公开(公告)号：US20070139896A1

公开(公告)日：2007-06-21

申请号：US10591134

申请日：2004-03-18

Applicant: Hiroshi Yamada ,  Tomonori Abe ,  Keiichi Takikoshi

Inventor： Hiroshi Yamada ,  Tomonori Abe ,  Keiichi Takikoshi

IPC: H05K7/20

CPC classification number: H01L23/34 ,  H01L23/4006 ,  H01L23/4093 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/141 ,  H05K3/301 ,  H05K3/306 ,  H05K2201/062 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A modular heat-radiation structure includes a module 5 for generating heat, including a first main unit 5a having a fixing hole 5e and a lead 5L for connecting to the printed circuit board 3, a heat-radiation fin 7, fixed to the top face of the first main unit 5a, for radiating heat generated in the module 5, a resin-made and insulating heat shield 9 inserted between the printed circuit board 3 and the first main unit 5a, and a screw 13 for fixing the heat shield 9, the module 5, and the heat-radiation fin 7, where a lead hole 9L for allowing the lead 5L to pass therethrough and a first fixing hole 9e for allowing the screw 13 to pass therethrough are provided in the heat shield 9, and a second fixing hole 3e for allowing the screw 13 to pass therethrough is provided in the printed circuit board 3.

Abstract translation: 模块化散热结构包括用于产生热量的模块5，包括具有固定孔5e的第一主单元5a和用于连接到印刷电路板3的引线5L，固定到 第一主单元5a的顶面，用于辐射模块5中产生的热量，插入在印刷电路板3和第一主单元5a之间的树脂制隔热隔热件9和用于固定的螺钉13 隔热罩9，模块5和散热片7，其中用于允许引线5L通过的引线孔9L和用于允许螺钉13通过的第一固定孔9e设置在 隔热板9和用于允许螺钉13通过的第二固定孔3e设置在印刷电路板3中。

公开(公告)号：US20070102490A1

公开(公告)日：2007-05-10

申请号：US11612873

申请日：2006-12-19

Applicant: Yuki Momokawa ,  Eiichi Kono ,  Masaru Saitou ,  Kazuhiko Tanabe

Inventor： Yuki Momokawa ,  Eiichi Kono ,  Masaru Saitou ,  Kazuhiko Tanabe

IPC: A47J36/02

CPC classification number: H05K3/3426 ,  H05K1/0201 ,  H05K1/09 ,  H05K1/114 ,  H05K3/0094 ,  H05K3/3415 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3468 ,  H05K3/3494 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09263 ,  H05K2201/09572 ,  H05K2201/09727 ,  H05K2201/10909 ,  H05K2201/2054 ,  H05K2203/0191 ,  H05K2203/047 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/1121 ,  H05K2203/1394 ,  H05K2203/304 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A through hole 2 in a circuit board 1 and to be joined to a lead 5 in a surface mounting component 6 is prepared from a material such as nickel, and palladium having a thermal conductivity equal to or less than 100 W/m.K, the circuit board 1 involving a alloy layer composed of at least a member selected from elements of solder 8, a pad 7, and the lead 5 in a solder joined site of the lead 5 and the pad 7, whereby a quantity of heat transmitted to the joined site via the through hole 2 is reduced at the time when wave-soldering is applied to the back of the circuit board 1 after the surface mounting component 6 was mounted, so that the joined site is maintained at a temperature equal to or less than a melting point of the alloy layer, and hence, exfoliation in an interface of the joined site is prevented, and reliability in the joint of the lead 5 and the pad 7 is elevated.

Abstract translation: 电路板1中的通孔2并且与表面安装部件6中的引线5接合，由诸如镍的材料和热导率等于或小于100W / mK的钯制成，电路 板1，其包括在引线5和焊盘7的焊料接合部位中至少由焊料8，焊盘7和引线5的元件组成的合金层，由此传递到接合部 在安装表面安装部件6之后，当在电路板1的背面上施加波峰焊时，通过通孔2的位置被减小，使得接合部位保持在等于或小于 合金层的熔点，因此防止了接合部位的界面的剥离，引线5和焊盘7的接头的可靠性提高。

公开(公告)号：US20070079276A1

公开(公告)日：2007-04-05

申请号：US11311655

申请日：2005-12-20

Applicant: Takayuki Ashida ,  Kenichirou Tsubone

Inventor： Takayuki Ashida ,  Kenichirou Tsubone

IPC: G06F17/50

CPC classification number: H05K3/0005 ,  G06F17/5081 ,  H05K1/0201 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/0969

