公开(公告)号：US09661739B2

公开(公告)日：2017-05-23

申请号：US14595401

申请日：2015-01-13

Applicant: RF Micro Devices, Inc.

Inventor： Donald Joseph Leahy ,  Brian D. Sawyer ,  Stephen Parker ,  Thomas Scott Morris

IPC: H05K9/00 ,  H01L23/552 ,  H05K1/02 ,  H05K3/28 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/0216 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/1461 ,  H05K1/0218 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/284 ,  H05K3/4614 ,  H05K2201/0715 ,  H05K2201/0949 ,  H05K2201/09618 ,  H05K2201/09709 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49171 ,  H01L2924/00

Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

公开(公告)号：US09622340B2

公开(公告)日：2017-04-11

申请号：US14858953

申请日：2015-09-18

Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： Xian-Qin Hu ,  Yan-Lu Li ,  Wen-Hsin Yu ,  Ming-Jaan Ho

IPC: H05K3/28 ,  H05K1/02 ,  H05K3/10

CPC classification number: H05K1/0228 ,  H05K1/0221 ,  H05K1/0237 ,  H05K1/0242 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/10 ,  H05K3/243 ,  H05K3/28 ,  H05K3/281 ,  H05K2201/0355 ,  H05K2201/0715

Abstract: A flexible circuit board includes an insulating layer, a linear signal line, a plurality of grounding lines, a metal coating layer, a circuit layer and an electromagnetic shielding layer. The insulating layer includes a first face and a second face. The metal coating layer covers the linear signal line on the first face. The metal coating layer has a thickness less than that of the linear signal line, and an electrical conductivity larger than that of the linear signal line. The grounding lines are at two opposite sides of the linear signal line on the first face. The circuit layer is on the second face. The electromagnetic shielding layer covers the linear signal line and the grounding lines. The linear signal line and the grounding lines are between the electromagnetic shielding layer and the circuit layer. A method for manufacturing the flexible circuit board is also provided.

公开(公告)号：US09560748B2

公开(公告)日：2017-01-31

申请号：US13734189

申请日：2013-01-04

Applicant: Drew Stone Briggs ,  Scott C. Perzanoski

Inventor： Drew Stone Briggs ,  Scott C. Perzanoski

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K1/0218 ,  H05K1/0225 ,  H05K1/0298 ,  H05K3/4617 ,  H05K3/4635 ,  H05K2201/0715 ,  H05K2201/09681 ,  H05K2201/2009 ,  Y10T156/10 ,  Y10T156/1043

Abstract: A flexible printed circuit includes a first insulating substrate layer and a first electrically conductive layer located adjacent to a first side of the insulating substrate layer. The first conductive layer has a first portion that is substantially solid and a second portion having a multiplicity of voids in the first conductive layer in a pattern for providing a lower stiffness in the second portion relative to the first portion, thereby providing more flexibility in the second portion relative to the first portion.

Abstract translation: 柔性印刷电路包括第一绝缘基底层和与绝缘基底层的第一侧相邻的第一导电层。 第一导电层具有基本上是固体的第一部分和在第一导电层中具有多个空隙的第二部分，该第二部分以图案形式提供相对于第一部分在第二部分中的较低刚度，由此在 相对于第一部分的第二部分。

公开(公告)号：US09560740B2

公开(公告)日：2017-01-31

申请号：US14861867

申请日：2015-09-22

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Kenzo Kitazaki ,  Eiji Mugiya ,  Masaya Shimamura

IPC: H05K7/00 ,  H05K1/02 ,  H05K9/00 ,  H05K3/28 ,  H05K3/00

CPC classification number: H05K1/0216 ,  H01L2224/16225 ,  H01L2924/181 ,  H05K3/0052 ,  H05K3/284 ,  H05K9/0024 ,  H05K2201/0715 ,  H01L2924/00012

Abstract: A circuit module, including: a substrate having electronic components mounted thereon and further having a conductive pattern that defines respective shielded areas where the electronic components are mounted; a sealing layer covering the substrate and the electronic components, the sealing layer having grooves formed therein along the conductive pattern; and a conductive shield, including: a first shielding section covering a top surface of the sealing layer; a second shielding section covering side faces of the sealing layer; and a third shielding section filling the grooves in the sealing layer, wherein the grooves are shaped such that the third shielding section has at least one end thereof connected to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the third shielding section.

