公开(公告)号：US20130228362A1

公开(公告)日：2013-09-05

申请号：US13599984

申请日：2012-08-30

Applicant: Jan Hendrik Berkel

Inventor： Jan Hendrik Berkel

IPC: H05K1/02 ,  F28F21/00 ,  H05K3/30

CPC classification number: H05K1/0201 ,  F28F21/00 ,  H01L23/36 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H05K1/0204 ,  H05K1/021 ,  H05K3/0061 ,  H05K3/30 ,  H05K2201/068 ,  H05K2201/09745 ,  H05K2201/10416 ,  H05K2201/1059 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed herein is a method for assembling a circuit board which has at least one layer copper clad on one or both sides or provided with conductor tracks, wherein, in one assembly step, at least one rigid flange insert is inserted into an associated recess in the circuit board or into a component associated with the circuit board and wherein at least one semiconductor die of a semiconductor component is applied onto the inserted flange insert in a subsequent application step.

Abstract translation: 本文公开了一种用于组装电路板的方法，该电路板在一个或两个侧面上具有至少一层铜包层或设置有导体轨道，其中在一个组装步骤中，至少一个刚性凸缘插入件插入到相关联的凹部中 电路板或与电路板相关联的部件，并且其中半导体部件的至少一个半导体管芯在随后的施加步骤中被施加到插入的法兰插入件上。

公开(公告)号：US20130100628A1

公开(公告)日：2013-04-25

申请号：US13655049

申请日：2012-10-18

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Takuto YAMAGUCHI

IPC: H05K1/11

CPC classification number: H01R12/585 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/1059

Abstract: An electronic device having a press-fit connection for connecting a connector and an electronic part mounted on a printed circuit board which is possible to enable high density mounting. Viewing the printed circuit board from an upper surface, between adjacent through holes on which a compressive force acts upon insertion of the press-fit terminal, among the large number of through holes, a land or a conductor film connected to the conductor film formed on the inner wall surface of the through hole or the conductor film not connected to the conductor film formed on the inner wall surface of the through hole, formed in the circuit board held between the top layer circuit board and the bottom layer circuit board, exists in a width equal to or wider than the diameter of the through hole.

Abstract translation: 具有用于连接连接器的压配合连接器和安装在印刷电路板上的可能实现高密度安装的电子部件的电子设备。 在大量通孔中观察印刷电路板的上表面，相邻通孔之间施加有压缩力作用在压配合端子之间的连接到导体膜上的焊盘或导体膜，形成在 贯通孔的内壁面或导体膜未连接到形成于贯通孔的内壁面的导体膜，形成在保持在顶层电路基板与底层电路基板之间的电路基板中，存在于 宽度等于或大于通孔的直径。

公开(公告)号：US08410610B2

公开(公告)日：2013-04-02

申请号：US12734192

申请日：2008-10-16

Applicant: Toshio Kazama ,  Shigeki Ishikawa

Inventor： Toshio Kazama ,  Shigeki Ishikawa

IPC: H01L23/48

CPC classification number: H05K3/326 ,  H01L23/49811 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01R12/714 ,  H01R13/2407 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A connecting terminal, a semiconductor package, a wiring board, a connector, and a microcontactor that can achieve a stable contact with a contact target are provided. To achieve the object and to establish an electrical connection to a contact target by making a physical contact with the contact target, there are provided a plurality of conductive terminal-forming members each having a terminal portion, which is extended in a band shape and at least a part of a surface of which forms a curved surface. Each terminal portion is configured so that a part of which is laminated on a part of at least one terminal portion in a thickness direction. All the terminal portions may be laminated at respective tip portions in the thickness direction.

