公开(公告)号：US07563112B2

公开(公告)日：2009-07-21

申请号：US11979972

申请日：2007-11-13

Applicant: Takayoshi Honda

Inventor： Takayoshi Honda

IPC: H01R12/00

CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: An electronic device includes a printed circuit board having lands and an electronic element having a body and terminals. First and second lands provide a zigzag pattern. Each first land is coupled with the first terminal, and each second land is coupled with the second terminal. The second terminal includes a first parallel member, a first connection member, a second parallel member and a first mounting member. The first parallel member is completely embedded in the body, or another part of the first parallel member exposed from the body is shorter than the second parallel member. A second height between the second parallel member and the printed circuit board is smaller than a first height between the first parallel member and the printed circuit board.

Abstract translation: 电子设备包括具有平台的印刷电路板和具有主体和端子的电子元件。 第一和第二土地提供锯齿形图案。 每个第一焊盘与第一端子耦合，并且每个第二焊盘与第二端子耦合。 第二端子包括第一平行构件，第一连接构件，第二平行构件和第一安装构件。 第一平行构件完全嵌入主体中，或者从主体露出的第一平行构件的另一部分比第二平行构件短。 第二平行构件和印刷电路板之间的第二高度小于第一平行构件和印刷电路板之间的第一高度。

公开(公告)号：US06898847B2

公开(公告)日：2005-05-31

申请号：US10193989

申请日：2002-07-15

Applicant: André Koerner ,  Ralf Schulze

Inventor： André Koerner ,  Ralf Schulze

IPC: H01R4/02 ,  H01R43/02 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H01R4/024 ,  H01R43/0235 ,  H01R43/0256 ,  H05K3/3415 ,  H05K3/3484 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10871 ,  H05K2201/10901 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: A method is described for producing an electrical connection between a plug element and a printed circuit board. A plug end of the at least one plug element is inserted in an opening extending through the printed circuit board. A solder, preferably in the form of solder paste, is applied essentially from above to at least parts of the opening or the area surrounding the opening. The connection between the board and the plug end is achieved by melting the solder. Prior to melting of the solder and/or application of the solder, the plug end is introduced into the opening in the printed circuit board essentially from below, and is held therein by a retaining arrangement such that during melting the solder enters the opening from above and contacts the plug end.

Abstract translation: 描述了一种用于产生插头元件和印刷电路板之间的电连接的方法。 所述至少一个插头元件的插塞端插入延伸穿过所述印刷电路板的开口中。 优选以焊膏形式的焊料基本上从上方施加到开口的至少部分或围绕开口的区域。 通过熔化焊料来实现板和插头端之间的连接。 在焊料熔化和/或焊接的应用之前，插塞端部基本上从下方引入印刷电路板的开口中，并通过保持装置保持在其中，使得在熔化期间焊料从上方进入开口 并接触插头端。

公开(公告)号：US4787853A

公开(公告)日：1988-11-29

申请号：US30505

申请日：1987-03-27

Applicant: Yutaka Igarashi

Inventor： Yutaka Igarashi

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/42 ,  H05K1/00

CPC classification number: H05K1/111 ,  H05K1/112 ,  H05K3/308 ,  H05K3/3421 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/10704 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/0455 ,  H05K3/321 ,  H05K3/42 ,  Y02P70/611 ,  Y02P70/613

Abstract: A printed circuit board is disclosed which comprises a plurality of non-through holes into thickness direction in one surface of the board, a plurality of through holes in some of the non-through holes to open through opposite surface of the board and having a smaller inside diameter than the non-through holes, a plurality of first conductive lands on the periphery of the openings of the non-through holes in one surface of the board, a plurality of second conductive lands on the periphery of the openings in opposite surface of the through holes and having the smaller outside diameter than the second lands on the periphery of the openings of the non-through holes, a conductor layer in inside wall of the non-through holes and the through holes for connecting the first lands in one surface and the second conductive lands in opposite surface of board, and conductive patterns formed in one surface and opposite surface of the board respectively, which invention is capable of including the great number of the conductive patterns as necessary for mounting the electric component such as PGA or HPC without multilayering the board or going around of the conductive patterns, because of the greater number of the spaces between the second lands can be formed in opposite surface.