Abstract: A multilayered board data input unit inputs design data of a multilayered circuit board provided with through holes penetrating and mutually connecting solid-layer conductors disposed in a multilayer manner. A limitation rule setting unit sets a limitation rule for limiting the number of solid-layer conductors to be connected to the through holes. A separation processing unit separates connections of the solid-layer conductors to the through holes in the design data based on the limitation rule. At this time, when a solid-layer conductor to be separated from the through holes is selected as a candidate, the separation processing unit determines whether the solid-layer conductor is isolated by separation, when the solid-layer conductor is not isolated, determines isolation, and when the solid-layer conductor is isolated, stops separation.

Abstract translation: 多层板数据输入单元输入设置有穿透并相互连接以多层方式布置的固体层导体的通孔的多层电路板的设计数据。 限制规则设定单元设定用于限制要连接到通孔的固体导体的数量的限制规则。 分离处理单元基于限制规则将设计数据中的固体导体与通孔的连接分离。 此时，当选择与通孔分离的固体层导体作为候选时，分离处理单元通过分离确定固体层导体是否被隔离，当固体层导体未被隔离时，确定 隔离，当固体层导体隔离时，停止分离。

公开(公告)号：US20060266806A1

公开(公告)日：2006-11-30

申请号：US11208552

申请日：2005-08-23

Applicant: Tsuyoshi Yamamoto ,  Akiomi Hiruma ,  Fumigi Koyama

Inventor： Tsuyoshi Yamamoto ,  Akiomi Hiruma ,  Fumigi Koyama

IPC: B23K1/20 ,  B23K5/00 ,  B23K35/38

CPC classification number: H05K3/3494 ,  H01L24/98 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K1/0201 ,  H05K3/284 ,  H05K3/288 ,  H05K2201/062 ,  H05K2203/0126 ,  H05K2203/176 ,  H05K2203/304

Abstract: A soldering method for soldering an electronic part on a substrate by reflow soldering is disclosed that includes the steps of applying a solder paste on the substrate; mounting the electronic part on the substrate by using the solder paste; disposing a heat capacity enhancing member on the electronic part, the heat capacity enhancing member including a gel-like material able to enhance the heat capacity of the electronic part; and soldering the electronic part onto the substrate by reflow soldering with the heat capacity enhancing member being applied thereon.

Abstract translation: 公开了一种通过回流焊接将电子部件焊接在基板上的焊接方法，其包括在基板上涂敷焊膏的工序; 通过使用焊膏将电子部件安装在基板上; 在电子部件上设置热容量增强部件，该热容增强部件包括能够提高电子部件的热容量的凝胶状材料; 以及通过在其上施加热容增强部件的回流焊将电子部件焊接到基板上。

公开(公告)号：US20060191713A1

公开(公告)日：2006-08-31

申请号：US11362675

申请日：2006-02-25

Applicant: Jeffrey Chereson

Inventor： Jeffrey Chereson

IPC: H01H85/04 ,  H05K1/11

CPC classification number: H01H85/0039 ,  H01H69/022 ,  H01H85/0411 ,  H01H85/046 ,  H01H2085/0412 ,  H05K1/0293 ,  H05K2201/062 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10181

Abstract: Electrically conductive devices and methods of making such devices are disclosed. One such device has a fusible conductor and a substrate. The substrate may support the fusible conductor. The substrate may have an outer perimeter and within the outer perimeter the substrate may have a heat-transfer-resisting material-deficient portion proximate to the fusible conductor.

Abstract translation: 公开了导电装置和制造这种装置的方法。 一种这样的器件具有可熔导体和衬底。 衬底可以支撑熔断体。 衬底可以具有外周边，并且在外周边内，衬底可以具有靠近可熔导体的耐热传递阻挡材料缺陷部分。

公开(公告)号：US20050258913A1

公开(公告)日：2005-11-24

申请号：US11129959

申请日：2005-05-16

Applicant: Manabu Ito ,  Minoru Fukuda ,  Tetuo Kudo ,  Takeshi Uchida

Inventor： Manabu Ito ,  Minoru Fukuda ,  Tetuo Kudo ,  Takeshi Uchida

IPC: H03B5/04 ,  H03B5/36 ,  H03L1/04 ,  H05K1/02 ,  H05K3/30 ,  H03B1/00

CPC classification number: H03B5/36 ,  H03B5/04 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0243 ,  H05K3/306 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10022 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/2036

