公开(公告)号：US20030156394A1

公开(公告)日：2003-08-21

申请号：US10420269

申请日：2003-04-22

Inventor： Paul Aurelio Martinez

IPC: H05K001/14 ,  H05K001/18

CPC classification number: H05K1/141 ,  H05K1/182 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/09072 ,  H05K2201/10477 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A system for reducing an apparent height of a board system is provided. The board system may include, for example, a carrier, a component, a printed circuit board and/or a solder material. The component is mounted on a first side of the carrier. The printed circuit board has a hole that is structured to accommodate the component. The solder material solders the carrier to the printed circuit board and provides a structural bond between the carrier and the printed circuit board. At least one portion of the solder material provides an electrical coupling between the carrier and the printed circuit board and at least one portion of the component is maintained in the hole after the carrier is soldered to the printed circuit board.

Abstract translation: 提供一种用于降低板系统的表观高度的系统。 板系统可以包括例如载体，组件，印刷电路板和/或焊料材料。 该部件安装在载体的第一侧上。 印刷电路板具有构造成容纳部件的孔。 焊料将载体焊接到印刷电路板上，并在载体和印刷电路板之间提供结构粘合。 焊料材料的至少一部分在载体和印刷电路板之间提供电耦合，并且在将载体焊接到印刷电路板之后，部件的至少一部分保持在孔中。

公开(公告)号：US06568600B1

公开(公告)日：2003-05-27

申请号：US09646402

申请日：2000-09-18

Applicant: Roland Carpier ,  Christine Lauvernier ,  Alain Le Loc'h

Inventor： Roland Carpier ,  Christine Lauvernier ,  Alain Le Loc'h

IPC: G06K1906

CPC classification number: G06K19/07769 ,  G06K19/07749 ,  G06K19/0775 ,  H01L2224/48227 ,  H01L2924/01057 ,  H01L2924/01078 ,  H05K1/112 ,  H05K1/183 ,  H05K3/3436 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/10477 ,  H05K2203/0465 ,  Y02P70/613

Abstract: A chip card includes a body of electrically insulating layers, one of which carries an open loop antenna having two ends. The body is equipped with a cavity for housing a micromodule adapted for connection to the antenna by two terminals. The micromodule includes an insulating substrate carrying, on a first side, a semiconductor component, and on a second side, several electrical contact pads. Two of the contact pads are disposed in a strip running through a center region of the substrate. The terminals are connected to the two contact pads through the substrate, and the two pads are respectively connected to ends of the antenna.

Abstract translation: 芯片卡包括电绝缘层的主体，其中一个承载具有两端的开环天线。 身体配备有用于容纳适于通过两个端子连接到天线的微型模块的空腔。 微型组件包括绝缘基板，其在第一侧上承载半导体部件，并且在第二侧上承载多个电接触焊盘。 接触焊盘中的两个设置在穿过衬底的中心区域的条带中。 端子通过基板连接到两个接触焊盘，并且两个焊盘分别连接到天线的端部。

公开(公告)号：US20030079909A1

公开(公告)日：2003-05-01

申请号：US10032908

申请日：2001-11-01

Inventor： Chinh Nguyen ,  Phu Hoang ,  Phan Hoang ,  Andy Le

IPC: H01L023/488

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/144 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2201/0367 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10992 ,  H05K2203/043 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2924/00

Abstract: In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.

Abstract translation: 在本发明的一个实施例中，堆叠元件包括印刷电路板（PCB）和多个焊料凸块。 PCB具有顶侧和底侧。 顶侧连接到第一设备的第一个引脚。 多个焊料凸块位于底侧，并附接到第二器件的第二引脚的上部区域，以提供第一引脚和第二引脚之间的电连接。

公开(公告)号：US06518163B2

公开(公告)日：2003-02-11

申请号：US09746336

申请日：2000-12-26

Applicant: Seiki Sakuyama ,  Yasuo Yamagishi ,  Masataka Mizukoshi

Inventor： Seiki Sakuyama ,  Yasuo Yamagishi ,  Masataka Mizukoshi

IPC: H01L2144

CPC classification number: H05K3/3484 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1532 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0266 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0574 ,  H05K2203/0577 ,  H05K2203/0769

Abstract: The present invention relates to a bump formation method, comprising the steps of providing a mask, in which a plurality of openings have been formed corresponding to a plurality of electrode pads, to a substrate provided with this plurality of electrode pads, filling the openings with a solder paste, and heat treating the solder paste. The solder paste contains a solder powder. This solder powder is one that contains no more than 10 wt % particles whose diameter is greater than the thickness of the mask and no more than 1.5 times this thickness. Preferably, this solder powder is one that contains no more than 10 wt % particles whose diameter is greater than 40% of the diameter of the openings, or one that contains no more than 30 wt % particles whose diameter is 40 to 100% the thickness of the mask.

