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    PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BOARD
    41.
    发明申请
    PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BOARD 有权
    印刷电路板，半导体封装和印刷电路板

    公开(公告)号：US20130279134A1

    公开(公告)日：2013-10-24

    申请号：US13862038

    申请日：2013-04-12

    Applicant: CANON KABUSHIKI KAISHA

    Inventor： Seiji Hayashi ,  Takuya Kondo ,  Shoji Matsumoto

    IPC: H05K1/02

    CPC classification number: H05K1/0216 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/48227 ,  H05K1/0228 ,  H05K1/0242 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/114 ,  H05K1/116 ,  H05K1/14 ,  H05K1/141 ,  H05K1/162 ,  H05K1/18 ,  H05K2201/0939 ,  H05K2201/09418 ,  H05K2201/09454 ,  H05K2201/09463 ,  H05K2201/09636 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10734

    Abstract: First and second signal wiring patterns are formed in a first conductor layer. A first electrode pad electrically connected to the first signal wiring pattern through a first via and a second electrode pad electrically connected to the second signal wiring pattern through a second via are formed in a second conductor layer as a surface layer. A third conductor layer is disposed between the first conductor layer and the second conductor layer with an insulator interposed between those conductor layers. A first pad electrically connected to the first via is formed in the third conductor layer. The first pad includes an opposed portion which overlaps the second electrode pad as viewed in a direction perpendicular to the surface of a printed board and which is opposed to the second electrode pad through intermediation of the insulator. This enables reduction of crosstalk noise caused between the signal wirings.

    Abstract translation: 第一和第二信号布线图案形成在第一导体层中。 通过第一通孔电连接到第一信号布线图案的第一电极焊盘和通过第二通孔电连接到第二信号布线图案的第二电极焊盘形成在作为表面层的第二导体层中。 第三导体层设置在第一导体层和第二导体层之间，绝缘体插在这些导体层之间。 电连接到第一通孔的第一焊盘形成在第三导体层中。 第一焊盘包括与垂直于印刷电路板的表面的方向观察的与第二电极焊盘重叠并且通过绝缘体与第二电极焊盘相对的相对部分。 这使得能够减少在信号布线之间引起的串扰噪声。

    Multilayer microstripline transmission line transition
    42.
    发明授权
    Multilayer microstripline transmission line transition 有权
    多层微带线传输线转换

    公开(公告)号：US08421551B2

    公开(公告)日：2013-04-16

    申请号：US12913741

    申请日：2010-10-27

    Applicant: Lance Dion Lascari

    Inventor： Lance Dion Lascari

    IPC: H03H7/38

    CPC classification number: H01P1/047 ,  H05K1/0222 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09618 ,  H05K2201/09718

    Abstract: A microstripline transmission line arrangement carries a signal having a fundamental frequency. The arrangement includes a first microstripline transmission line, a second microstripline transmission line, and a coaxial electrically conductive conduit interconnecting the first transmission line and the second transmission line. The conduit includes a signal conductor and an electrically grounded shield substantially surrounding the signal conductor. The conductor and the shield are positioned relative to each other to thereby comprise a means for lowpass filtering the signal. A cutoff frequency of the lowpass filtering is less than a third harmonic of the fundamental frequency.

    Abstract translation: 微带线传输线路布置具有基频的信号。 该装置包括第一微带线传输线，第二微带线传输线和互连第一传输线和第二传输线的同轴导电导管。 导管包括信号导体和基本上围绕信号导体的电接地屏蔽。 导体和屏蔽件相对于彼此定位，从而包括用于对信号进行低通滤波的装置。 低通滤波的截止频率小于基频的三次谐波。

    Multilayered printed wiring board
    43.
    发明授权
    Multilayered printed wiring board 有权
    多层印刷线路板

