公开(公告)号：US20070263998A1

公开(公告)日：2007-11-15

申请号：US11798213

申请日：2007-05-11

Applicant: Chih-Hsien Lien ,  Chin-Wen Lo ,  Yu-Jen Tsai

Inventor： Chih-Hsien Lien ,  Chin-Wen Lo ,  Yu-Jen Tsai

IPC: G02B7/04

CPC classification number: H05K1/189 ,  G02F1/13452 ,  H05K1/0393 ,  H05K2201/046 ,  H05K2201/09063

Abstract: The present invention provides a liquid crystal display module including housing, a flexible printed circuit board and a plurality of electric devices. The housing has at least a receiving notch. The flexible printed circuit board has a flexible substrate and at least an extension substrate projected from the flexible substrate to mount electric devices thereon. The extension substrate may be bent and received in the receiving notch of the housing to achieve the purpose of mounting more electric device on the flexible printed circuit board without having to increase the size of module.

Abstract translation: 本发明提供一种液晶显示模块，包括壳体，柔性印刷电路板和多个电气装置。 外壳至少有一个接收口。 柔性印刷电路板具有柔性基板和至少一个从柔性基板突出的延伸基板，以在其上安装电气设备。 延伸基板可以弯曲并容纳在壳体的接收凹口中，以实现将更多电气装置安装在柔性印刷电路板上的目的，而不必增加模块的尺寸。

公开(公告)号：US5031027A

公开(公告)日：1991-07-09

申请号：US552039

申请日：1990-07-13

Applicant: Dale W. Dorinski ,  Barry M. Miles ,  David E. Reiff

Inventor： Dale W. Dorinski ,  Barry M. Miles ,  David E. Reiff

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K9/00

CPC classification number: H05K1/189 ,  H05K9/0039 ,  H05K1/0218 ,  H05K1/0393 ,  H05K2201/046 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/2009 ,  H05K2203/1311 ,  H05K3/0058 ,  H05K3/284

Abstract: A flexible substrate (100) carries circuitry (102) in one area of the substrate and other portions of the substrate are at least partially covered with conductive material (206) to provide a ground plane. The substrate is folded about the circuitry to form an enclosure shielding the circuit.

Abstract translation: 柔性基板（100）在基板的一个区域中承载电路（102），并且基板的其它部分至少部分地被导电材料（206）覆盖以提供接地平面。 基板围绕电路折叠以形成屏蔽电路的外壳。

公开(公告)号：US4085433A

公开(公告)日：1978-04-18

申请号：US744136

申请日：1976-11-22

Applicant: Conrad J. Baranowski

Inventor： Conrad J. Baranowski

IPC: H05K1/18 ,  H05K1/04

CPC classification number: H05K1/189 ,  H05K2201/042 ,  H05K2201/046 ,  H05K2201/09445 ,  H05K2201/10303 ,  H05K2201/10454 ,  H05K2201/10515 ,  H05K2201/10651

Abstract: A method for increasing the packaging density of discrete electronic components. The components are mounted to a flexible printed circuit board at predetermined locations with normal orientation with respect to the board. The board is then folded in such a manner that the bodies of the components are mutually interleaved and are interleaved with other circuit components and terminals. A package with such interleaved components is also disclosed.

Abstract translation: 一种用于提高分立电子部件的封装密度的方法。 组件在相对于板的正常定向的预定位置安装到柔性印刷电路板。 然后以这样一种方式折叠该板，使得这些部件的主体相互交错并与其他电路部件和端子交错。 还公开了具有这种交错部件的封装。

公开(公告)号：US3755717A

公开(公告)日：1973-08-28

申请号：US3755717D

申请日：1972-05-12

Applicant: LUCAS INDUSTRIES LTD

Inventor： SHAW J

IPC: H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K1/04

CPC classification number: H05K1/189 ,  H05K1/05 ,  H05K3/0058 ,  H05K2201/046 ,  H05K2201/056 ,  H05K2201/064 ,  H05K2201/2009

Abstract: A flexible electric wiring arrangement has an insulating sheet carrying a conductor pattern. The sheet is slotted and folded so as to be cruciform in plan and so that one side of the sheet defines eight outwardly directed surfaces to which components can be attached.

