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    Method and apparatus for packaging phosphor-coated LEDs
    31.
    发明授权
    Method and apparatus for packaging phosphor-coated LEDs 有权
    用于包装磷光体涂覆的LED的方法和装置

    公开(公告)号：US09082942B2

    公开(公告)日：2015-07-14

    申请号：US14140973

    申请日：2013-12-26

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Min Lin

    IPC: H01L33/50 ,  H01L33/46

    CPC classification number: H01L33/504 ,  H01L33/46 ,  H01L33/505 ,  H01L2933/0041

    Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.

    Abstract translation: 本公开涉及封装发光二极管（LED）的方法。 根据该方法，在胶带上设置多个LED。 粘合带设置在基板上。 在一些实施例中，衬底可以是玻璃衬底，硅衬底，陶瓷衬底和氮化镓衬底。 磷光体层被涂覆在多个LED上。 然后将磷光体层固化。 在荧光体层固化之后去除胶带和基材。 然后将替代胶带附接到多个LED。 然后在去除衬底之后，对多个LED进行切割处理。 然后可以将去除的衬底重新用于将来的LED封装工艺。

    Cost-effective LED lighting instrument with good light output uniformity
    32.
    发明授权
    Cost-effective LED lighting instrument with good light output uniformity 有权
    性价比高的LED照明仪器具有良好的光输出均匀性

    公开(公告)号：US09048113B2

    公开(公告)日：2015-06-02

    申请号：US14181938

    申请日：2014-02-17

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Chih-Lin Wang

    IPC: H01L33/00 ,  F21K99/00 ,  F21S6/00 ,  F21V9/16 ,  H01L25/075 ,  F21Y101/02 ,  F21Y105/00

    CPC classification number: H01L25/0753 ,  F21K9/00 ,  F21S6/005 ,  F21V9/30 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A lighting instrument includes: a substrate; a plurality of first light-emitting diodes (LEDs) disposed over the substrate, wherein the first LEDs each have a first value range for a light output characteristic; a plurality of second LEDs disposed over the substrate, wherein the second LEDs each have a second value range for the light output characteristic, the second value range being different from the first value range; a phosphor layer located at a distance above the first LEDs and the second LEDs; and a light-reflective layer that is disposed on a surface of the phosphor layer; wherein the first LEDs interleave with the second LEDs according to a predefined pattern.

    Abstract translation: 照明器具包括：基板; 设置在所述基板上的多个第一发光二极管（LED），其中所述第一LED各自具有用于光输出特性的第一值范围; 设置在所述基板上的多个第二LED，其中所述第二LED各自具有用于所述光输出特性的第二值范围，所述第二值范围不同于所述第一值范围; 位于第一LED和第二LED上方的距离处的磷光体层; 以及设置在所述荧光体层的表面上的光反射层; 其中所述第一LED根据预定模式与所述第二LED交错。

    LED device with improved thermal performance
    33.
    发明授权
    LED device with improved thermal performance 有权
    具有改善热性能的LED器件

    公开(公告)号：US08993447B2

    公开(公告)日：2015-03-31

    申请号：US13858785

    申请日：2013-04-08

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Hsing-Kuo Hsia ,  Chih-Kuang Yu ,  Hung-Yi Kuo ,  Chyi Shyuan Chern

    IPC: H01L21/311 ,  H01L33/64

    CPC classification number: H01L33/64 ,  H01L25/075 ,  H01L33/54 ,  H01L33/58 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    Abstract: An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings.

    Abstract translation: 一种装置包括其中具有多个开口的晶片。 对于每个开口，LED器件以这样的方式耦合到导电载体和晶片，使得每个耦合的LED器件和导电载体的一部分至少部分地填充开口。 制造LED器件的方法包括在晶片中形成多个开口。 该方法还包括将发光二极管（LED）器件耦合到导电载体上。 具有导电载体的LED装置至少部分地填充每个开口。

    LIGHT COLOR AND INTENSITY ADJUSTABLE LED
    34.
    发明申请
    LIGHT COLOR AND INTENSITY ADJUSTABLE LED 有权
    光颜色和强度可调LED

    公开(公告)号：US20150054412A1

    公开(公告)日：2015-02-26

    申请号：US14524060

    申请日：2014-10-27

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Hsin-Chieh Huang

    IPC: H05B33/08

    CPC classification number: H05B33/0845 ,  F21V23/0457 ,  F21Y2115/10 ,  H05B33/0851 ,  H05B33/0869

    Abstract: An integrated photonic device includes a number of LEDs and a feedback mechanism that measures individual LED light outputs using a photo sensor via a light transmitter disposed in the vicinity of individual LEDs. A controller or driver adjusts a current driven to each LED using the detected values according to various logic based on the device application.