Abstract translation: 提供了可以实现与接触目标的稳定接触的连接端子，半导体封装，布线板，连接器和微控制器。 为了实现该目的并通过与接触目标物理接触来建立与接触靶的电连接，提供了多个导电端子形成部件，每个导体端子形成部件具有端部，该端子部分延伸成带状， 其表面的至少一部分形成曲面。 每个端子部分被构造为使得其一部分层压在厚度方向上的至少一个端子部分的一部分上。 所有端子部分可以在厚度方向的各个尖端部分层叠。

公开(公告)号：US08385082B2

公开(公告)日：2013-02-26

申请号：US12849820

申请日：2010-08-04

Applicant: Yen-Chih Chang ,  Ke-Hao Chen

Inventor： Yen-Chih Chang ,  Ke-Hao Chen

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K7/1069 ,  H01R12/7082 ,  H01R12/714 ,  H05K3/308 ,  H05K2201/10393 ,  H05K2201/1059 ,  H05K2201/10704

Abstract: An electrical connection arrangement includes an IC package, and a PCB having a plurality of receiving holes for receiving a plurality of contacts therein. The contact having a contacting portion engaged with the IC package that seated upon the PCB. A retaining device is provided for securing the IC package onto the PCB. Since there is no socket utilized in the present invention, the total profile of the arrangement and the cost are effectively reduced.

Abstract translation: 电连接装置包括IC封装和具有用于在其中接收多个触点的多个接收孔的PCB。 接触件具有与安装在PCB上的IC封装相接合的接触部分。 提供保持装置用于将IC封装固定到PCB上。 由于在本发明中没有使用插座，所以可以有效地减少布置的总体轮廓和成本。

公开(公告)号：US08323037B2

公开(公告)日：2012-12-04

申请号：US13197368

申请日：2011-08-03

Applicant: Su-Hyun Cha ,  Junghoon Kim ,  Seongchan Han

Inventor： Su-Hyun Cha ,  Junghoon Kim ,  Seongchan Han

IPC: H01R12/00

CPC classification number: H05K1/117 ,  H01L23/13 ,  H01L23/5383 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K2201/09145 ,  H05K2201/09409 ,  H05K2201/09845 ,  H05K2201/1059 ,  H01L2924/00

Abstract: Example embodiments relate to semiconductor modules and semiconductor devices including the same. The semiconductor module may include a board, a plurality of semiconductor chips, a plurality of first taps, and a plurality of second taps. The board may include a chip region, a first tap region, and a second tap region. The first tap region of the board may have a first width that extends in a thickness direction of the board. The second tap region may have a second width that is less than the first width. The second tap region may be disposed under the first tap region. The semiconductor chips may be mounted in the chip region of the board. The first taps may be disposed in the first tap region, and the second taps may be disposed in the second tap region. The first and second taps may be configured to transmit/receive an electric signal to/from the plurality of semiconductor chips.

Abstract translation: 示例性实施例涉及包括其的半导体模块和半导体器件。 半导体模块可以包括板，多个半导体芯片，多个第一抽头和多个第二抽头。 板可以包括芯片区域，第一分接区域和第二分接区域。 板的第一分接区域可以具有沿着板的厚度方向延伸的第一宽度。 第二抽头区域可以具有小于第一宽度的第二宽度。 第二抽头区域可以设置在第一抽头区域下方。 半导体芯片可以安装在板的芯片区域中。 第一抽头可以设置在第一抽头区域中，并且第二抽头可以设置在第二抽头区域中。 第一和第二抽头可以被配置为向/从多个半导体芯片发送/接收电信号。

公开(公告)号：US20120244753A1

公开(公告)日：2012-09-27

申请号：US13514347

申请日：2010-12-03

Applicant: Roland Moedinger

Inventor： Roland Moedinger

IPC: H01R24/50 ,  H05K1/00 ,  H05K3/36

CPC classification number: H05K3/308 ,  H01R12/585 ,  H01R12/724 ,  H01R13/6587 ,  H05K1/0245 ,  H05K1/0251 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2203/0242 ,  Y10T29/49126