Abstract translation: 一种电路模块，包括：具有安装在其上的电子部件并且还具有限定电子部件安装的相应屏蔽区域的导电图案的基板; 覆盖所述基板和所述电子部件的密封层，所述密封层沿着所述导电图案形成在其中; 以及导电屏蔽，包括：覆盖所述密封层的顶表面的第一屏蔽部分; 覆盖所述密封层的侧面的第二遮蔽部; 以及填充所述密封层中的凹槽的第三屏蔽部分，其中所述凹槽成形为使得所述第三屏蔽部分的至少一端连接到所述第二屏蔽部分，所述第三屏蔽部分用作屏蔽壁， 并且所述第三屏蔽部分的至少一端的宽度比所述第三屏蔽部分的其它部分宽。

公开(公告)号：US09555425B2

公开(公告)日：2017-01-31

申请号：US14023850

申请日：2013-09-11

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Matthew Sean Read

IPC: B05B9/00 ,  B05B9/04 ,  B05B7/08 ,  B05B7/04 ,  B05B7/06 ,  B05B1/30 ,  H05K1/02 ,  B05B12/08 ,  B05B7/24 ,  H05K3/28

CPC classification number: B05B9/042 ,  B05B1/3046 ,  B05B7/04 ,  B05B7/06 ,  B05B7/0815 ,  B05B7/2427 ,  B05B12/081 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2203/049 ,  H05K2203/1344 ,  H05K2203/1366

Abstract: During fabrication of shielded radio-frequency modules where costly metallic paint is sprayed to form a conductive layer, it is desirable to reduce the amount of paint being utilized, and to reduce the likelihood of accumulation of metal particles along various paths. A closed recirculation system can be provided to yield such desirable features, and can include a reservoir for holding a volume of metallic paint, a spray apparatus for spraying metallic paint received from the reservoir, and a recirculator for recirculating the metallic paint that is not sprayed back to the reservoir. In some embodiments, the spray apparatus can be implemented so as to have reduced dimensions, and include a mechanism for switching between a spray mode and a recirculate mode. Such a spray apparatus can reduce the amount of paint being utilized, and also reduce accumulation of metal particles in the spray apparatus.

Abstract translation: 在制造高价金属涂料以形成导电层的屏蔽射频模块的制造期间，期望减少所利用的涂料的量，并且减少金属颗粒沿各种路径堆积的可能性。 可以提供闭合的再循环系统以产生这种期望的特征，并且可以包括用于保持一定量的金属涂料的储存器，用于喷射从储存器接收的金属漆的喷射装置，以及用于再循环未喷涂的金属涂料的再循环器 回到水库。 在一些实施例中，喷雾装置可以实现为具有减小的尺寸，并且包括用于在喷雾模式和再循环模式之间切换的机构。 这样的喷雾装置可以减少所利用的涂料的量，并且还减少金属颗粒在喷雾装置中的积聚。

公开(公告)号：US09520942B2

公开(公告)日：2016-12-13

申请号：US14379998

申请日：2012-02-24

Applicant: Liqiang Cao ,  Qidong Wang ,  Daniel Guidotti

Inventor： Liqiang Cao ,  Qidong Wang ,  Daniel Guidotti

IPC: H04B10/12 ,  H04B10/25 ,  H04B10/90 ,  H05K1/02 ,  H04B10/00

CPC classification number: H04B10/2503 ,  H04B10/12 ,  H04B10/90 ,  H05K1/0218 ,  H05K1/0239 ,  H05K2201/037 ,  H05K2201/0715 ,  H05K2201/10098