    公开(公告)号：US08367943B2

    公开(公告)日：2013-02-05

    申请号：US11831389

    申请日：2007-07-31

    Applicant: Youhong Wu ,  Masanori Tamaki

    Inventor： Youhong Wu ,  Masanori Tamaki

    IPC: H05K1/16

    CPC classification number: H05K1/115 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0352 ,  H05K2201/09454 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09627

    Abstract: A multilayered printed wiring board has a core substrate having a through hole opening with a radius R, a through hole structure formed at the through hole opening and including a lid-shaped conductive structure, a first interlaminar resin insulation layer formed over the core substrate and having a first via hole structure with a bottom radius r, and a second interlaminar resin insulation layer formed over the first interlaminar resin insulation layer and having a second via hole structure. The lid-shaped conductive structure is formed over the core substrate at an end portion of the through-hole opening and covering the end portion of the through-hole opening. The first via hole structure is formed on the lid-shaped conductive structure and has an electroless plated film and an electrolytic plated film. The second via hole structure has an electroless plated film and an electrolytic plated film. The first via hole has a gravity center at or beyond a radius D, where D=(R−r/3) and the radius D is measured from a gravity center of the through-hole opening, and the bottom radius r of the first via hole is larger than a bottom radius of the second via hole.

    Abstract translation: 多层印刷布线板具有芯基板，其具有半径为R的通孔开口，通孔结构形成在通孔开口处并且包括盖形导电结构，形成在芯基板上的第一层间树脂绝缘层和 具有底部半径r的第一通孔结构和形成在第一层间树脂绝缘层上并具有第二通孔结构的第二层间树脂绝缘层。 盖形导电结构在通孔开口的端部处形成在芯基板上，并且覆盖通孔开口的端部。 第一通孔结构形成在盖状导电结构上，并具有无电镀膜和电解电镀膜。 第二通孔结构具有无电解电镀膜和电解电镀膜。 第一通孔具有重心在半径D以上或超过半径D，其中D =（R-r / 3），并且半径D从通孔开口的重心测量，并且第一通孔的底部半径r 通孔大于第二通孔的底部半径。

    Rib reinforcement of plated thru-holes
    45.
    发明授权
    Rib reinforcement of plated thru-holes 有权
    电镀通孔肋筋加固

    公开(公告)号：US08319116B2

    公开(公告)日：2012-11-27

    申请号：US12557630

    申请日：2009-09-11

    Applicant: Jorge Eduardo Martinez-Vargas ,  Lien-Fen (Livia) Hu ,  Samuel Ming Sien Lee ,  James David Britton ,  Martin John Henson

    Inventor： Jorge Eduardo Martinez-Vargas ,  Lien-Fen (Livia) Hu ,  Samuel Ming Sien Lee ,  James David Britton ,  Martin John Henson

    IPC: H05K1/11

    CPC classification number: H05K1/116 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09627 ,  H05K2201/09781 ,  Y10T29/49124 ,  Y10T29/49142

    Abstract: Systems and methods for providing mechanically reinforced plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities and reliability, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB. One or more electrically-nonfunctional lands (or “rib reinforcements”) are provided in internal conductive layers to mechanically support the walls of the PCB. These rib reinforcements improve the mechanical strength of the PTHs without affecting the electrical performance and without impacting the ability to solder components to the PCB.

    Abstract translation: 本文描述了用于在PCB中提供机械加强电镀通孔（PTH）的系统和方法，其有利地允许改进的焊接能力和可靠性。 通过提供围绕PTH的一个或多个通孔来提供PTH与PCB的内部和底部导电层之间的电连接来减少PTH的散热效应来实现这种系统和方法。 在这方面，PTH与至少一个内部导电层（例如，接地层或功率层）间隔开，因此降低了散热效果。 该特征使得熔融焊料在冷冻之前基本上填充整个PTH，从而改善电气部件和PCB之间的机械和电连接。 在内部导电层中提供一个或多个电 - 非功能性焊盘（或肋加强件）以机械地支撑PCB的壁。 这些肋加强件可以改善PTH的机械强度，而不影响电气性能，并且不影响将部件焊接到PCB的能力。