Abstract: The invention relates to a multipole relief plug-in connector (10a, 10b) and to a multilayer circuit board (12a, 12b), the relief plug-in connector (10a, 10b) comprising a plurality of contact elements (14a, 14b), the contacting sections (16a, 16b) of which are arranged in height-offset contact area surfaces (18a, 18b), and the multilayer circuit board (12a, 12b) comprising several height-offset contact area surfaces (20, 20b) accordingly, and to a combination of a multipole relief plug-in connector (10a, 10b) for contacting with a multilayer circuit board (12a, 12b) and a multilayer circuit board (12a, 12b) for populating with the multipole relief plug-in connector (10a, 10b). The relief plug-in connector (10a, 10b) according to the invention is characterized in that the contact elements (14a, 14b) are designed in the contacting section (16a, 16b) as press-in contacts (22a, 22b, 26a, 26b, 28a, 28b) for pressing into press-in contact receiving portions (24a, 24b, 38a, 38b, 44a, 44b) of the multilayer circuit board (12a, 12b). The multilayer circuit board (12a, 12b) is characterized in that contact element receiving portions are arranged in the contact area surfaces (20a, 20b) of the multilayer circuit board (12a, 12b), the contact element receiving portions being designed as press-in contact receiving portions (24a, 24b, 38a, 38b, 44a, 44b). The invention further relates to a production method for the multilayer circuit board (12a, 12b).

Abstract translation: 本发明涉及多极释放插入式连接器（10a，10b）和多层电路板（12a，12b），所述释放插入式连接器（10a，10b）包括多个接触元件（14a，14b） ，其接触部分（16a，16b）布置在高度偏移的接触区域表面（18a，18b）中，并且所述多层电路板（12a，12b）相应地包括多个高度偏移接触面积表面（20,20b） 以及用于与多层电路板（12a，12b）接触的多极释放插入式连接器（10a，10b）和用于填充多极释放插入式连接器的多层电路板（12a，12b）的组合 （10a，10b）。 根据本发明的释放插入式连接器（10a，10b）的特征在于，接触元件（14a，14b）被设计在接触部分（16a，16b）中，作为压入触头（22a，22b，26a， 26b，28a，28b），用于压入多层电路板（12a，12b）的压入接触部（24a，24b，38a，38b，44a，44b）。 多层电路板（12a，12b）的特征在于，多层电路板（12a，12b）的接触区域表面（20a，20b）中布置有接触元件接收部分， 在接触接收部分（24a，24b，38a，38b，44a，44b）中。 本发明还涉及多层电路板（12a，12b）的制造方法。

公开(公告)号：US08217277B2

公开(公告)日：2012-07-10

申请号：US12070578

申请日：2008-02-19

Applicant: Robert Kraus ,  Wolfgang Georg Pabst ,  Harald Stoyan

Inventor： Robert Kraus ,  Wolfgang Georg Pabst ,  Harald Stoyan

IPC: H05K1/16

CPC classification number: H05K1/148 ,  H01R12/52 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/1059

Abstract: A mounting panel arrangement having a plurality of mounting panels for optoelectronic components. Two adjacent mounting panels (1, 2) are connected to one another, in a mechanically stable manner, a connection body (3). Each of the two mounting panels has a connection area (110, 210), each of which is associated with an attachment section (31, 32) of the connection body. For each connection area, a plug connection is formed between the connection area and the associated attachment section.

Abstract translation: 一种具有用于光电子部件的多个安装面板的安装面板装置。 两个相邻的安装面板（1,2）以机械稳定的方式彼此连接，连接体（3）。 两个安装面板中的每一个具有连接区域（110,210），每个连接区域与连接体的连接部分（31,32）相关联。 对于每个连接区域，在连接区域和相关联的连接部分之间形成插头连接。

公开(公告)号：US08215965B2

公开(公告)日：2012-07-10

申请号：US12741108

申请日：2009-04-24

Applicant: Masanori Mizoguchi

Inventor： Masanori Mizoguchi

IPC: H01R12/00

CPC classification number: H05K3/326 ,  H01R12/718 ,  H05K1/118 ,  H05K1/147 ,  H05K3/306 ,  H05K3/363 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K2201/0949 ,  H05K2201/10378 ,  H05K2201/1059

