FLEXIBLE SUBSTRATE
    39.
    发明申请
    FLEXIBLE SUBSTRATE 审中-公开
    柔性基板

    公开(公告)号:US20150289363A1

    公开(公告)日:2015-10-08

    申请号:US14747036

    申请日:2015-06-23

    Inventor: Yoshihito OTSUBO

    Abstract: A flexible substrate includes a substrate including interconnection wiring on a surface of or in the substrate, a component disposed on the surface of or in the substrate and electrically connected to the interconnection wiring, and an external connection conductor provided on the surface of the substrate. The substrate includes, when viewed two-dimensionally, a base portion where the external connection conductor is disposed, and a projecting portion projecting from the base portion. The projecting portion includes a first constricted portion provided at a connection to the base portion, and a first wide portion provided on an extension of the first constricted portion and having a width greater than that of the first constricted portion, with the component being disposed in the first wide portion.

    Abstract translation: 柔性基板包括:衬底,其包括在衬底的表面上或衬底中的互连布线,设置在衬底的表面上或与衬底中的表面电连接的部件,以及设置在衬底的表面上的外部连接导体。 当二维观察时,基板包括设置外部连接导体的基部和从基部突出的突出部。 突出部包括设置在与基部的连接处的第一收缩部分和设置在第一收缩部分的延伸部上并且具有大于第一收缩部分的宽度的宽度的第一宽部分,其中部件设置在 第一大部分。

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