Abstract translation: 凸点形成方法技术领域本发明涉及一种凸块形成方法，包括以下步骤：将具有多个电极焊盘的多个开口形成的掩模提供给设置有该多个电极焊盘的基板， 焊膏，并对焊膏进行热处理。 焊膏含有焊料粉末。 该焊料粉末是含有不超过10重量％的直径大于掩模厚度且不大于该厚度的1.5倍的颗粒。 优选地，该焊料粉末是含有不超过10重量％的直径大于开口直径的40％的颗粒，或者包含不超过30重量％的直径为40至100重量％的颗粒的焊料粉末 的面具。

公开(公告)号：US06507121B2

公开(公告)日：2003-01-14

申请号：US09756086

申请日：2001-01-08

Applicant: Chien-Ping Huang

Inventor： Chien-Ping Huang

IPC: H01L2348

CPC classification number: H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10477 ,  H05K2201/10992 ,  H05K2201/2036 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A solder ball array type package structure is able to control collapse. The package includes a substrate, a carrier, a plurality of dies, a molding compound and a plurality of solder balls. The substrate has at least one active surface. Pads are located on the first surface of the substrate. The carrier has at least an active surface and a back surface opposite the active surface. A plurality of dies are located on the back surface and the active surface of the carrier. The dies arranged on the active surface are electrically connected to the carrier by flip chip technology. A molding compound encapsulates on the back surface of the carrier to cover the dies on the back surface of the carrier. Solder balls having a base material are provided on the active surface of the carrier in array. At least three solder balls coated with the base material having a high melting-temperature core are further provided in the periphery of the array. The carrier is arranged such that the active surface faces the first surface of the substrate to allow each solder ball correspond to the one of the pads, respectively.

公开(公告)号：US20020149074A1

公开(公告)日：2002-10-17

申请号：US09901480

申请日：2001-07-09

Inventor： Chiaki Imaeda

IPC: H01L031/0232

CPC classification number: H05K3/363 ,  G02F1/1333 ,  G02F1/13452 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/3463 ,  H05K3/3494 ,  H05K3/4084 ,  H05K2201/0394 ,  H05K2201/062 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2203/0195

Abstract: A liquid crystal device 100 includes a liquid crystal panel 110, a plastic frame 120 arranged to overlap with the liquid crystal panel 110, a light diffusing layer 130 arranged to overlap with the frame 120, a flexible wiring substrate 140 mounted on the liquid crystal panel 110, and a circuit wiring substrate 150 arranged to be connected to the flexible wiring substrate 140 and overlap with the light diffusing layer 130. The light diffusing layer 130 is made of a material having good heat insulating property to prevent thermal deformation or thermal deterioration of the frame due to the heat produced during connection of the flexible wiring substrate 140 and the circuit wiring substrate 150

Abstract translation: 液晶装置100包括液晶面板110，与液晶面板110重叠配置的塑料框架120，与框架120重叠配置的光漫射层130，安装在液晶面板上的柔性布线基板140 110以及布置成连接到柔性布线基板140并与光漫射层130重叠的电路布线基板150.光漫射层130由具有良好隔热性的材料制成，以防止热变形或热劣化 由于在柔性布线基板140和电路布线基板150的连接期间产生的热量引起的框架

公开(公告)号：US06459044B2

公开(公告)日：2002-10-01

申请号：US09907004

申请日：2001-07-16

Applicant: Yasushi Watanabe ,  Kenichi Shinano

Inventor： Yasushi Watanabe ,  Kenichi Shinano

IPC: H05K100

CPC classification number: H05K3/361 ,  B32B3/00 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/28 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4635 ,  H05K2201/0195 ,  H05K2201/09063 ,  H05K2201/10477 ,  H05K2203/1178 ,  H05K2203/1461 ,  H05K2203/1572 ,  Y10T428/24917

Abstract: In a flexible multilayer wiring board, a first conductive pattern provided on a first flexible base material and a second conductive pattern provided on a second flexible base material are made to conduct via a first conductive body filled in a first through hole. Hereby, a flexible multilayer wiring board of which the productivity is satisfactory, which is low-priced and highly reliable in connection can be provided.

