公开(公告)号：US11749948B2

公开(公告)日：2023-09-05

申请号：US17340877

申请日：2021-06-07

Applicant: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD

Inventor： Tao Song ,  Kun Liu

IPC: H01R13/648 ,  H01R13/6471 ,  H01R13/40 ,  H01R13/6587 ,  H01R13/6591 ,  H01R13/514 ,  H01R13/518 ,  H01R12/72 ,  H01R13/6586 ,  H01R12/58 ,  H05K1/11 ,  H01R13/6588 ,  H01R13/6583 ,  H01R13/6585 ,  H01R13/6582 ,  H01R43/24 ,  H01R12/71 ,  H01R13/20 ,  H01R13/504 ,  H01R13/6461 ,  H01R13/6584 ,  H05K3/30 ,  H01R13/02 ,  H05K3/34 ,  H01R13/6474 ,  H01R13/502 ,  H01R13/46 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6581

CPC classification number: H01R13/6471 ,  H01R12/585 ,  H01R12/716 ,  H01R12/724 ,  H01R13/02 ,  H01R13/20 ,  H01R13/40 ,  H01R13/504 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6461 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6584 ,  H01R13/6585 ,  H01R13/6586 ,  H01R13/6587 ,  H01R13/6588 ,  H01R13/6591 ,  H01R43/24 ,  H05K1/115 ,  H05K3/306 ,  H05K3/3447 ,  H01R12/71 ,  H01R12/712 ,  H01R12/722 ,  H01R13/46 ,  H01R13/502 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6474 ,  H01R13/6581 ,  H05K2201/09236 ,  H05K2201/1078 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10871

Abstract: A backplane connector includes a number of first conductive terminals, an insulating bracket, a first metal shield and a second metal shield. The first conductive terminal includes a first mating portion, a first tail portion and a first connection portion. The first conductive terminals include first differential signal terminals, a first ground terminal and a second ground terminal. The first mating portion, the first connection portion and the first tail portion extend along a mating direction so that the structural design of the conductive terminal is simplified. The first metal shield, the second metal shield, the first mating portion of the first grounding terminal and the first mating portion of the second grounding terminal are enclosed to form a shielding space. The first mating portions of the first differential signal terminals are located in the shielding space.

公开(公告)号：US11705671B2

公开(公告)日：2023-07-18

申请号：US17341009

申请日：2021-06-07

Applicant: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD

Inventor： Xiaogang Liu ,  Kun Liu ,  Rongzhe Guo ,  Chuanqi Gong ,  Tao Song

IPC: H01R13/648 ,  H01R13/6471 ,  H01R13/40 ,  H01R13/6587 ,  H01R13/6591 ,  H01R13/514 ,  H01R13/518 ,  H01R12/72 ,  H01R13/6586 ,  H01R12/58 ,  H05K1/11 ,  H01R13/6588 ,  H01R13/6583 ,  H01R13/6585 ,  H01R13/6582 ,  H01R43/24 ,  H01R12/71 ,  H01R13/20 ,  H01R13/504 ,  H01R13/6461 ,  H01R13/6584 ,  H05K3/30 ,  H01R13/02 ,  H05K3/34 ,  H01R13/6474 ,  H01R13/502 ,  H01R13/46 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6581

CPC classification number: H01R13/6471 ,  H01R12/585 ,  H01R12/716 ,  H01R12/724 ,  H01R13/02 ,  H01R13/20 ,  H01R13/40 ,  H01R13/504 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6461 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6584 ,  H01R13/6585 ,  H01R13/6586 ,  H01R13/6587 ,  H01R13/6588 ,  H01R13/6591 ,  H01R43/24 ,  H05K1/115 ,  H05K3/306 ,  H05K3/3447 ,  H01R12/71 ,  H01R12/712 ,  H01R12/722 ,  H01R13/46 ,  H01R13/502 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6474 ,  H01R13/6581 ,  H05K2201/09236 ,  H05K2201/1078 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10871

Abstract: A backplane connector assembly includes a first backplane connector and a second backplane connector. The first backplane connector includes a number of first conductive terminals, a first insulating bracket, a first metal shield, a second metal shield and a shielding space. The second backplane connector includes a second terminal module. Each second terminal module includes mating terminals mated with the first conductive terminals and a shielding shell surrounding a periphery of the mating terminals. The shielding shell is received in the shielding space. As a result, the backplane connector assembly of the present disclosure reduces crosstalk and improves the quality of signal transmission.

