公开(公告)号：US07929100B2

公开(公告)日：2011-04-19

申请号：US12167743

申请日：2008-07-03

Applicant: Wal-Hee Kim

Inventor： Wal-Hee Kim

IPC: G02F1/1345

CPC classification number: H05K1/189 ,  G02F1/13452 ,  G02F2001/133612 ,  H05K1/147 ,  H05K3/281 ,  H05K3/363 ,  H05K2201/058 ,  H05K2201/10106 ,  H05K2203/0455

Abstract: A flexible printed circuit board for use in a liquid crystal display device includes: a body section having a light source portion embedded therein; a leg section including a solder pad connected to an external printed circuit board, the leg section being extended from the body section and integrally formed with the body section; and a single conductive layer formed across the body section and the leg section for electrically interconnecting the light source portion and the solder pad.

Abstract translation: 一种用于液晶显示装置的柔性印刷电路板包括：具有嵌入其中的光源部分的主体部分; 腿部，其包括连接到外部印刷电路板的焊盘，所述腿部从所述主体部分延伸并与所述主体部分一体形成; 以及形成在主体部分和腿部上的单个导电层，用于将光源部分和焊盘电连接。

公开(公告)号：US20110024160A1

公开(公告)日：2011-02-03

申请号：US12534077

申请日：2009-07-31

Applicant: Clifton Quan ,  Hee Kyung Kim ,  Fangchou Yang ,  Kevin C. Rolston ,  Edward Marsh Jackson

Inventor： Clifton Quan ,  Hee Kyung Kim ,  Fangchou Yang ,  Kevin C. Rolston ,  Edward Marsh Jackson

IPC: H05K1/00 ,  H05K3/36

CPC classification number: H05K1/028 ,  H05K1/024 ,  H05K1/144 ,  H05K1/147 ,  H05K3/361 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/09109 ,  H05K2201/09318 ,  H05K2201/10378 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, the invention relates to a method for interconnecting components of a corrugated printed circuit board, the components including a first flexible layer having a first signal line on a surface of the first flexible layer and a second flexible layer having a second signal line on a surface of the second flexible layer, the method including forming at least one first hole in the first flexible layer, forming a conductive pad on the second flexible layer, forming at least one second hole in a non-conductive adhesive layer, aligning the at least one second hole with the at least one first hole and the conductive pad, bonding the first flexible layer and the second flexible layer, with the non-conductive adhesive layer disposed there between, and filling the at least one first hole and the at least one second hole with a conductive paste to electrically couple the first signal line with the second signal line.

Abstract translation: 提供多层微波波纹印刷电路板。 在一个实施例中，本发明涉及一种用于互连波纹印刷电路板的部件的方法，所述部件包括在第一柔性层的表面上具有第一信号线的第一柔性层和具有第二信号线的第二柔性层 在所述第二柔性层的表面上，所述方法包括在所述第一柔性层中形成至少一个第一孔，在所述第二柔性层上形成导电垫，在非导电粘合剂层中形成至少一个第二孔， 至少一个具有所述至少一个第一孔和所述导电垫的第二孔，将所述第一柔性层和所述第二柔性层结合，所述非导电粘合剂层设置在所述第一孔和所述第二柔性层之间，并填充所述至少一个第一孔和所述第二孔 至少一个具有导电膏的第二孔，用于将第一信号线与第二信号线电耦合。

公开(公告)号：US20100326726A1

公开(公告)日：2010-12-30

申请号：US12818542

申请日：2010-06-18

Applicant: Hisao Tanaka ,  Satoshi Emoto ,  Kenichi Nashirozawa ,  Nana Matsushima ,  Takumi Masuyama

Inventor： Hisao Tanaka ,  Satoshi Emoto ,  Kenichi Nashirozawa ,  Nana Matsushima ,  Takumi Masuyama

IPC: H01R4/02

CPC classification number: H05K3/363 ,  G11B5/4846 ,  H05K3/3452 ,  H05K2201/0373 ,  H05K2201/058 ,  H05K2201/098 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2201/2036

Abstract: A solder joint structure include: a first terminal portion including a plurality of first terminal conductors adjacent to each other; a second terminal portion arranged opposite to the first terminal portion and including a plurality of second terminal conductors which are joined to the first terminal conductors; solders electrically connecting the first terminal conductors and the second terminal conductors; and member for suppressing flow of the solders.