Abstract: The present invention is one where, in a lead wire led-out type crystal oscillator of constant temperature type for high stability, comprising: a heat supply body that supplies heat to a crystal resonator from which a plurality of lead wires are led out, to maintain the temperature constant; an oscillating element that constitutes an oscillating circuit together with the crystal resonator; a temperature control element that constitutes a temperature control circuit for controlling the temperature of the crystal resonator; and a circuit board for mounting the heat supply body, the oscillating element, and the temperature control element, and through which lead wires of the crystal resonator are passed through for mounting, the heat supply body comprises: a heat conducting plate which has through-holes for the lead wires and is mounted on the circuit board, and which faces, and is directly thermally joined to, the crystal resonator; and a chip resistor for heating which is mounted on the circuit board adjacent to the heat conducting plate, and is thermally joined to the heat conducting plate. As a result, a lead wire led-out type crystal oscillator of constant temperature type for high stability wherein the structure is simplified, and in particular the height dimension is reduced can be provided. Moreover, the present invention is a constant temperature type surface mounting type crystal oscillator which uses a crystal resonator for surface mounting which is mounted on the circuit board together with the oscillating elements and temperature control elements, and is constructed such that the crystal resonator is arranged on a ceramic substrate, and at least a chip resistor for heat generation and a highly temperature-dependent highly heat sensitive element are arranged on the ceramic substrate. The structure is such that the crystal resonator is arranged on one principal plane of the ceramic substrate, and the chip resistor and the temperature sensitive element are arranged on the other principal plane of the ceramic substrate, and the other principal plane of the ceramic substrate is positioned facing one principal plane of the circuit board, and heat conductive resin is interposed between the chip resistor and the circuit board. A surface mounted crystal oscillator of constant temperature type in which miniaturization is advanced, and the structure is simplified, is provided.

公开(公告)号：US20050224715A1

公开(公告)日：2005-10-13

申请号：US10503188

申请日：2003-02-03

Applicant: Michael Devine

Inventor： Michael Devine

IPC: G01J5/06 ,  G01J5/16 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  G01J5/00

CPC classification number: G01J5/06 ,  G01J5/16 ,  H05K1/0201 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/062 ,  H05K2201/09263 ,  H05K2201/09727

Abstract: Apparatus for protection against undesired thermal transfer comprising a printed circuit board (15), an infrared sensing device (100) electrically connected to the printed circuit board (15) by way of an electrical lead (12), and solid thermally insulating material (18, 20) between the board (15) and the device (100) and protecting that side of the device (100) facing the board (15) from thermal transfer from the board (15) to the device (100). The solid thermally insulating material (18) bounds a passageway (19) in the material (18) through which the lead (12) passes. Advantageously, the in sensing device (100) is in thermal communication with a heat sink (14) and the solid therm:ally insulating material (20) protects the heat sink (14) also against such thermal transfer from the board (15), i.e. thermal radiation from the board (15) and thermal convection currents induced by the board (15).

Abstract translation: 用于防止不期望的热转印的装置，包括印刷电路板（15），通过电引线（12）电连接到印刷电路板（15）的红外感测装置（100）和固体隔热材料（18） ，20）和保护面对板（15）的装置（100）的该侧不受板（15）到装置（100）的热传递。 固体绝热材料（18）限定了引线（12）通过的材料（18）中的通道（19）。 有利地，感测装置（100）与散热器（14）热连通，并且固体热绝缘材料（20）还防止散热器（14）抵抗来自板（15）的热传递， 即板的热辐射（15）和由板（15）引起的热对流。

公开(公告)号：US20050111166A1

公开(公告)日：2005-05-26

申请号：US10969051

申请日：2004-10-21

Applicant: Yukinori Kita

Inventor： Yukinori Kita

IPC: B60R16/02 ,  B60R16/023 ,  H02G3/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/34 ,  H05K7/02 ,  H02B1/26

CPC classification number: B60R16/0239 ,  H05K1/144 ,  H05K3/202 ,  H05K3/306 ,  H05K3/3447 ,  H05K7/026 ,  H05K2201/0397 ,  H05K2201/062 ,  H05K2201/10424

