12

Applicant: Hiroki Shiraiwa ,  Kazuomi Kiyosue ,  Akinori Nakashima ,  Tomohiro Sugiura ,  Noriyoshi Yamazaki ,  Minoru Umezaki

Inventor： Hiroki Shiraiwa ,  Kazuomi Kiyosue ,  Akinori Nakashima ,  Tomohiro Sugiura ,  Noriyoshi Yamazaki ,  Minoru Umezaki

IPC: H02G3/08

CPC classification number: H01R9/2466 ,  H01R13/68 ,  H01R2201/26 ,  H05K1/0263 ,  H05K1/0295 ,  H05K2201/09954 ,  H05K2201/10272

Abstract: The present invention provides a junction block adapted for a variety grade of vehicles without increase of cost. The junction block includes a circuit board 2, a terminal block 3 for low-grade use to be connected to the circuit board, a bus bar block 4 for high-grade use superimposed on the terminal block and connected to the circuit board, a cover 9 for covering the circuit board from side of the bus bar block, and a plurality of fuses 39, 39′ to be connected to terminals 14a, 19a of the terminal block and the bus bar block, wherein the junction block is adapted for high-grade use and low-grade use with or without use of the bus bar block.

Abstract translation: 本发明提供了适用于各种等级的车辆而不增加成本的连接块。 接线块包括电路板2，用于低级使用的端子块3连接到电路板，用于高级使用的母线块4叠加在端子块上并连接到电路板，盖 9，用于从母线块的一侧覆盖电路板，以及多个保险丝39,39'，以连接到接线端子的端子14a，19a和母线块，其中， 使用或不使用母线块的低档使用和低档使用。

公开(公告)号：US07813208B2

公开(公告)日：2010-10-12

申请号：US11965753

申请日：2007-12-28

Applicant: Shou-Kuo Hsu ,  Duen-Yi Ho ,  Cheng-Shien Li

Inventor： Shou-Kuo Hsu ,  Duen-Yi Ho ,  Cheng-Shien Li

IPC: G11C5/14

CPC classification number: G06F13/4072 ,  G06F13/4239 ,  H05K1/0262 ,  H05K1/14 ,  H05K2201/044 ,  H05K2201/09954 ,  H05K2201/10159

Abstract: An exemplary motherboard includes a driving module, at least two first slots arranged for mounting two first type of memories, at least two second slots arranged for mounting two second type of memories, and a voltage regulator. The driving module is electronically connected to the at least two first slots, the at least two second slots, and the voltage regulator in turn via a channel. The first type of memories and the second type of memories are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of memory mounted on the motherboard accordingly.

Abstract translation: 示例性主板包括驱动模块，布置成用于安装两个第一类型存储器的至少两个第一槽，布置成安装两个第二类型存储器的至少两个第二槽和电压调节器。 驱动模块通过通道电连接到至少两个第一插槽，至少两个第二插槽和电压调节器。 第一类型的存储器和第二类型的存储器交替地安装在母板上，电压调节器检测当前安装在母板上的哪种类型的存储器，并相应地输出适合于安装在母板上的存储器类型的电压。

公开(公告)号：US20100099274A1

公开(公告)日：2010-04-22

申请号：US12495265

申请日：2009-06-30

Applicant: Sung-Yu Hsieh ,  Wen-Chin Wu

Inventor： Sung-Yu Hsieh ,  Wen-Chin Wu

IPC: H01R12/00 ,  H05K3/30

CPC classification number: H01R12/7005 ,  H01R12/7052 ,  H01R12/716 ,  H05K1/182 ,  H05K3/306 ,  H05K2201/09063 ,  H05K2201/09954 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2203/167 ,  Y10T29/49139

Abstract: A sinking type electrical connector is adapted for coupling to a circuit board. The sinking type electrical connector includes a body and at least one limiting unit. The body has a front end portion, a connecting portion provided in the front end portion, and a top surface. The limiting unit is provided at one side of the body and includes a plurality of limiting portions respectively located at different levels. A selected one of the limiting portions of the limiting unit which are at different levels is brought to engage the circuit board so that a distance from the top surface of the body to the circuit board is changeable.