Abstract translation: 公开了一种印刷电路板，其包括在板的一个表面中的厚度方向上的多个非通孔，一些非通孔中的多个通孔，通过板的相对表面打开并具有较小的 在所述板的一个表面中的所述非通孔的开口周边上的多个第一导电焊盘，所述多个第一导电焊盘在所述板的一个表面中的所述开口的周边上， 所述通孔具有比所述非通孔的开口周边上的第二焊盘小的外径，所述非通孔的内壁中的导体层和用于将一个表面中的第一焊盘连接的通孔 并且板的相对表面中的第二导电焊盘和分别形成在板的一个表面和相对表面中的导电图案，其能够包括gr 由于可以在相对的表面上形成第二焊盘之间的更大数量的空间，因此可以根据需要安装诸如PGA或HPC的电气部件的数量的导电图案，而不需要多层导电板或导电图案。

公开(公告)号：US11936251B2

公开(公告)日：2024-03-19

申请号：US16969860

申请日：2019-01-21

Applicant: SANDEN AUTOMOTIVE COMPONENTS CORPORATION

Inventor： Mikio Kobayashi ,  Masataka Matsuda ,  Toru Yoshihara

IPC: H02K11/33 ,  H02K11/02 ,  H03H1/00 ,  H03H7/01 ,  H05K1/18 ,  B60H1/32 ,  H01L25/07

CPC classification number: H02K11/33 ,  H02K11/02 ,  H03H1/0007 ,  H03H7/0115 ,  H05K1/18 ,  B60H1/3223 ,  H01L25/072 ,  H02K2211/03 ,  H05K2201/10166 ,  H05K2201/10378 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10606 ,  H05K2201/10757 ,  H05K2201/10901

Abstract: Assembly workability of an electric compressor to which an inverter circuit section and a filter circuit section are attached is improved. The inverter circuit section (3) includes an inverter control board (17), a sleeve assembly (18), and a power module (14). The inverter control board, the sleeve assembly, and the power module are integrated. The filter circuit section (4) includes a filter circuit board (66) and a support member (67). The filter circuit board (66) and the support member (67) are integrated. The inverter circuit section and the filter circuit section are structured to be capable of being stored each individually within an inverter storing section (8) from the same direction and detachably attached to the housing (2).

公开(公告)号：US11832390B2

公开(公告)日：2023-11-28

申请号：US17688473

申请日：2022-03-07

Applicant: Rolls-Royce Corporation

Inventor： Shuai Wang ,  Chandana J. Gajanayake ,  David R. Trawick

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K1/18 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10901

Abstract: An electrical assembly, such as a multi-layer bus bar, includes an electrical connection pin and a plurality of electrically conductive layers. Each of the electrically conductive layers is formed to define a cutout therein to receive the electrical connection pin and allow access for joining material to join the electrical connection pin with the plurality of electrically conductive layers. Each of the cutouts is formed to include a first portion arranged around the electrical connection pin and a second portion located radially outward of the first portion.

公开(公告)号：US09872389B2

公开(公告)日：2018-01-16

申请号：US14905134

申请日：2014-07-24

Applicant: LG DISPLAY CO., LTD.

Inventor： Ducksu Oh ,  Sung Soo Park ,  Minsoo Kang

IPC: H05K1/14 ,  H01L51/52 ,  H05K1/02 ,  H05K1/11 ,  H05K3/36 ,  H01L51/00 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/14 ,  H01L51/0097 ,  H01L51/5246 ,  H05K1/028 ,  H05K1/111 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/058 ,  H05K2201/09563 ,  H05K2201/10128 ,  H05K2201/10901

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

公开(公告)号：US20170149154A1

公开(公告)日：2017-05-25

申请号：US15423269

申请日：2017-02-02

Applicant: MERCURY SYSTEMS, INC.