Abstract: The present disclosure provides a millimeter-wave waveguide communication system. The millimeter-wave waveguide communication system may comprise: a clock component, and at least two sets of millimeter-wave receiving/transmitting channels. The clock component is configured to provide a clock signal to sending ends and receiving ends of the two sets of millimeter-wave receiving/sending channels respectively. Each set of millimeter-wave receiving/sending channels comprises: a transmitter component, a receiver component and a transmission waveguide. The transmission waveguide is located between the transmitter component and the receiver component and is configured to provide a channel for millimeter-wave transmission. The top face, side face and/or bottom face of the transmission waveguide, except for active devices and accessories thereof, are plated with a metal conductive wall to form an electromagnetic shield from a transmission waveguide in an adjacent millimeter-wave receiving/sending channel. The metal conductive wall can minimize the crosstalk between the channels during high-speed communications, thereby improving data bandwidth and data throughput of the millimeter-wave communication system.

Abstract translation: 本公开提供了一种毫米波波导通信系统。 毫米波波导通信系统可以包括：时钟分量和至少两组毫米波接收/发送信道。 时钟分量被配置为提供时钟信号以分别发送两组毫米波接收/发送信道的端点和接收端。 每组毫米波接收/发送通道包括：发射器部件，接收器部件和传输波导。 传输波导位于发射器部件和接收器部件之间，并且被配置为提供用于毫米波传输的通道。 除了有源器件及其附件之外，传输波导的顶面，侧面和/或底面镀有金属导电壁，以在相邻毫米波接收/发送通道中的传输波导形成电磁屏蔽 。 金属导电壁可以在高速通信期间最小化通道之间的串扰，从而提高毫米波通信系统的数据带宽和数据吞吐量。

公开(公告)号：US09456504B2

公开(公告)日：2016-09-27

申请号：US14547498

申请日：2014-11-19

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Tomoki Kobayashi

IPC: H05K3/28 ,  H05K1/02 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K3/284 ,  H05K1/0218 ,  H05K1/186 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/0715 ,  H05K2201/086 ,  H05K2201/10234

Abstract: An electronic device includes wiring substrates stacked upon one another with a connection member arranged between adjacent wiring substrates, in which the connection member electrically connects the adjacent wiring substrates, and each wiring substrate includes a solder resist layer as a lowermost layer, electronic components mounted on the wiring substrates so that at least one of the electronic components is mounted on each wiring substrate, a first magnetic thin film covering a lower surface of the solder resist layer of an upper one of the adjacent wiring substrates, a first encapsulation resin formed on an upper surface of the uppermost wiring substrate and encapsulates the electronic component mounted on the uppermost wiring substrate, and a second magnetic thin film that entirely covers an upper surface of the first encapsulation resin and covers a lower surface of the solder resist layer on the lowermost wiring substrates.

Abstract translation: 一种电子设备，包括：布置在相邻的布线基板之间的连接构件彼此堆叠的布线基板，其中连接构件电连接相邻布线基板，并且每个布线基板包括作为最下层的阻焊层，安装在 所述布线基板使得至少一个所述电子部件安装在每个布线基板上，覆盖所述相邻布线基板的上部的阻焊层的下表面的第一磁性薄膜，形成在所述布线基板上的第一封装树脂 最上面的布线基板的上表面，封装安装在最上面的布线基板上的电子部件和完全覆盖第一封装树脂的上表面的第二磁性薄膜，并且覆盖最下面布线上的阻焊层的下表面 底物。

公开(公告)号：US09455228B2

公开(公告)日：2016-09-27

申请号：US14146895

申请日：2014-01-03

Applicant: Apple Inc.