Abstract translation: 沉没式电连接器适于耦合到电路板。 沉没式电连接器包括主体和至少一个限制单元。 主体具有前端部，设置在前端部的连接部和顶面。 限制单元设置在主体的一侧，并且包括分别位于不同级别的多个限制部分。 限制单元的不同级别的限定部分中的选定的一个使得电路板接合，使得从主体的顶表面到电路板的距离是可变的。

公开(公告)号：US07677898B2

公开(公告)日：2010-03-16

申请号：US12023008

申请日：2008-01-30

Applicant: Yi Rui ,  Ai-Yu Pan ,  Jian-She Shen ,  Mei Huang

Inventor： Yi Rui ,  Ai-Yu Pan ,  Jian-She Shen ,  Mei Huang

IPC: H01R29/00

CPC classification number: G06F13/4068 ,  G06F2213/0026 ,  H05K1/0237 ,  H05K1/0295 ,  H05K1/141 ,  H05K3/222 ,  H05K2201/044 ,  H05K2201/09227 ,  H05K2201/09954 ,  H05K2201/10189

Abstract: An exemplary patch panel includes a printed circuit board having a plurality of signal terminals for connecting to two pairs of peripheral component interconnect express (PCI-E) X1 differential signal terminals of an I/O controller hub (ICH), an interface terminal of a high definition multimedia interface (HDMI), four pairs of differential signal terminals of the HDMI, four pairs of differential signal terminals of a graphic and memory controller hub (GMCH), one of another differential signal terminal of the GMCH, and two pairs of differential signal terminals of a PCI-E X16 slot. Therefore, the ICH is connected to the PCI-E X16 slot via the patch panel for supporting a PCI-E X1 card while the GMCH is connected to the HDMI via the patch panel. A patch panel connector is provided to mount the patch panel on a motherboard.

Abstract translation: 示例性接线板包括具有多个信号端子用于连接到I / O控制器集线器（ICH）的两对外围组件互连快速（PCI-E）X1差分信号端子的印刷电路板， 高分辨率多媒体接口（HDMI），HDMI对的四对差分信号端子，图形和存储器控制器集线器（GMCH）的四对差分信号端子，GMCH的另一个差分信号端子和两对差分 PCI-E X16插槽的信号端子。 因此，ICH通过接线板连接到PCI-E X16插槽，用于支持PCI-E X1卡，而GMCH通过接线板连接到HDMI。 提供了一个接线板连接器，用于将接线板安装在主板上。

公开(公告)号：US20090315701A1

公开(公告)日：2009-12-24

申请号：US12141531

申请日：2008-06-18

Applicant: Dean S. Anderson ,  Danny J. Vatland ,  Brian J. Bischoff

Inventor： Dean S. Anderson ,  Danny J. Vatland ,  Brian J. Bischoff

IPC: G08B1/08 ,  H05K1/18 ,  B23P19/00

CPC classification number: G08B21/04 ,  G08B21/0492 ,  H05K1/0295 ,  H05K2201/09954 ,  H05K2201/10098 ,  Y10T29/53174

Abstract: Methods, devices, and systems for electronic wireless communication in circuits for monitoring one or more activities of an individual are disclosed. One circuit board assembly embodiment includes a carrier board portion having a module contact pattern to electrically connect a module, selected from a plurality of different module types each having a contact pattern that corresponds to the module contact pattern of the carrier board portion, to a number of electrical components attached to the carrier board portion; a sensor portion for sensing one or more activities of an individual, the sensor portion electrically connected to the carrier board portion; and a communications module portion selected from the plurality of different module types, wherein the module portion has a contact pattern that corresponds to the module contact pattern and wherein the communications module portion is electrically connected to the carrier board portion via the module contact pattern.

Abstract translation: 公开了用于监测个人的一个或多个活动的电路中用于电子无线通信的方法，设备和系统。 一个电路板组件实施例包括具有模块接触图案的载板基板部分，以将从具有对应于载板单元的模块接触图案的接触图案的多个不同模块类型中选出的模块电连接到数字 附接到所述载板部分的电气部件; 用于感测个体的一个或多个活动的传感器部分，所述传感器部分电连接到所述载体板部分; 以及从所述多个不同模块类型中选择的通信模块部分，其中所述模块部分具有对应于所述模块接触图案的接触图案，并且其中所述通信模块部分经由所述模块接触图案电连接到所述承载板部分。