公开(公告)号：US20160161637A1

公开(公告)日：2016-06-09

申请号：US14794076

申请日：2015-07-08

Applicant: National Tsing Hua University

Inventor： Ta-Jen YEN ,  Ting-Tso YEH ,  Dong-Sheng SU

IPC: G02B1/00 ,  G02B5/20 ,  H05K1/09 ,  H05K1/03 ,  H05K1/02

CPC classification number: G02B1/002 ,  G02B5/3058 ,  H05K1/097 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/09681 ,  H05K2201/10128

Abstract: A transparent conducting electrode using a metamaterial high pass filter includes a substrate and a metal layer. The metal layer is disposed on a surface of the substrate and has a plurality of periodic patterns, wherein the plurality of periodic patterns are interconnected to form a metamaterial structure with subwavelength meshes, and a size of open area of the periodic pattern is smaller than the average wavelength of visible light. The abovementioned transparent conducting electrode using the metamaterial high pass filter has advantages of higher transmittance, conductivity and flexibility and lower process temperature.

Abstract translation: 使用超材料高通滤波器的透明导电电极包括基板和金属层。 金属层设置在基板的表面上并且具有多个周期性图案，其中多个周期性图案互连以形成具有亚波长网格的超材料结构，并且周期性图案的开口面积的尺寸小于 可见光的平均波长。 使用超材料高通滤波器的上述透明导电电极具有透光率，导电性和柔性更高，工艺温度更低的优点。

公开(公告)号：US09335034B2

公开(公告)日：2016-05-10

申请号：US14040578

申请日：2013-09-27

Applicant: Richard Speer ,  Adam Scotch ,  Jeffery Serre ,  Sridharan Venk

Inventor： Richard Speer ,  Adam Scotch ,  Jeffery Serre ,  Sridharan Venk

IPC: H05K1/00 ,  F21V21/14 ,  F21K99/00 ,  H05K1/02 ,  H05K1/18 ,  H01L33/62 ,  H05K1/03 ,  H05K3/28

CPC classification number: F21V21/14 ,  F21K9/90 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0066 ,  H05K1/0281 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0145 ,  H05K2201/10106 ,  H05K2201/2009 ,  Y10T29/49133 ,  H01L2924/00014

Abstract: A flexible circuit board is described that includes a flexible substrate, at least one ridge defining a flexion zone and a component mounting area. The flexion zone acting to dissipate at least a portion of a force applied to the substrate, so as to insulate the component mounting area from the force. Light sources using such flexible circuit boards and methods for making such circuit boards are also described.

Abstract translation: 描述了一种柔性电路板，其包括柔性基板，限定弯曲区域的至少一个脊和部件安装区域。 所述屈曲区用于消散施加到所述基底的力的至少一部分，以使所述部件安装区域与所述力绝缘。 还描述了使用这种柔性电路板的光源和用于制造这种电路板的方法。

公开(公告)号：US20160121364A1

公开(公告)日：2016-05-05

申请号：US14591134

申请日：2015-01-07

Applicant: NANOBIT TECH. CO., LTD.

Inventor： Shiou-Ming LIU ,  Yu-Yang CHANG ,  Shuei-Chuan WANG

IPC: B05D3/02 ,  B05B15/00 ,  B05D3/06

CPC classification number: H05K3/1283 ,  G06F3/041 ,  G06F2203/04103 ,  H01B1/24 ,  H05K2201/0145 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/1545

Abstract: A baking method for metallic paste on transparent substrate first prepares a thin transparent substrate coated with metallic paste and the thin transparent substrate is arranged in roll-to-roll or in batch to a baking area of a baking device. A near-infrared light source with a predetermined distance with the baking area is provided, and the near-infrared light source irradiates a near-infrared light with predetermined wavelength to the thin transparent substrate for baking process. In baking operation, the thin transparent substrate is placed on the baking area for static baking or dynamic baking. The thin transparent substrate is then sent to a cooling stabilization area for normal cooling.

