公开(公告)号：US20060040522A1

公开(公告)日：2006-02-23

申请号：US11211810

申请日：2005-08-25

Applicant: Thomas Distefano ,  Joseph Fjelstad

Inventor： Thomas Distefano ,  Joseph Fjelstad

IPC: H05K1/00

CPC classification number: H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

Abstract: A microelectronic interposer is made by providing a sacrificial layer over the surface of a planar body. Apertures are formed passing through the body and the sacrificial layer. A layer of an electrically conductive structural material is deposited in each of the apertures and over the sacrificial layer, proximate to each aperture to thereby form contacts. The sacrificial layer is removed leaving the contacts with outwardly flaring peripheral portions spaced vertically above the surface of the planar body.

Abstract translation: 通过在平面体的表面上设置牺牲层来制造微电子插入器。 形成穿过身体和牺牲层的孔。 一层导电结构材料沉积在每个孔中并在牺牲层上方，靠近每个孔，从而形成接触。 去除牺牲层，留下接触件，其外部扩张的外围部分在平面体的表面上方垂直地间隔开。

公开(公告)号：US20050158916A1

公开(公告)日：2005-07-21

申请号：US10998277

申请日：2004-11-24

Applicant: Koichi Hirano ,  Seiichi Nakatani ,  Mitsuhiro Matsuo ,  Yoshihisa Yamashita

Inventor： Koichi Hirano ,  Seiichi Nakatani ,  Mitsuhiro Matsuo ,  Yoshihisa Yamashita

IPC: C08J5/18 ,  B29C43/18 ,  C08K3/00 ,  C08L101/00 ,  H01L23/373 ,  H01L23/433 ,  H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K3/20 ,  H05K3/40 ,  H05K7/20 ,  H01L21/44

CPC classification number: H05K7/205 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/202 ,  H05K3/4084 ,  H05K7/20463 ,  H05K2201/0209 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/0969 ,  H05K2201/10416 ,  H05K2203/1189 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49171 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. Accordingly, there are provided a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection reliability, a method of manufacturing the same, and a power module allowing its size to be reduced and its density to be increased.

Abstract translation: 一种片状导热性树脂组合物，其含有70〜95重量％ ％无机填料和5〜30wt。 热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。 因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。 因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。 因此，提供了具有高散热，高导电性和高接地连接可靠性的导热电路板，其制造方法以及允许其尺寸减小并且其密度增加的功率模块。

公开(公告)号：US06877221B2

公开(公告)日：2005-04-12

申请号：US10123290

申请日：2002-04-16

Applicant: Birger Karlsson ,  Lars-Anders Olofsson ,  Christer Olsson

Inventor： Birger Karlsson ,  Lars-Anders Olofsson ,  Christer Olsson

IPC: H05K3/40 ,  H05K3/00

CPC classification number: H05K3/4046 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2203/0195 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49165 ,  Y10T29/5327

Abstract: The present invention relates to a copper ball insertion machine, for integrating metal inserts in via holes provided through a printed circuit board (PCB), comprising a motor driven X-Y table (2) with the PCB on top. The X-Y table (2) is adjustable to position a selected via hole in a predetermined location aligned with a closable outlet opening (12) of a movable container (6) for metal inserts. The container is by means of a clamping cylinder (28) displaceable for clamping the part of the PCB adjacent said via hole against the working surface (2) of said X-Y table. By means of a pivoting cylinder (20) the container is rotatable for feeding one metal insert through the outlet opening (12) into said via hole. A stamp (30) is drivable by a hammer cylinder (40) for compressing said metal insert to shape and deform it into a tight fit with the via hole.

Abstract translation: 铜球插入机技术领域本发明涉及一种用于将通过印刷电路板（PCB）提供的通孔中的金属插入件集成在一起的铜球插入机，包括具有PCB顶部的电动机驱动的X-Y台（2）。 X-Y工作台（2）是可调节的，以将选定的通孔定位在与用于金属插入件的可移动容器（6）的可关闭出口（12）对准的预定位置。 该容器借助于可移动的夹紧缸（28），用于将邻近所述通孔的部分PCB夹紧在所述X-Y工作台的工作表面（2）上。 通过枢转圆筒（20），容器可旋转，以将一个金属插入件通过出口开口（12）进入所述通孔。 邮票（30）可以由锤筒（40）驱动，用于压缩所述金属插入件以使其形状变形成与通孔紧密配合。