    Abstract translation: 集成光子器件包括多个LED和反馈机构，其通过布置在各个LED附近的光发射器使用光传感器来测量各个LED光输出。 根据设备应用的各种逻辑，控制器或驱动器使用检测到的值来调整驱动到每个LED的电流。

    METHOD AND APPARATUS FOR FABRICATING PHOSPHOR-COATED LED DIES
    35.
    发明申请
    METHOD AND APPARATUS FOR FABRICATING PHOSPHOR-COATED LED DIES 有权
    制造磷光涂料的方法和装置

    公开(公告)号：US20140291611A1

    公开(公告)日：2014-10-02

    申请号：US14305352

    申请日：2014-06-16

    Applicant: TSMC Solid State Lighting Ltd,

    Inventor： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Min Lin

    IPC: H01L33/50 ,  H01L27/15 ,  H01L33/06

    CPC classification number: H01L33/505 ,  H01L33/46 ,  H01L33/508 ,  H01L33/54 ,  H01L2933/0041

    Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A first conductive terminal and a second conductive terminal are each disposed below the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and on side surfaces of the first and second doped semiconductor layers and the light-emitting layer. A bottommost surface of the photo-conversion layer is located closer to the second doped semiconductor layer than bottom surfaces of the first and second conductive terminals.

    Abstract translation: 本公开涉及照明装置。 照明装置包括第一掺杂半导体层。 发光层设置在第一掺杂半导体层上。 第二掺杂半导体层设置在发光层上。 第二掺杂半导体层具有与第一掺杂半导体层不同的导电类型。 第一导电端子和第二导电端子分别设置在第一掺杂半导体层的下方。 光转换层设置在第二掺杂半导体层上以及第一和第二掺杂半导体层和发光层的侧表面上。 光转换层的最下表面比第一和第二导电端子的底表面更靠近第二掺杂半导体层。

    Methods of Forming Through Silicon Via Openings
    37.
    发明申请
    Methods of Forming Through Silicon Via Openings 有权
    通过开口形成硅的方法

    公开(公告)号：US20140235053A1

    公开(公告)日：2014-08-21

    申请号：US14267303

    申请日：2014-05-01

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Chyi Shyuan Chern ,  Hsin-Hsien Wu ,  Chun-Lin Chang ,  Hsing-Kuo Hsia ,  Hung-Yi Kuo

    IPC: H01L21/768

    CPC classification number: H01L21/76801 ,  H01L21/02057 ,  H01L21/3065 ,  H01L21/76898

    Abstract: A method of forming a through-silicon-via (TSV) opening includes forming a TSV opening through a substrate. A recast of a material of the substrate on sidewalls of the TSV opening is removed with a first chemical. The sidewalls of the TSV opening are cleaned with a second chemical by substantially removing a residue of the first chemical.

    Abstract translation: 形成贯通硅通孔（TSV）开口的方法包括通过基板形成TSV开口。 使用第一种化学物质去除在TSV开口的侧壁上的衬底的材料的重铸。 TSV开口的侧壁通过基本上除去第一种化学物质的残留物而用第二种化学品清洗。

    Method and apparatus for accurate die-to-wafer bonding
    40.
    发明授权
    Method and apparatus for accurate die-to-wafer bonding 有权
    用于准确的晶片到晶片键合的方法和装置

    公开(公告)号：US08722436B2

    公开(公告)日：2014-05-13

    申请号：US14088780

    申请日：2013-11-25

    Applicant: TSMC Solid State Lighting Ltd.

    Inventor： Chyi Shyuan Chern ,  Hsin-Hsien Wu ,  Chih-Kuang Yu ,  Hung-Yi Kuo

    IPC: H01L21/00

    CPC classification number: H01L33/62 ,  H01L23/49513 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/08 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

    Abstract: A method of light-emitting diode (LED) packaging includes coupling a number of LED dies to corresponding bonding pads on a sub-mount. A mold apparatus having concave recesses housing LED dies is placed over the sub-mount. The sub-mount, the LED dies, and the mold apparatus are heated in a thermal reflow process to bond the LED dies to the bonding pads. Each recess substantially restricts shifting of the LED die with respect to the bonding pad during the heating.

    Abstract translation: 一种发光二极管（LED）封装的方法包括将多个LED管芯耦合到子安装座上的对应焊盘。 具有容纳LED管芯的凹入凹槽的模具装置放置在子安装座上。 子载体，LED管芯和模具装置在热回流过程中被加热以将LED管芯接合到接合焊盘。 每个凹槽在加热期间基本上限制相对于接合焊盘的LED管芯的移位。

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