Abstract translation: 在透明基板上的金属膏的烘烤方法首先准备涂布有金属膏的薄的透明基板，并且将薄的透明基板配置成一个烘烤装置的烘烤区域。 提供与烘烤区域具有预定距离的近红外光源，并且近红外光源将具有预定波长的近红外光照射到用于烘烤处理的薄透明基板。 在烘烤操作中，将薄的透明基板放置在烘烤区域上用于静态烘烤或动态烘烤。 然后将薄的透明基板送到冷却稳定区域以进行正常冷却。

公开(公告)号：US09320139B2

公开(公告)日：2016-04-19

申请号：US14299017

申请日：2014-06-09

Applicant: BOARDTEK ELECTRONICS CORPORATION

Inventor： Chien-Cheng Lee

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0284 ,  H05K1/0326 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/10424 ,  H05K2201/2018

Abstract: A circuit board having an interior space includes a multi-layer structure and a compartmentalized frame embedded in the multi-layer structure. The multi-layer structure has a plurality of plates stacked along a stacking direction and a gel combining any two adjacent plates. The plates include two outer plates and at least one inner plate arranged between the outer plates. The compartmentalized frame defines a predetermined space. The compartmentalized frame is arranged between the outer plates and substantially abuts the outer plates. The compartmentalized frame is arranged in a path of a flowing direction of gel which flows toward the predetermined space to prevent any gel from flowing into the predetermined space. Thus, the circuit board of the instant disclosure is provided with the interior space accurately formed by embedding the compartmentalized frame.

Abstract translation: 具有内部空间的电路板包括多层结构和嵌入多层结构中的分隔框架。 多层结构具有多个层叠堆叠的板和凝胶组合任何两个相邻的板。 板包括两个外板和布置在外板之间的至少一个内板。 分隔框架限定了预定的空间。 分隔框架布置在外板之间并且基本上邻接外板。 分隔框架布置在朝向预定空间流动的凝胶流动方向的路径中，以防止任何凝胶流入预定空间。 因此，本公开的电路板设置有通过嵌入隔间框架而精确地形成的内部空间。

公开(公告)号：US09313886B2

公开(公告)日：2016-04-12

申请号：US14447575

申请日：2014-07-30

Applicant: Chao-Min Wang

Inventor： Chao-Min Wang

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  H05K3/14

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/49866 ,  H01L2221/68345 ,  H01L2221/68381 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/09 ,  H05K3/0058 ,  H05K3/0061 ,  H05K3/048 ,  H05K3/06 ,  H05K3/064 ,  H05K3/14 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0145 ,  H05K2203/0152 ,  H05K2203/0502 ,  H05K2203/0548 ,  H05K2203/066

Abstract: A manufacturing method of a substrate structure includes the following steps. A substrate including a supporting layer, two release layers and two base metal layers is provided. The release layers are disposed on two opposite surfaces of the supporting layer respectively. Each base metal layer covers each of the release layers. A first patterned solder-resist layer is formed on each of the base metal layers. A stacking layer is laminated on each of the base metal layers to cover each of the first patterned solder-resist layers. Each stacking layer includes a dielectric layer and a metal foil. Each dielectric layer is disposed between the corresponding base metal layer and the corresponding metal foil. Each base metal layer is separated from the supporting layer. Each base metal layer is patterned to form a patterned metal layer on each stacking layer. Each patterned metal layer exposes the corresponding first patterned solder-resist layer.

Abstract translation: 衬底结构的制造方法包括以下步骤。 提供了包括支撑层，两个释放层和两个基底金属层的基板。 剥离层分别设置在支撑层的两个相对的表面上。 每个基底金属层覆盖每个释放层。 在每个基底金属层上形成第一图案化的阻焊层。 在每个基底金属层上层叠堆叠层以覆盖每个第一图案化阻焊层。 每个堆叠层包括电介质层和金属箔。 每个电介质层设置在相应的基底金属层和相应的金属箔之间。 每个基底金属层与支撑层分离。 每个基底金属层被图案化以在每个堆叠层上形成图案化的金属层。 每个图案化的金属层暴露相应的第一图案化的阻焊层。

公开(公告)号：US20160095227A1

公开(公告)日：2016-03-31

申请号：US14892345

申请日：2014-11-10

Applicant: NIPPON MEKTRON, LTD.