Abstract: A female connector which is useful for space saving and height reduction of a connector connection portion is a female connector including: an insulating film having flexibility; a plurality of pad portions formed at predetermined positions on one face of the insulating film in an arranged manner; female terminal portions composed of openings formed at one lateral portions within faces of the pad portions so as to extend up to the other face of the insulating film; and spacer bumps formed at positions corresponding to the other lateral positions within the faces of the pad portions in a standing manner within the other face of the insulating film, proximal portions of the spacer bumps being electrically connected to the pad portions.

Abstract translation: 用于连接器连接部分的节省空间和降低高度的阴连接器是阴连接器，包括：具有柔性的绝缘膜; 以排列的方式形成在所述绝缘膜的一个表面上的预定位置处的多个焊盘部分; 阴端子部分由形成在焊盘部分的表面内的一个侧部处的开口组成，以延伸到绝缘膜的另一个面; 以及在所述绝缘膜的另一个表面内以垂直方式形成在与所述焊盘部分的所述表面内的其它侧向位置对应的位置处的间隔凸块，所述间隔件凸块的近侧部分电连接到所述焊盘部分。

公开(公告)号：US08199320B2

公开(公告)日：2012-06-12

申请号：US12534305

申请日：2009-08-03

Applicant: Hideaki Takahashi

Inventor： Hideaki Takahashi

IPC: G01N21/00

CPC classification number: H05K3/308 ,  G01N2021/551 ,  H05K1/0269 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2201/10909 ,  H05K2201/2054 ,  H05K2203/162

Abstract: A method for testing a part mounting status on a substrate, the method comprises preparing the part including a retroreflection portion for occurring reflect light by retroreflection; irradiating light onto the retroreflection portion; receiving the reflect light from the retroreflection portion; and determining whether the part exist by the use of the reflect light from the retroreflection portion.

Abstract translation: 一种用于测试衬底上的部件安装状态的方法，所述方法包括准备包括用于通过回射发生反射光的回射部分的部件; 将光照射到回射部分上; 接收来自回射部分的反射光; 以及通过使用来自回射部分的反射光来确定部件是否存在。

公开(公告)号：US08192068B2

公开(公告)日：2012-06-05

申请号：US12703279

申请日：2010-02-10

Applicant: You-Jin Kwon ,  Won-Il Kim ,  Hyun-Gu Kang ,  Seung-Ryeol Ryu ,  Sang-Geun Bae ,  Seung-Sik Hong

Inventor： You-Jin Kwon ,  Won-Il Kim ,  Hyun-Gu Kang ,  Seung-Ryeol Ryu ,  Sang-Geun Bae ,  Seung-Sik Hong

IPC: H01R33/00 ,  F21V19/04

CPC classification number: F21V19/001 ,  F21V19/045 ,  F21Y2115/10 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/301 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10598 ,  H01L2924/00014

Abstract: A light-emitting module includes a printed circuit board (PCB), a fastening member, and a light-emitting package. The PCB has a power-supplying pad to provide electrical power. The fastening member is disposed on the PCB and has a package-receiving hole exposing the power-supplying pad. The light-emitting package is received by the package-receiving hole such that the light-emitting package is electrically connected to the power-supplying pad and detachably coupled with the fastening member. Therefore, the light-emitting package may be easily combined with the PCB, and the light-emitting package may be replaced when desired.

Abstract translation: 发光模块包括印刷电路板（PCB），紧固构件和发光封装。 PCB具有供电电源以提供电力。 紧固构件设置在PCB上并且具有暴露供电垫的封装容纳孔。 发光封装由封装容纳孔接收，使得发光封装电连接到供电焊盘并且可拆卸地与紧固构件连接。 因此，发光封装可以容易地与PCB组合，并且如果需要，可以更换发光封装。