公开(公告)号：US09841281B2

公开(公告)日：2017-12-12

申请号：US14553595

申请日：2014-11-25

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chung-Yuan Su ,  Chun-Yin Tsai ,  Chao-Ta Huang

IPC: B81B3/00 ,  G01C19/5762

CPC classification number: G01C19/5762 ,  B81B3/0045 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0163 ,  Y10T74/12

Abstract: A micro-electromechanical apparatus includes a rotary element, at least one restraint and at least two folded springs. The rotary element is capable of rotating with respect to an axis. The folded springs are symmetrically disposed about the axis. Each folded spring has a moving end and a fixed end, the moving end is connected to the rotary element, and the fixed end is connected to the at least one restraint. The moving end is not located on the axis, and the fixed end is not located on the axis. A moving distance is defined as a distance between the moving end and the axis, a fixed distance is defined as a distance between the fixed end and the axis. A spring length is defined as a distance between the moving end and the fixed end. The spring length is varied according to the rotation of the rotary element.

公开(公告)号：US09829318B2

公开(公告)日：2017-11-28

申请号：US14694208

申请日：2015-04-23

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Anssi Blomqvist

IPC: G01C19/00 ,  G01C19/5762 ,  G01C19/5712 ,  G01C19/5747

CPC classification number: G01C19/5762 ,  B81B2201/0242 ,  B81B2201/033 ,  G01C19/5712 ,  G01C19/5747

Abstract: A microelectromechanical gyroscope structure for detecting angular motion about an axis of angular motion. A drive element is suspended for one-dimensional motion in a direction of a drive axis, and a sense body carries one or more sense rotor electrodes and is coupled to the drive element with a first directional spring structure that forces the sense body to move with the drive element and has a preferred direction of motion in a direction of a sense axis. The drive element includes an actuation body and a drive frame wherein the first spring structure couples the sense body directionally to the drive frame, and a second directional spring structure that couples the drive frame to the actuation body and has a preferred direction of motion in the direction of the sense axis.

公开(公告)号：US09815687B2

公开(公告)日：2017-11-14

申请号：US15085901

申请日：2016-03-30

Applicant: STMicroelectronics S.R.L.

Inventor： Angelo Antonio Merassi

IPC: G01L9/00 ,  B81B3/00 ,  G01P1/00 ,  G01P15/125 ,  G01P15/18 ,  G01P15/08

CPC classification number: B81B3/0072 ,  B81B2201/0242 ,  G01P1/006 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0831

Abstract: A micromechanical structure of a MEMS device, integrated in a die of semiconductor material provided with a substrate and having at least a first axis of symmetry lying in a horizontal plane, has a stator structure, which is fixed with respect to the substrate, and a rotor structure, having a suspended mass, mobile with respect to the substrate and to the stator structure as a result of an external action, the stator structure having fixed sensing electrodes capacitively coupled to the rotor structure; a compensation structure is integrated in the die for compensation of thermo-mechanical strains. The compensation structure has stator compensation electrodes, which are fixed with respect to the substrate, are capacitively coupled to the rotor structure, and are arranged symmetrically to the fixed sensing electrodes with respect to the first axis of symmetry.

公开(公告)号：US20170318396A1

公开(公告)日：2017-11-02

申请号：US15377627

申请日：2016-12-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto BRIOSCHI ,  Marco Omar GHIDONI

IPC: H04R19/04 ,  B81C1/00 ,  H04R31/00 ,  H04R1/44 ,  H04R7/06 ,  H04R19/00 ,  B81B7/04

CPC classification number: H04R19/04 ,  B06B1/0292 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2201/047 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R1/44 ,  H04R3/005 ,  H04R7/06 ,  H04R19/005 ,  H04R31/003 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

公开(公告)号：US20170313581A1

公开(公告)日：2017-11-02

申请号：US15643536

申请日：2017-07-07

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chun-wen CHENG ,  Hung-Chia TSAI ,  Lan-Lin CHAO ,  Yuan-Chih HSIEH ,  Ping-Yin LIU

IPC: B81C1/00

CPC classification number: B81C1/00246 ,  B81B2201/0242

Abstract: A method of making a micro electromechanical system (MEMS) package includes patterning a substrate to form a MEMS section. The method further includes bonding a carrier to a surface of the substrate. The carrier is free of active devices. The carrier includes a carrier bond pad on a surface of the carrier opposite the MEMS section. The carrier bond pad is electrically connected to the MEMS section. The method further includes bonding a wafer bond pad of an active circuit wafer to the carrier bond pad. The bonding of the wafer bond pad to the carrier bond pad includes re-graining the wafer bond pad to form at least one grain boundary extending from the wafer bond pad to the carrier bond pad.