Inventor： Shoji TAKANO ,  Fumihiko MATSUDA

IPC: H05K3/10 ,  H05K3/46 ,  H05K3/40 ,  H05K3/00

CPC classification number: H05K3/101 ,  H05K1/09 ,  H05K3/0014 ,  H05K3/0044 ,  H05K3/005 ,  H05K3/0094 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0264 ,  H05K2203/0568 ,  H05K2203/1178 ,  H05K2203/1461

Abstract: A filling method of conductive paste includes a step of providing a protective film on a principal surface of a metal foil clad laminated sheet, a step of forming bottomed via holes, a step of from a surface to a midway thereof to forma conductive paste flowing groove having the via holes, a step of disposing a housing member on the film, and thereby, causing conductive paste injecting channel and a vacuum evacuating channel to communicate with a conductive paste flowing space S, a step of depressurizing the space S via the channel, and a step of injecting conductive paste into the space S via the channel, and thereby, filling an inside of the via holes with the conductive paste.

Abstract translation: 导电浆料的填充方法包括在金属箔复合层叠片的主面上设置保护膜的步骤，形成有底通孔的步骤，从表面到中途的步骤，形成导电糊流动槽 具有通孔，将壳体部件设置在膜上的步骤，从而使导电浆料注入通道和真空排气通道与导电浆料流动空间S连通，经由通道减压空间S的步骤， 以及经由通道将导电膏注入到空间S中的步骤，由此用导电膏填充通孔的内部。

公开(公告)号：US20160053072A1

公开(公告)日：2016-02-25

申请号：US14753055

申请日：2015-06-29

Applicant: Ticona LLC

Inventor： Paul C. Yung ,  Michael Schaefer

IPC: C08K3/10 ,  C08K3/32 ,  H05K1/03 ,  C08K3/30 ,  C08K7/10 ,  C08K3/34 ,  C08K3/40

CPC classification number: C08K3/10 ,  C08G63/605 ,  C08K3/22 ,  C08K3/30 ,  C08K3/32 ,  C08K3/34 ,  C08K3/40 ,  C08K7/10 ,  C08K2003/2248 ,  C08K2003/2251 ,  C08K2003/3045 ,  C08K2003/325 ,  C08K2201/005 ,  C08L67/03 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/165 ,  H05K3/105 ,  H05K3/106 ,  H05K3/185 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0266 ,  H05K2201/10098 ,  H05K2203/107 ,  C08L67/00

Abstract: A polymer composition that comprises an aromatic polyester, a laser activatable additive, and a mineral filler is provided. The mineral filler has a median size of about 35 micrometers or less and the laser activatable additive has a mean size of about 1000 nanometers or less.

Abstract translation: 提供了包含芳族聚酯，激光可激活添加剂和矿物填料的聚合物组合物。 矿物填料的中值粒径约为35微米或更小，激光活化添加剂的平均粒径约为1000纳米或更小。

公开(公告)号：US20150382445A1

公开(公告)日：2015-12-31

申请号：US14315380

申请日：2014-06-26

Applicant: HICEL CO., LTD.

Inventor： Eun Kuk Choi

IPC: H05K1/02 ,  C23C18/31 ,  H05K3/00 ,  C23C18/16 ,  H05K1/11 ,  H05K1/09

CPC classification number: C23C18/31 ,  C23C18/1633 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/40 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/115 ,  H05K1/189 ,  H05K3/246 ,  H05K2201/0145 ,  H05K2201/0154

Abstract: Disclosed is a double-sided flexible printed circuit board, including a flexible substrate including at least one via hole and a via formed therein to connect circuit wirings respectively formed on both sides of the substrate; a patterned wiring layer formed by printing a conductive paste composition in a predetermined circuit wiring pattern on each of both sides of the flexible substrate; an electroless metal plating layer formed on the patterned wiring layer; and a metal plating layer additionally formed on the electroless metal plating layer to increase electrical conductivity of a wiring including the patterned wiring layer and the electroless metal plating layer formed on each of both sides of the flexible substrate, wherein the circuit wirings respectively patterned on both sides of the flexible substrate are electrically connected to each other through the via formed in the via hole. Also provided is a method of manufacturing the same.