Inventor： Altan N. Yazar ,  Kiavash Baratzadeh ,  Michael J. Reilly ,  Sean A. Mayo

IPC: H05K9/00 ,  H01L23/552 ,  H05K1/02 ,  H05K3/34 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/0243 ,  H05K3/3436 ,  H05K9/0028 ,  H05K2201/0715 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: This is directed to self-shielded components and methods for making the same. A self-shielded component can include an electromagnetic interference (EMI) shield that contains circuitry within a shielded space defined by the EMI shield. Self-shielding can be achieved by interfacing a conformal shield layer to a ground layer disposed on or within a substrate of the self-shielded component. The combination of the conformal shield layer and the around layer can form a boundary of the shielded space that envelops circuitry requiring shielding. This enables the self-shielded component to be mounted to a circuit board without requiring a shield can or other processing to impart EMI shielding. In addition, the self-shielded components include the benefits of EMI shielding while simultaneously decreasing space requirements.

Abstract translation: 这是针对自屏蔽组件和制作相同的方法。 自屏蔽部件可以包括电磁干扰（EMI）屏蔽，其包含由EMI屏蔽限定的屏蔽空间内的电路。 可以通过将保形屏蔽层与设置在自屏蔽部件的基板上或内部的接地层相接合来实现自屏蔽。 共形屏蔽层和周围层的组合可以形成包围需要屏蔽的电路的屏蔽空间的边界。 这使得自屏蔽部件能够安装到电路板，而不需要屏蔽罩或其它处理来施加EMI屏蔽。 此外，自屏蔽组件还包括EMI屏蔽的优点，同时降低了空间要求。

公开(公告)号：US20160254622A1

公开(公告)日：2016-09-01

申请号：US15151772

申请日：2016-05-11

Applicant: SONY CORPORATION

Inventor： Akira AKIBA ,  Mitsuo HASHIMOTO ,  Shinya MORITA ,  Shun MITARAI ,  Mikihiro TAKETOMO ,  Kazunao ONIKI ,  Koichi IKEDA

IPC: H01R13/66 ,  H01P3/08 ,  H01R24/64

CPC classification number: H01R13/6691 ,  H01P3/08 ,  H01P3/085 ,  H01P3/121 ,  H01R13/6599 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0219 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09618

Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.

Abstract translation: 信号传输电缆具有包括电介质层和金属层的电缆。 信号传输电缆还包括具有带终端的芯片的连接器。 连接器包括具有有机层的衬底，并且有机层的一部分从衬底延伸以形成电缆的电介质层。 金属层位于电介质层上，直接连接到端子。

公开(公告)号：US09426935B2

公开(公告)日：2016-08-23

申请号：US14139253

申请日：2013-12-23

Applicant: Huawei Device Co., Ltd.

Inventor： Chunyu Gao

IPC: H05K7/00 ,  H05K9/00 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K9/0081 ,  H05K1/0218 ,  H05K3/28 ,  H05K3/284 ,  H05K9/00 ,  H05K9/0022 ,  H05K9/003 ,  H05K9/0045 ,  H05K2201/0715 ,  H05K2201/2018 ,  H05K2203/107 ,  Y10T29/49124

Abstract: Embodiments of the present invention disclose a method for manufacturing a circuit board, and a circuit board. The method includes: separately fixing at least two function modules and a shielding frame on a circuit board, where the shielding frame is located between the at least two function modules; packaging the at least two function modules and the shielding frame by using a plastic package material; cutting the plastic package material corresponding to the top of the shielding frame to a surface of the shielding frame; and covering an outside of the plastic package material and an top part of the shielding frame with a conducting material, and covering a surface of the conducting material with an insulation material. In the embodiments, the cutting height is decreased, the processing time is short, and good manufacturability is provided.

Abstract translation: 本发明的实施方式公开了电路基板的制造方法以及电路基板。 该方法包括：在电路板上分开固定至少两个功能模块和屏蔽框架，其中屏蔽框架位于至少两个功能模块之间; 通过使用塑料包装材料包装至少两个功能模块和屏蔽框架; 将对应于屏蔽框架的顶部的塑料封装材料切割到屏蔽框架的表面; 并且用导电材料覆盖塑料封装材料的外部和屏蔽框架的顶部，并用绝缘材料覆盖导电材料的表面。 在实施例中，切割高度减小，处理时间短，并且提供良好的可制造性。