Abstract translation: 焊接结构包括：包括彼此相邻的多个第一端子导体的第一端子部分; 第二端子部分，布置成与第一端子部分相对并且包括多个第二端子导体，第二端子导体连接到第一端子导体; 电连接第一端子导体和第二端子导体的焊料; 以及用于抑制焊料流动的部件。

公开(公告)号：US20100103649A1

公开(公告)日：2010-04-29

申请号：US12523944

申请日：2007-08-21

Applicant: Tetsuya Hamada

Inventor： Tetsuya Hamada

IPC: G02F1/13357 ,  F21S4/00

CPC classification number: H05K1/118 ,  F21K9/00 ,  F21Y2115/10 ,  H01R12/78 ,  H01R25/162 ,  H05K1/142 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/10106 ,  H05K2201/10189

Abstract: A light source module (1) is constituted by forming lines (13a, 13b) on a mounting substrate (11) and a connection substrate (12) integrally formed of a flexible material, and mounting a first connector (15), a second connector (16), and a plurality of LEDs (18) on the substrates. The connection substrate of one of adjoining light source modules is connected with the first connector (15) of the other light source module, thereby connecting a plurality of light source modules (1) linearly. In the light source module (1) at the end, terminals (14a, 14b) of the connection substrate (12) are connected with the second connector (16) while being reversed, thereby interconnecting two lines (13a, 14b). A plurality of light source modules (1) can thereby be connected without using a separate component such as a wire harness.

Abstract translation: 光源模块（1）通过在安装基板（11）上形成线（13a，13b）和由柔性材料一体形成的连接基板（12）构成，并且安装第一连接器（15），第二连接器 （16），以及在所述基板上的多个LED（18）。 相邻光源模块之一的连接基板与另一个光源模块的第一连接器（15）连接，从而线性地连接多个光源模块（1）。 在光源模块（1）的端部，连接基板（12）的端子（14a，14b）与第二连接器（16）连接，同时被反向，从而互连两条线（13a，14b）。 因此，可以连接多个光源模块（1）而不使用诸如线束的单独部件。

公开(公告)号：US20080186595A1

公开(公告)日：2008-08-07

申请号：US12027560

申请日：2008-02-07

Applicant: Atsushi HASEGAWA ,  Takumi KUWAHARA ,  Manabu KOBAYASHI ,  Fumio Shinano

Inventor： Atsushi HASEGAWA ,  Takumi KUWAHARA ,  Manabu KOBAYASHI ,  Fumio Shinano

IPC: G02B7/02 ,  H05K1/00

CPC classification number: H05K1/0256 ,  G02B7/102 ,  H05K1/189 ,  H05K3/363 ,  H05K2201/055 ,  H05K2201/058

Abstract: A flexible printed circuit according to the present invention is anchored to a holding member disposed within electronic equipment, and comprises: a main body portion 70 that includes electrical lines; a first connection portion 71 disposed in the main body portion 70 and to which an electric component or another flexible printed circuit is connected; and a first cover portion 72 formed as part of the main body portion 70 and disposed so as to cover the first connection portion. Part of the first cover portion is held by a lens holder 6. According to this configuration, an insulated state can be reliably maintained by using a configuration in which soldered connection portions are covered by part of the FPC and the covering portion is held by the housing.

Abstract translation: 根据本发明的柔性印刷电路被固定到设置在电子设备内的保持构件，并且包括：主体部分70，其包括电线; 第一连接部分71，设置在主体部分70中，电气部件或另一个柔性印刷电路连接到该第一连接部分71; 以及形成为主体部70的一部分并且被设置为覆盖第一连接部的第一盖部72。 第一盖部分的一部分由透镜保持器6保持。 根据该结构，通过使用焊接连接部分被FPC的一部分覆盖并且覆盖部分被壳体保持的构造，可以可靠地保持绝缘状态。

公开(公告)号：US20080136021A1

公开(公告)日：2008-06-12

申请号：US11856867

申请日：2007-09-18

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H05K1/147 ,  H01L23/13 ,  H01L23/5385 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/142 ,  H05K3/361 ,  H05K3/4611 ,  H05K2201/058 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/0919 ,  Y10T428/31678 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Disclosed is a method of manufacturing a hybrid structure of multi-layer substrates. The method comprises steps of: separating a border district of at least one metal layer connecting with a border district of the corresponding dielectric layer from adjacent metal layers and adjacent dielectric layers for each multi-layer substrate and connecting a separated border of a metal layer of one multi-layer substrate with a separated border district of a metal layer of another multi-layer substrate to form a connection section. The hybrid structure comprises at least a first multi-layer substrate and a second multi-layer substrate. At least one first metal layer is connected with at least one second metal layer to form a connection section.