公开(公告)号：US20170313574A1

公开(公告)日：2017-11-02

申请号：US15142806

申请日：2016-04-29

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： YUAN-CHIH HSIEH ,  HSING-LIEN LIN ,  JUNG-HUEI PENG ,  YI-CHIEN WU

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0005 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/04

Abstract: The present disclosure provides a method of manufacturing a structure. The method comprises: providing a first substrate; forming a plurality of conductive pads over the first substrate; forming a film on a first subset of the plurality of conductive pads, thereby leaving a second subset of the plurality of conductive pads exposed from the film; forming a self-assembled monolayer (SAM) over the film; and forming a cavity by the first substrate and a second substrate through bonding a portion of the second substrate to the second subset of the plurality of conductive pads that are exposed from the film.

公开(公告)号：US20170305740A1

公开(公告)日：2017-10-26

申请号：US15480015

申请日：2017-04-05

Applicant: Robert Bosch GmbH

Inventor： Steffen Zunft

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0016 ,  B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0163 ,  B81B2203/0315 ,  B81C1/00333 ,  B81C2203/0109 ,  B81C2203/0118

Abstract: A micromechanical device having a substrate wafer, a functional layer situated above it which has a mobile micromechanical structure, and a cap situated on top thereof, having a first cavity, which is formed at least by the substrate wafer and the cap and which includes the micromechanical structure. The micromechanical device has a fixed part and a mobile part, which are movably connected to each other with at least one spring element, and the first cavity is situated in the mobile part. Also described is a method for producing the micromechanical device.

公开(公告)号：US20170297908A1

公开(公告)日：2017-10-19

申请号：US15516322

申请日：2015-10-01

Applicant: Sergio Fabian ALMEIDA LOYA ,  David ZUBIA ,  Ernest J. GARCIA ,  Jose MIRELES, JR. ,  Board of Regents, The University of Texas System ,  Sandia National Laboratories

Inventor： Sergio Fabian Almeida Loya ,  David Zubia ,  Ernest J. Garcia ,  Jose Mireles, Jr.

IPC: B81B7/02 ,  B81B7/00 ,  G01P15/125 ,  B29C67/00

CPC classification number: B81B7/02 ,  B81B7/008 ,  B81B7/0087 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01P15/125

Abstract: A MEMS apparatus with dynamic displacement control includes a MEMS parallel plate capacitor integrated with one or more memristors in a series configuration wherein a displacement is observable as a function of memristance, such that an upper electrode position is capable of being interpreted in a form of a resistance rather than a capacitance. The current is limited by said MEMS parallel plate capacitor restricting a change in the resistance of the memristor(s). The memristor(s) can be employed in some embodiments a sensor element to improve a MEMS operation range.

公开(公告)号：US09790084B2

公开(公告)日：2017-10-17

申请号：US14536091

申请日：2014-11-07

Applicant: Robert Bosch GmbH

Inventor： Arnd Kaelberer ,  Jochen Reinmuth

IPC: G01P15/00 ,  G01C19/00 ,  B81B7/00 ,  G01P15/08 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00238 ,  B81C2203/0792 ,  G01P15/0802 ,  G01P2015/0882

Abstract: A micromechanical sensor device includes an evaluation circuit formed in a first substrate, and an MEMS structure which is situated in a cavity delimited by a second substrate and a third substrate, the MEMS structure and the second substrate being situated on top of each other, the MEMS structure being functionally connected to the evaluation circuit via a contact area, the contact area between the MEMS structure and the first substrate being situated essentially centrally on the second substrate and essentially centrally on the first substrate and has an essentially punctiform configuration, proceeding radially from the contact area, a clearance being formed between the first substrate and the second substrate.

公开(公告)号：US09764943B2

公开(公告)日：2017-09-19

申请号：US15361972

申请日：2016-11-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tsuyoshi Okami ,  Takashi Mizota ,  Yuki Ueya ,  Junya Matsuoka ,  Nobuaki Tsuji

IPC: B81B3/00 ,  G01C19/5762 ,  H01L41/113 ,  H01L41/12

CPC classification number: B81B3/0021 ,  B81B3/00 ,  B81B3/0045 ,  B81B2201/0228 ,  B81B2201/0242 ,  B81B2203/0154 ,  G01C19/5762 ,  H01L41/113 ,  H01L41/1132 ,  H01L41/125

Abstract: A MEMS structure includes a planar substrate, a support body coupled to the planar substrate, a fixed electrode coupled to the planar substrate and a moveable portion. The movable portion is spaced from and faces the fixed electrode. The movable electrode includes a movable weight and an intermediate frame surrounding an outer edge of the movable weight. A plurality of elastic supports connect the movable weight to the intermediate frame. The elastic supports are elastically deformable in a first direction extending parallel to the plane of the substrate such that the movable weight can move in the first direction. At least one torsion bar pivotally connects one end of the intermediate frame to the support body so as to allow the intermediate frame, and with it the movable weight, to pivot around an axis which extends parallel to the plane of the substrate and perpendicular to the first direction.