公开(公告)号：US09668344B2

公开(公告)日：2017-05-30

申请号：US14878891

申请日：2015-10-08

Applicant: SK hynix Inc.

Inventor： Won Duck Jung ,  Jong Ho Lee ,  Joo Hyun Kang ,  Chong Ho Cho ,  In Chul Hwang

IPC: H05K7/00 ,  H05K7/12 ,  H05K1/11 ,  H01L27/115 ,  H05K1/14 ,  H05K3/32

CPC classification number: H05K1/111 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L27/115 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1601 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81897 ,  H01L2224/8192 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K1/145 ,  H05K3/32 ,  H05K3/325 ,  H05K2201/09209 ,  H05K2201/10159 ,  H05K2201/10287 ,  H05K2201/10613 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/45099

Abstract: A semiconductor package may include a first substrate including a first connection portion disposed on a surface of the first substrate and a second substrate including a second connection portion disposed on a surface of the second substrate. The second substrate may be disposed over the first substrate and the second connection portion facing the first connection portion. A first connection loop portion may be provided to include an end connected to the first connection portion. A second connection loop portion may be provided to include one end connected to the second connection portion and the other end combined with the first connection loop portion.

公开(公告)号：US20170149154A1

公开(公告)日：2017-05-25

申请号：US15423269

申请日：2017-02-02

Applicant: MERCURY SYSTEMS, INC.

Inventor： Darryl J. MCKENNEY ,  Absu METHRATTA ,  Erica OUELLETTE

IPC: H01R12/58 ,  H05K1/02 ,  H01R12/71

CPC classification number: H01R12/716 ,  H01R4/028 ,  H01R9/091 ,  H01R12/526 ,  H01R12/58 ,  H01R12/714 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/421 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10878 ,  H05K2201/10901 ,  Y02P70/611

Abstract: According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

公开(公告)号：US20160316559A1

公开(公告)日：2016-10-27

申请号：US14878891

申请日：2015-10-08

Applicant: SK hynix Inc.

Inventor： Won Duck JUNG ,  Jong Ho LEE ,  Joo Hyun KANG ,  Chong Ho CHO ,  In Chul HWANG

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L27/115 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1601 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81897 ,  H01L2224/8192 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K1/145 ,  H05K3/32 ,  H05K3/325 ,  H05K2201/09209 ,  H05K2201/10159 ,  H05K2201/10287 ,  H05K2201/10613 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/45099

Abstract: A semiconductor package may include a first substrate including a first connection portion disposed on a surface of the first substrate and a second substrate including a second connection portion disposed on a surface of the second substrate. The second substrate may be disposed over the first substrate and the second connection portion facing the first connection portion. A first connection loop portion may be provided to include an end connected to the first connection portion. A second connection loop portion may be provided to include one end connected to the second connection portion and the other end combined with the first connection loop portion.

Abstract translation: 半导体封装可以包括第一衬底，其包括设置在第一衬底的表面上的第一连接部分和包括设置在第二衬底的表面上的第二连接部分的第二衬底。 第二基板可以设置在第一基板上，第二连接部分面向第一连接部分。 可以提供第一连接环部分以包括连接到第一连接部分的端部。 可以提供第二连接环部分以包括连接到第二连接部分的一端和与第一连接环部分组合的另一端。

公开(公告)号：US20150077940A1

公开(公告)日：2015-03-19

申请号：US14548805

申请日：2014-11-20

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: H05K1/11 ,  H05K1/18 ,  H01R12/70 ,  H05K1/02

CPC classification number: H05K1/11 ,  H01R12/7076 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10454 ,  H05K2201/10598 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/611

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部，并且每个这样的电子部件通过夹具保持在适当的位置，所述夹具与 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