Abstract translation: 公开了一种制造多层基板的混合结构的方法。 该方法包括以下步骤：将与相应电介质层的边界区连接的至少一个金属层的边界区域与相邻的金属层和相邻的电介质层分别用于每个多层基板并连接金属层的金属层的分离边界 一个多层基板，具有另一多层基板的金属层的分离边界区域，以形成连接部分。 所述混合结构至少包括第一多层基板和第二多层基板。 至少一个第一金属层与至少一个第二金属层连接以形成连接部分。

公开(公告)号：US20080045077A1

公开(公告)日：2008-02-21

申请号：US11889878

申请日：2007-08-17

Applicant: Yung-Wei Chou

Inventor： Yung-Wei Chou

IPC: H01R12/24

CPC classification number: H01R12/00 ,  H01R4/027 ,  H01R12/7076 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/048 ,  H05K2201/058 ,  H05K2201/09081

Abstract: A connecting structure of a printed circuit board of a liquid crystal display (LCD) module includes a double side printed circuit board and a single side printed circuit board. With the design of the double side printed circuit board having a solder element with two solder surfaces with a plurality of plated through holes (PTHs), and the design of the opening neighboring the solder element, the conducting surface of the single side printed circuit board may easily accord with the structural requirements to select the corresponding solder surface for performing welding.

Abstract translation: 液晶显示器（LCD）模块的印刷电路板的连接结构包括双面印刷电路板和单面印刷电路板。 通过双面印刷电路板的设计，具有具有多个电镀通孔（PTH）的两个焊接表面的焊料元件以及与焊料元件相邻的开口的设计，单面印刷电路板的导电表面 可以容易地符合选择用于进行焊接的相应焊接表面的结构要求。

公开(公告)号：US11882649B2

公开(公告)日：2024-01-23

申请号：US17948564

申请日：2022-09-20

Applicant: Samsung Display Co., Ltd.

Inventor： Hee-Kwon Lee

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0259 ,  H05K1/0281 ,  H05K1/189 ,  H05K2201/049 ,  H05K2201/058 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2201/2063

Abstract: A display device including: a display module including a display panel for displaying an image and a circuit board connected to the display panel; a support plate disposed on a surface of the display module; and a conductive adhesive film disposed between the circuit board and the support plate, the conductive adhesive film including: a double-sided adhesive film fixed to a surface of the support plate and a surface of the circuit board; and a single-sided adhesive film fixed to one of the surface of the support plate and the surface of the circuit board.

公开(公告)号：US20230309237A1

公开(公告)日：2023-09-28

申请号：US17993484

申请日：2022-11-23

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： HSIN-YEN HSU

IPC: H05K1/18 ,  H05K1/14 ,  H01L27/146

CPC classification number: H05K1/189 ,  H05K1/142 ,  H01L27/14625 ,  H01L27/14618 ,  H01L27/14636 ,  H05K2201/058 ,  H05K2201/2009 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A packaging structure includes a flexible circuit board, an image sensor, a reinforcing plate, and an adhesive layer. The flexible circuit board defines a first opening, a first connecting portion, and a second connecting portion. The image sensor includes a photosensitive area exposed in the first opening and a connection area electrically coupled with the first connecting portion through a conductive body. The reinforcing plate and the image sensor are located on a same side of the flexible circuit board. The adhesive layer covers edges of the image sensor and couples the image sensor to the flexible circuit board. A lens module and an electronic device comprising the packaging structure are also disclosed.

公开(公告)号：US20230309225A1

公开(公告)日：2023-09-28

申请号：US18326426

申请日：2023-05-31

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han-Sung BAE ,  Wonkyu KWAK ,  Cheolgeun AN

IPC: H05K1/11 ,  H01L23/00 ,  G02F1/1345

CPC classification number: H05K1/118 ,  H05K1/111 ,  H01L24/06 ,  G02F1/13458 ,  H05K2201/058 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/094 ,  H05K3/361

Abstract: Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.