公开(公告)号：US06875962B2

公开(公告)日：2005-04-05

申请号：US10466750

申请日：2002-01-17

Applicant: Günther Uhl ,  Steffen Geiger ,  Thomas Alban ,  Thomas Giffels ,  Dirk Wenske ,  Andreas Hamburger ,  Mike Riether

Inventor： Günther Uhl ,  Steffen Geiger ,  Thomas Alban ,  Thomas Giffels ,  Dirk Wenske ,  Andreas Hamburger ,  Mike Riether

IPC: B60H1/03 ,  B60H1/22 ,  H05K1/02 ,  H05K3/38 ,  H05K3/40 ,  H05B3/06

CPC classification number: B60H1/2225 ,  B60H1/034 ,  F24H3/0441 ,  H05K1/0206 ,  H05K3/0061 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/0382 ,  H05K2201/10166 ,  H05K2201/2036 ,  H05K2203/0315

Abstract: An electric heating system for motor vehicles including one or several electric heating elements; a control circuit provided for controlling the power dissipated by the heating elements; the control circuit including one or several power semiconductors arranged on a circuit board; the circuit board is by means of a solid matter connection connected by the side facing away from the power semiconductors to a metal plate intended to be mass potential; the metal plate being electrically insulated from conductor paths located on the underside of the circuit board and intended to carry a voltage in relation to the ground potential; the control circuit being arranged in a housing. One or several heat sinks are provided outside the housing. The metal plate is connected with the heat sinks arranged outside the housing by thermally conductive connectors.

Abstract translation: 一种用于机动车辆的电加热系统，包括一个或多个电加热元件; 控制电路，用于控制由所述加热元件消耗的功率; 所述控制电路包括布置在电路板上的一个或多个功率半导体; 电路板是借助于一个固体物质的连接方式，该固体物质连接通过一个远离功率半导体的一侧连接到一个意图成为质量电势的金属板; 金属板与位于电路板的下侧上的导体路径电绝缘并且旨在承载相对于地电势的电压; 控制电路布置在壳体中。 一个或多个散热器设置在外壳的外部。 金属板通过导热连接器与布置在壳体外部的散热器连接。

公开(公告)号：US06827867B2

公开(公告)日：2004-12-07

申请号：US09855382

申请日：2001-05-15

Applicant: Takuya Yamamoto ,  Takashi Kataoka ,  Yutaka Hirasawa

Inventor： Takuya Yamamoto ,  Takashi Kataoka ,  Yutaka Hirasawa

IPC: H01B1300

CPC classification number: H05K3/025 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/384 ,  H05K3/4652 ,  H05K2201/0382

Abstract: A printed wiring board manufacturing method is provided which is so consitituted that when a carbon dioxide leaser is used to form holes such as via holes in a copper clad laminate, copper foils and resin layers may be processed at the same time, without having to perform an etching treatment on the cooper foil. Namely, a carbon dioxide laser is used to form recess portions such as via holes in a copper clad laminate, followed by plating to form interlayer electrical connections, forming etching resist layers, and exposing and developing the etching resist layers, thereby effecting a circuit etching treatment. In particular, the copper clad laminate is a laminate formed by using waved copper foils to form external copper foils.

Abstract translation: 提供一种印刷电路板的制造方法，其特征在于，当使用二氧化碳激光器在铜包覆层压板中形成诸如通孔的孔时，铜箔和树脂层可以同时被处理，而不必执行 对铜箔进行蚀刻处理。 即，使用二氧化碳激光器在覆铜层压板中形成诸如通孔的凹部，然后进行电镀以形成层间电连接，形成抗蚀剂层，以及曝光和显影抗蚀剂层，从而进行电路蚀刻 治疗。 特别地，覆铜层压板是通过使用波形铜箔形成外部铜箔形成的层压体。

公开(公告)号：US20040183094A1

公开(公告)日：2004-09-23

申请号：US10768836

申请日：2004-01-29

Applicant: International Business Machines Corporation

Inventor： David Vincent Caletka ,  Krishna Darbha ,  Donald W. Henderson ,  Lawrence P. Lehman ,  George Henry Thiel

IPC: H01L031/111 ,  H01L029/74

CPC classification number: H01L23/49811 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/563 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05026 ,  H01L2224/05078 ,  H01L2224/05551 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/113 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/0382 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49171 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05552

Abstract: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.