Abstract: A heat-insulating member for a circuit assembly is interposed between a bus bar substrate to construct a circuit assembly in a compact structure and to provide a heat-insulating member that can be easily installed in the circuit assembly and constructed effectively in a thermal design. A control circuit substrate for performing a heat-insulating function between both the substrates. The bus bar substrate includes a plurality of bus bars constituting an electrical power circuit, circuit components to be connected to the electrical power circuit, and a plurality of upright terminals extending from the given bus bars. The control circuit substrate includes a control circuit for controlling the circuit components and is provided with through-holes into which the upright terminals are inserted and connected electrically. The control circuit substrate is disposed substantially in parallel to the bus bar substrate. The heat-insulating member includes a body section disposed between both the substrates and positioning and reinforcing sections for positioning the upright terminals at the positions corresponding to the through-holes and preventing the upright terminals from being deformed between both the substrates, respectively.

Abstract translation: 用于电路组件的隔热构件介于汇流条基板之间以构造紧凑结构的电路组件，并且提供能够容易地安装在电路组件中并在热设计中有效构造的绝热构件。 一种用于在两个基板之间执行绝热功能的控制电路基板。 汇流条基板包括构成电力电路的多个母线，要连接到电力电路的电路部件和从给定母线延伸的多个直立端子。 控制电路基板包括用于控制电路部件的控制电路，并且设置有直立端子电连接到其中的通孔。 控制电路基板大致平行于汇流条基板设置。 隔热构件包括设置在两个基板之间的主体部分和用于将直立端子定位在对应于通孔的位置的定位和加强部分，并且防止直立端子在两个基板之间变形。

公开(公告)号：US06879488B2

公开(公告)日：2005-04-12

申请号：US10302813

申请日：2002-11-25

Applicant: Eriko Takeda ,  Atsushi Isobe ,  Satoshi Tanaka ,  Hiroshi Okabe

Inventor： Eriko Takeda ,  Atsushi Isobe ,  Satoshi Tanaka ,  Hiroshi Okabe

IPC: H01L23/12 ,  H01L23/34 ,  H01L23/367 ,  H01L25/04 ,  H01L25/18 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05H7/20

CPC classification number: H01L23/345 ,  H01L23/3677 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/0306 ,  H05K2201/062 ,  H01L2924/00012

Abstract: In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the firs chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.

Abstract translation: 在紧凑型射频模块中，第一芯片形成加热元件，第二芯片形成其工作特性随温度变化而变化或其最大工作温度低于第一芯片的最大工作温度的器件。 多层基板具有多个电介质层和多个导体层，并机械地支撑第一芯片和第二芯片，其中一些导体层与这些芯片电连接。 该模块可以在整个模块中传导第一芯片产生的热量; 将第一芯片产生的热量从模块的顶面引导到其底面; 并且将来自第一芯片的第一导体图案的热传导中断到放置第二芯片的第二导体图案。

公开(公告)号：US06853091B2

公开(公告)日：2005-02-08

申请号：US10627710

申请日：2003-07-28

Applicant: Yoshiyuki Miyajima

Inventor： Yoshiyuki Miyajima

IPC: B23K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H01K23/48

CPC classification number: H05K1/116 ,  B23K1/0016 ,  B23K2101/42 ,  H05K1/0201 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/062 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/0989

Abstract: A printed circuit board having circuit patterns printed thereon has a plurality of composite lands each including a first land having a terminal hole formed at its center for inserting the terminal of a selected electric or electronic part or device, and a plurality of second lands each being contiguous to and extending outwards from the first land. The areas contiguous to the contours of the first and second lands have no conductive foils, such as copper foils, thereon such that the substrate surface of the printed circuit board is exposed in these areas. The exposed areas are effective to confine the thermal energy in the limited areas for soldering. And the composite land shape defines a ridged cone-like solder lump, which can fixedly grip the terminal of the part or device.

Abstract translation: 具有印刷电路图案的印刷电路板具有多个复合凸台，每个复合凸台包括第一凸台，该第一凸台具有形成在其中心的端子孔，用于插入所选择的电气或电子部件或装置的端子，以及多个第二凸台 与第一个土地相邻并向外延伸。 与第一和第二焊盘的轮廓相邻的区域在其上没有导电箔，例如铜箔，使得印刷电路板的衬底表面暴露在这些区域中。 暴露的区域有效地将热能限制在有限的焊接区域。 并且复合平台形状限定了脊状的锥形焊料块，其可以固定地夹持部件或装置的端子。