Inventor： Darryl J. MCKENNEY ,  Absu METHRATTA ,  Erica OUELLETTE

IPC: H01R12/58 ,  H05K1/02 ,  H01R12/71

CPC classification number: H01R12/716 ,  H01R4/028 ,  H01R9/091 ,  H01R12/526 ,  H01R12/58 ,  H01R12/714 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/421 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10878 ,  H05K2201/10901 ,  Y02P70/611

Abstract: According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

公开(公告)号：US20160174373A1

公开(公告)日：2016-06-16

申请号：US14567402

申请日：2014-12-11

Applicant: Intel Corporation

Inventor： Beom-Taek Lee ,  Raul Enriquez Shibayama

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/115 ,  H01R12/585 ,  H01R12/718 ,  H01R31/06 ,  H05K1/147 ,  H05K1/184 ,  H05K2201/10295 ,  H05K2201/10356 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/1059 ,  H05K2201/10704 ,  H05K2201/10901

Abstract: In one embodiment, the apparatus comprises: a substrate having a first side and a second side, the second side being on an opposite side of the substrate from the first side, where the substrate has a first location on the first side at which an semiconductor package is to be coupled; and a cable coupled to the substrate on the second side of the substrate at a second location on the second side, the second location being at least partially below the first location.

Abstract translation: 在一个实施例中，该装置包括：具有第一侧和第二侧的衬底，第二侧与衬底的与第一侧相反的一侧，其中衬底在第一侧上具有第一位置， 包装要耦合; 以及在所述第二侧上的第二位置处耦合到所述衬底的所述第二侧上的所述衬底的电缆，所述第二位置至少部分地位于所述第一位置的下方。

公开(公告)号：US20090212444A1

公开(公告)日：2009-08-27

申请号：US12235616

申请日：2008-09-23

Applicant: Li-Cheng Shen

Inventor： Li-Cheng Shen

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H01L23/49827 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05001 ,  H01L2224/05111 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/9202 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/10674 ,  H05K2201/10901 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor package including a substrate, a circuit pattern, a chip, at least one conductive material and an adhesive is provided. The substrate has a first surface, a second surface opposite thereto, and at least one through hole which penetrates the first surface and the second surface. The circuit pattern structure is disposed on the second surface and has at least one connecting pad disposed at the through hole. The chip is disposed on the first surface of the substrate. The chip has at least one conductive post, wherein the conductive post and the conductive material are disposed inside the through hole, and the conductive post is electrically connected with the pattern circuit structure through the conductive material. The adhesive is disposed between the chip and the substrate. A manufacturing method of the semiconductor structure is also provided.

Abstract translation: 提供了包括基板，电路图案，芯片，至少一种导电材料和粘合剂的半导体封装。 基板具有第一表面，与其相对的第二表面和穿过第一表面和第二表面的至少一个通孔。 电路图形结构设置在第二表面上并且具有设置在通孔处的至少一个连接焊盘。 芯片设置在基板的第一表面上。 芯片具有至少一个导电柱，其中导电柱和导电材料设置在通孔的内部，并且导电柱通过导电材料与图案电路结构电连接。 粘合剂设置在芯片和基板之间。 还提供了半导体结构的制造方法。

公开(公告)号：US20080144260A1

公开(公告)日：2008-06-19

申请号：US11979972

申请日：2007-11-13

Applicant: Takayoshi Honda

Inventor： Takayoshi Honda

IPC: H05K7/00

CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: An electronic device includes a printed circuit board having lands and an electronic element having a body and terminals. First and second lands provide a zigzag pattern. Each first land is coupled with the first terminal, and each second land is coupled with the second terminal. The second terminal includes a first parallel member, a first connection member, a second parallel member and a first mounting member. The first parallel member is completely embedded in the body, or another part of the first parallel member exposed from the body is shorter than the second parallel member. A second height between the second parallel member and the printed circuit board is smaller than a first height between the first parallel member and the printed circuit board.

Abstract translation: 电子设备包括具有平台的印刷电路板和具有主体和端子的电子元件。 第一和第二个土地提供锯齿形图案。 每个第一焊盘与第一端子耦合，并且每个第二焊盘与第二端子耦合。 第二端子包括第一平行构件，第一连接构件，第二平行构件和第一安装构件。 第一平行构件完全嵌入主体中，或者从主体露出的第一平行构件的另一部分比第二平行构件短。 第二平行构件和印刷电路板之间的第二高度小于第一平行构件和印刷电路板之间的第一高度。