Abstract translation: 在柔性多层布线板中，设置在第一柔性基底材料上的第一导电图案和设置在第二柔性基底材料上的第二导电图案通过填充在第一通孔中的第一导电体导通。 因此，可以提供其生产率令人满意的柔性多层布线板，其连接成本低廉且可靠性高。

公开(公告)号：US20010039724A1

公开(公告)日：2001-11-15

申请号：US09274957

申请日：1999-03-23

Inventor： OSAMU OHSHIMA ,  YOSHIAKI UDAGAWA ,  MASAHIRO SUZUKI ,  TAKESHI NISHIYAMA

IPC: H05K007/02 ,  H01R043/16

CPC classification number: H05K1/141 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15322 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10704 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218 ,  H01L2924/00014

Abstract: A method and apparatus are provided for mounting circuit elements on a printed wiring board, wherein an integrated circuit having terminals with a first interterminal pitch are mounted onto a first surface of a terminal density conversion board which converts the first interterminal pitch of the integrated circuit to terminals with a second interterminal pitch larger than the first interterminal pitch on a second surface of the terminal density conversion board; and the terminals on the second surface of the terminal density conversion board with the second interterminal pitch are mounted onto the printed wiring board.

Abstract translation: 提供了一种用于将电路元件安装在印刷电路板上的方法和装置，其中具有第一间隔间距的端子的集成电路安装在终端密度转换板的第一表面上，该终端密度转换板将集成电路的第一interterminal pitch转换为 在终端密度转换板的第二表面上具有大于第一interterminal间距的第二interterminal间距的端子; 并且具有第二交间距的端子密度转换板的第二表面上的端子安装在印刷线路板上。

公开(公告)号：US06316737B1

公开(公告)日：2001-11-13

申请号：US09393952

申请日：1999-09-09

Applicant: Michael D. Evans ,  James D. Goss ,  Jeffrey A. Curhan ,  Patrizio Vinciarelli

Inventor： Michael D. Evans ,  James D. Goss ,  Jeffrey A. Curhan ,  Patrizio Vinciarelli

IPC: H05K116

CPC classification number: H05K1/111 ,  H01L2224/48091 ,  H01L2924/01079 ,  H05K1/0306 ,  H05K1/182 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0179 ,  H05K2201/09572 ,  H05K2201/09745 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

Abstract: In general, in one aspect, the invention features a connection between a through-hole in a circuit board and a contact region on a component. The contact region has a surface bearing a depression. A continuous solder column has one end of that forms a solder joint with an inner wall of the through-hole and the other end of that forms a solder joint with the contact region.

Abstract translation: 通常，一方面，本发明的特征在于电路板中的通孔与部件上的接触区域之间的连接。 接触区域具有带凹陷的表面。 连续的焊料柱的一端与通孔的内壁形成焊接点，另一端与接触区域形成焊接点。

公开(公告)号：US06285554B1

公开(公告)日：2001-09-04

申请号：US09527572

申请日：2000-03-16

Applicant: David Westberg

Inventor： David Westberg

IPC: H05K720

CPC classification number: H05K1/0209 ,  H01L23/36 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09781 ,  H05K2201/10477 ,  H05K2201/10674 ,  H01L2224/0401

Abstract: A method and an arrangement for connecting a component, such as a chip (6), on a substrate (7) to a conductive surface of a carrier. The conductive surface can be an earth plane (10) and the carrier can be a printed circuit board. The method and arrangement allow the component to thermally conduct and/or electrically conduct onto the conductive surface.

Abstract translation: 一种用于将诸如芯片（6）的部件在基板（7）上连接到载体的导电表面的方法和装置。 导电表面可以是接地平面（10），载体可以是印刷电路板。 该方法和装置允许部件热传导和/或导电到导电表面上。