公开(公告)号：US20110299288A1

公开(公告)日：2011-12-08

申请号：US13210329

申请日：2011-08-15

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: F21V11/00 ,  H05K7/00

CPC classification number: H05K1/11 ,  H01R12/7076 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10454 ,  H05K2201/10598 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/611

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部位置上，并且每个这样的电子部件通过覆盖并与其接触的夹具保持就位 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

公开(公告)号：US20010041370A1

公开(公告)日：2001-11-15

申请号：US09430559

申请日：1999-10-29

Inventor： MIKE BROOKS ,  WALTER L. MODEN

IPC: H01L021/00

CPC classification number: H01L23/36 ,  H01L23/4334 ,  H01L2924/0002 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H05K3/341 ,  H05K2201/10689 ,  H05K2201/1078 ,  H05K2201/1084 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor package and method for fabricating the package are provided. The package includes a semiconductor die and a heat sink in thermal communication with the die. The heat sink includes one or more pad structures adapted to form bonded connections, and thermal paths to contacts on a substrate. The method includes forming multiple heat sinks on a frame similar to a lead frame, and etching or stamping the pad structures on the heat sink. The frame can then be attached to a leadframe containing encapsulated dice, and the assembly singulated to form separate packages. The packages can be used to form electronic assemblies such as circuit board assemblies and multi chip modules.

Abstract translation: 提供一种用于制造封装的半导体封装和方法。 封装包括半导体管芯和与管芯热连通的散热器。 散热器包括适于形成接合连接的一个或多个焊盘结构，以及衬底上的触点的热路径。 该方法包括在类似于引线框架的框架上形成多个散热器，以及蚀刻或冲压散热器上的焊盘结构。 然后可以将该框架连接到包含封装的骰子的引线框架上，并且该组件被单个化以形成单独的封装。 这些封装可用于形成诸如电路板组件和多芯片模块之类的电子组件。

公开(公告)号：US4110904A

公开(公告)日：1978-09-05

申请号：US798729

申请日：1977-05-19

Applicant: Samuel B. Johnson

Inventor： Samuel B. Johnson

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/30 ,  H05K1/10

CPC classification number: H05K3/308 ,  H01R12/58 ,  H05K1/116 ,  H05K1/0306 ,  H05K2201/09036 ,  H05K2201/09845 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/1078 ,  H05K2201/1081 ,  H05K2203/0278 ,  H05K2203/1446 ,  Y10T29/49121 ,  Y10T29/4914

Abstract: An electrical circuit component includes an apertured substrate having a circuit deposited on a surface and further includes a terminal lead seated in the aperture and having laterally extending flanged portions in clamping relationship at opposite sides of the substrate. The inserted portion of the terminal lead is provided with peripheral knurling to define collapsible ridges. The ridges engage the surface of the aperture as a temporary means of aligning the axes of the terminal lead and the aperture prior to upsetting a protruding end portion of the lead for permanent clamping retention of the substrate and the deposited circuitry.

公开(公告)号：US4048716A

公开(公告)日：1977-09-20

申请号：US675106

申请日：1976-04-09

Applicant: Roger F. Jehlicka

Inventor： Roger F. Jehlicka

IPC: G03B15/04 ,  H01R4/10 ,  H01R43/04 ,  H05K3/30 ,  H05K13/04 ,  H01R9/14 ,  H01R9/20

CPC classification number: H01R43/04 ,  G03B15/0442 ,  H05K13/0473 ,  H05K3/308 ,  H01R12/585 ,  H01R4/10 ,  H05K2201/10113 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10962 ,  H05K2203/1446 ,  Y10T29/49151

Abstract: Eyelets are placed through openings from one side of a circuit board so as to make electrical connections with circuit runs on the board, wires are inserted through the eyelets, and portions of the eyelets extending from the other side of the board are bent over by wiping action of a tool so as to crimp the eyelets to the wires and secure the eyelets to the circuit board.

Abstract translation: 孔眼从电路板的一侧通过开口放置，以便与电路板上的电路连接进行电连接，电线通过孔眼插入，并且从板的另一侧延伸的孔眼部分通过擦拭 工具的作用，以将孔眼卷曲到电线并将孔眼固定到电路板上。