Abstract translation: 柔性电布线布置具有承载导体图案的绝缘片。 片材被开槽和折叠成十字形的平面图，并且片材的一侧限定八个向外指向的表面，部件可以附接到该表面。

公开(公告)号：US3505570A

公开(公告)日：1970-04-07

申请号：US3505570D

申请日：1968-03-08

Applicant: EDGAR O SPRUDE ,  WILBUR E HESS

Inventor： SPRUDE EDGAR O ,  HESS WILBUR E

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H02B1/04 ,  H02B9/00

CPC classification number: H05K1/189 ,  H05K1/145 ,  H05K3/0058 ,  H05K2201/042 ,  H05K2201/046 ,  H05K2201/052 ,  H05K2201/056 ,  H05K2201/09709 ,  H05K2201/10446 ,  H05K2201/10651 ,  H05K2201/2009

公开(公告)号：US11672079B2

公开(公告)日：2023-06-06

申请号：US17444364

申请日：2021-08-03

Applicant: AT&S (China) Co. Ltd.

Inventor： Nick Xin ,  Mikael Tuominen

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/0277 ,  H05K1/0278 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/118 ,  H05K1/148 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/058

Abstract: A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion.

公开(公告)号：US09923107B2

公开(公告)日：2018-03-20

申请号：US14795653

申请日：2015-07-09

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Kazumasa Toya ,  Takashi Iwasaki ,  Youichi Nagai ,  Koji Mori ,  Kenji Saito ,  Rui Mikami

IPC: H01L31/042 ,  H01L31/0392 ,  H02S40/34 ,  H05K3/30 ,  H01L31/05 ,  H02S40/22 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L31/03926 ,  H01L31/02013 ,  H01L31/0508 ,  H01L31/0543 ,  H02S20/32 ,  H02S30/10 ,  H02S40/22 ,  H02S40/34 ,  H02S40/42 ,  H05K1/0204 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/142 ,  H05K1/144 ,  H05K1/189 ,  H05K3/301 ,  H05K2201/046 ,  H05K2201/049 ,  H05K2201/09263 ,  H05K2201/10121 ,  H05K2201/10143 ,  Y02E10/52

Abstract: A photovoltaic module includes: a flexible printed circuit; and a plurality of power generating elements mounted on the flexible printed circuit, wherein the flexible printed circuit includes a turning portion, and strip-shaped portions of the flexible printed circuit which are located on opposite sides of the turning portion are aligned so as to oppose each other.

公开(公告)号：US09780465B1

公开(公告)日：2017-10-03

申请号：US15270816

申请日：2016-09-20

Applicant: Jeffrey David Hartman

Inventor： Jeffrey David Hartman

IPC: H01R12/00 ,  H01R12/52 ,  H01R13/24 ,  H01R43/02 ,  H01R43/26 ,  H01R107/00

CPC classification number: H01R12/722 ,  H01R12/737 ,  H05K1/14 ,  H05K3/366 ,  H05K3/403 ,  H05K3/4617 ,  H05K3/4682 ,  H05K2201/046 ,  H05K2201/09154 ,  H05K2201/0919 ,  H05K2201/10189 ,  H05K2203/0228

Abstract: An angled circuit board connector includes a unitary connector block having first and second board-contacting faces. The first and second board-contacting faces are arranged relative to each other at an operative angle. The connector block includes a block body. The first and second board-contacting faces face outward from the block body. A first connector port is located on the first board-contacting face. A second connector port is located on the second board-contacting face. A connector trace extends through at least a portion of the block body between the first and second board-contacting faces. The connector trace electrically connects the first and second connector ports.

公开(公告)号：US09746879B2

公开(公告)日：2017-08-29

申请号：US14544875

申请日：2015-02-27

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00 ,  G06F1/16 ,  G06F1/18 ,  H05K1/14 ,  H05K3/36 ,  H01R12/62 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: G06F1/16 ,  G06F1/184 ,  G06F1/185 ,  H01R12/62 ,  H05K1/028 ,  H05K1/118 ,  H05K1/147 ,  H05K1/181 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/09481 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10545

Abstract: An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.

公开(公告)号：US20170201208A1

公开(公告)日：2017-07-13

申请号：US15324984

申请日：2015-07-06

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Kazumasa Toya ,  Takashi Iwasaki ,  Youichi Nagai ,  Koji Mori ,  Kenji Saito ,  Rui Mikami ,  Takeshi Yamana

IPC: H02S40/22 ,  H02S40/34 ,  H01L31/02 ,  H02S30/10 ,  H02S20/32

CPC classification number: H01L31/03926 ,  H01L31/02013 ,  H01L31/0508 ,  H01L31/0543 ,  H02S20/32 ,  H02S30/10 ,  H02S40/22 ,  H02S40/42 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/046 ,  H05K2201/09263 ,  H05K2201/10121 ,  Y02E10/52

Abstract: A wiring substrate is configured to have a power generating portion mounted thereto. The wiring substrate includes a land portion and a wire portion. The width of the wire portion is smaller than the width of the land portion.