Abstract translation: 公开了一种双面柔性印刷电路板，包括柔性基板，其包括至少一个通孔和形成在其中的通孔，以连接分别形成在基板两侧的电路布线; 通过在柔性基板的两侧的每一侧的预定电路布线图案中印刷导电糊组合物形成的图案化布线层; 形成在图案化的布线层上的无电镀金属层; 以及另外形成在所述无电金属镀层上的金属镀层，以增加包括形成在所述柔性基板的两侧上的所述图案化布线层和所述化学镀金层的布线的导电性，其中，在两者上分别图案化的电路布线 柔性基板的侧面通过形成在通孔中的通孔彼此电连接。 还提供了制造该方法的方法。

公开(公告)号：US20150373839A1

公开(公告)日：2015-12-24

申请号：US14746984

申请日：2015-06-23

Applicant: LG INNOTEK CO., LTD.

Inventor： Soo Keun KIM ,  Ji Chang RYU ,  Jae Hak HER

IPC: H05K1/02 ,  G06F3/0354 ,  G06F3/047 ,  G06F3/041 ,  G06F3/044

CPC classification number: H05K1/0271 ,  G06F3/03545 ,  G06F3/0412 ,  G06F3/044 ,  G06F3/047 ,  G06F2203/04101 ,  G06F2203/04107 ,  G06F2203/04111 ,  G06F2203/04112 ,  G06F2203/04808 ,  G06F2203/04809 ,  H05K1/0274 ,  H05K2201/0145

Abstract: Provided is a touch panel including a cover substrate including an active area and an unactive area, and a printing layer on the unactive area. The printing layer has surface roughness in a range of 0.4 μm to 0.6 μm. The printing layer has straightness in a range of ±0.1 μm to ±10 μm.

Abstract translation: 提供了一种触摸面板，其包括具有活动区域和非活动区域的盖基板，以及在非活动区域上的印刷层。 印刷层的表面粗糙度在0.4μm至0.6μm的范围内。 印刷层的平直度在±0.1μm〜±10μm的范围内。

公开(公告)号：US20150342036A1

公开(公告)日：2015-11-26

申请号：US14819040

申请日：2015-08-05

Applicant: MC10, Inc.

Inventor： Brian David Elolampi ,  Roozbeh Ghaffari ,  Bassel de Graff ,  William J. Aurora ,  Xiaolong Hu

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  H05K3/06

CPC classification number: H05K1/0278 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/4985 ,  H01L23/5389 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/1461 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/115 ,  H05K3/067 ,  H05K3/4644 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H01L2924/00

Abstract: Flexible electronic structure and methods for fabricating flexible electronic structures are provided. An example method includes applying a first layer to a substrate, creating a plurality of vias through the first layer to the substrate, and applying a second polymer layer to the first layer such that the second polymer forms anchors contacting at least a portion of the substrate. At least one electronic device layer is disposed on a portion of the second polymer layer. At least one trench is formed through the second polymer layer to expose at least a portion of the first layer. At least a portion of the first layer is removed by exposing the structure to a selective etchant to providing a flexible electronic structure that is in contact with the substrate. The electronic structure can be released from the substrate.

Abstract translation: 提供了灵活的电子结构和制造柔性电子结构的方法。 一个示例性方法包括将第一层施加到衬底，产生通过第一层到衬底的多个通孔，以及向第一层施加第二聚合物层，使得第二聚合物形成与衬底的至少一部分接触的锚固件 。 至少一个电子器件层设置在第二聚合物层的一部分上。 通过第二聚合物层形成至少一个沟槽以暴露第一层的至少一部分。 通过将结构暴露于选择性蚀刻剂以提供与衬底接触的柔性电子结构来去除第一层的至少一部分。 电子结构可以从衬底释放。