公开(公告)号：US06751860B2

公开(公告)日：2004-06-22

申请号：US10229288

申请日：2002-08-28

Applicant: Yuichi Watanabe ,  Hisashi Ohtsuki

Inventor： Yuichi Watanabe ,  Hisashi Ohtsuki

IPC: H05K300

CPC classification number: H05K3/041 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/4092 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09118 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49153

Abstract: The present invention provides a method of making an electronic parts mounting board, comprising the steps of: punching a conductive sheet to form a circuit pattern portion and through-holes in which electronic parts are to be mounted by use of a progressive die device while at the same time partially folding said circuit pattern portion to form connection terminal portions by use of said same progressive die device; and molding an insulative resin over the whole opposite sides of said circuit pattern portion and the base ends of the terminal portions including the folded parts thereof to form an integral covering portion having openings for electrically connecting said circuit pattern portion to electronic parts to be mounted thereon.

Abstract translation: 本发明提供一种制造电子部件安装板的方法，包括以下步骤：在导电片上冲压导电片以形成电路图案部分和通过使用渐进式模具装置安装电子部件的通孔，同时在 同时部分地折叠所述电路图形部分以通过使用所述相同的渐进式模具装置形成连接端子部分; 以及在所述电路图形部分的整个相对侧和包括其折叠部分的端子部分的基端部上模制绝缘树脂以形成具有用于将所述电路图案部分电连接到要安装在其上的电子部件的开口的整体覆盖部分。

公开(公告)号：US20040045159A1

公开(公告)日：2004-03-11

申请号：US10658941

申请日：2003-09-10

Applicant: Tessera, Inc.

Inventor： Thomas H. DiStefano ,  Joseph Fjelstad

IPC: C09J001/00

CPC classification number: H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

Abstract: An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a contact pad defining a central hole on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts contract radially inwardly and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.

公开(公告)号：US06638858B2

公开(公告)日：2003-10-28

申请号：US10020700

申请日：2001-10-30

Applicant: David C. H. Cheng

Inventor： David C. H. Cheng

IPC: H01L2144

CPC classification number: H05K3/4046 ,  H01L21/4853 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/10234

Abstract: A hole metal-filling method, applied to hole filling and electroplating a printed circuit board which has been mechanical-drilled with holes. A plurality of holes is drilled in a substrate. The substrate is placed on a platform. A plurality of metal balls is disposed on a surface of the substrate. By vibrating the platform, a part of the metal balls roll into the holes, while the metal balls not rolling into the holes are removed. The substrate is then placed on a press down unit. The metal balls in the holes are pressed to level with surfaces of the substrate. The substrate is directly electroplated for forming a plating layer closely dovetail to the metal balls.

Abstract translation: 孔金属填充方法，适用于已经机械钻孔的印刷电路板的孔填充和电镀。 在基板上钻出多个孔。 将基板放置在平台上。 多个金属球设置在基板的表面上。 通过振动平台，金属球的一部分滚动到孔中，而不会滚动到孔中的金属球被去除。 然后将基板放置在压下单元上。 孔中的金属球被压制以与基底的表面平齐。 将基板直接电镀以形成与金属球紧密接合的镀层。

公开(公告)号：US06630839B1

公开(公告)日：2003-10-07

申请号：US09531686

申请日：2000-03-20

Applicant: Makoto Haseyama ,  Shigeyuki Maruyama

Inventor： Makoto Haseyama ,  Shigeyuki Maruyama

IPC: G01R3126

CPC classification number: G01R1/06761 ,  G01R1/0735 ,  G01R3/00 ,  H05K3/244 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  Y10T29/49147 ,  Y10T29/49151

Abstract: A contactor is used for testing an integrated circuit electronic component provided with a plurality of electrodes. The contactor includes an insulating base material provided with holes formed at positions corresponding to the electrodes, a first conductive layer having contacts which are plastically deformed portions of the first conductive layer, and reinforcement members provided on the contacts on a first surface of the contacts. The first surface of the contacts is facing towards the holes. The contacts are provided at positions corresponding to the electrodes for enabling an electrical connection to the electronic component and are protruded from the insulating base material.

Abstract translation: 接触器用于测试设置有多个电极的集成电路电子部件。 接触器包括：绝缘基材，在与电极对应的位置形成有孔，第一导电层具有第一导电层的塑性变形部分的触点，以及设置在触点的第一表面上的触点上的加强部件。 触点的第一表面朝向孔。 触点设置在与电极对应的位置处，用于能够与电子部件电连接并从绝缘基材突出。