    Printed circuit board and method of manufacturing the same
    47.
    发明申请
    Printed circuit board and method of manufacturing the same 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20120043128A1

    公开(公告)日：2012-02-23

    申请号：US13064657

    申请日：2011-04-06

    Applicant: Kyoung Ro Yoon ,  Joung Gul Ryu ,  Young Hwan Shin

    Inventor： Kyoung Ro Yoon ,  Joung Gul Ryu ,  Young Hwan Shin

    IPC: H05K1/11 ,  H05K3/42

    CPC classification number: H05K3/429 ,  H05K2201/09454 ,  H05K2201/09527 ,  H05K2203/1572 ,  Y10T29/49165

    Abstract: The present invention provides a multilayer printed circuit board and a method for manufacturing the same. The printed circuit board includes: an inner circuit layer which is disposed on a first insulating layer; a via land which is disposed on the first insulating layer to be spaced apart from the inner circuit layer and has a hole; a second insulating layer which is disposed on the first insulating layer including the inner circuit layer and the via land; first and second outer circuit layers which are disposed on outer surfaces of the first and second insulating layers, respectively; and a via which passes through the hole of the via land and the first and second insulating layers and electrically interconnects the first and second outer circuit layers.

    Abstract translation: 本发明提供一种多层印刷电路板及其制造方法。 印刷电路板包括：设置在第一绝缘层上的内部电路层; 通孔焊盘，其设置在所述第一绝缘层上以与所述内部电路层间隔开并具有孔; 第二绝缘层，其设置在包括内部电路层和通路接地的第一绝缘层上; 第一和第二外部电路层，分别设置在第一和第二绝缘层的外表面上; 以及通孔，其通过通孔接合区的孔和第一和第二绝缘层，并使第一和第二外部电路层电连接。

    RIB REINFORCEMENT OF PLATED THRU-HOLES
    50.
    发明申请
    RIB REINFORCEMENT OF PLATED THRU-HOLES 有权
    RIB加固镀层THRH-HOLES

    公开(公告)号：US20110061233A1

    公开(公告)日：2011-03-17

    申请号：US12557630

    申请日：2009-09-11

    Applicant: Jorge Eduardo Martinez-Vargas ,  Lien-Fen(Livia) Hu ,  Samuel Ming Sien Lee ,  James David Britton ,  Martin John Henson

    Inventor： Jorge Eduardo Martinez-Vargas ,  Lien-Fen(Livia) Hu ,  Samuel Ming Sien Lee ,  James David Britton ,  Martin John Henson

    IPC: H05K3/34 ,  H05K1/11

    CPC classification number: H05K1/116 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09627 ,  H05K2201/09781 ,  Y10T29/49124 ,  Y10T29/49142

    Abstract: Systems and methods for providing mechanically reinforced plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities and reliability, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB. One or more electrically-nonfunctional lands (or “rib reinforcements”) are provided in internal conductive layers to mechanically support the walls of the PCB. These rib reinforcements improve the mechanical strength of the PTHs without affecting the electrical performance and without impacting the ability to solder components to the PCB.

    Abstract translation: 本文描述了用于在PCB中提供机械加强电镀通孔（PTH）的系统和方法，其有利地允许改进的焊接能力和可靠性。 通过提供围绕PTH的一个或多个通孔来提供PTH与PCB的内部和底部导电层之间的电连接来减少PTH的散热效应来实现这种系统和方法。 在这方面，PTH与至少一个内部导电层（例如，接地层或功率层）间隔开，因此降低了散热效果。 该特征使得熔融焊料在冷冻之前基本上填充整个PTH，从而改善电气部件和PCB之间的机械和电连接。 在内部导电层中提供一个或多个电 - 非功能焊盘（或“肋加强件”）以机械地支撑PCB的壁。 这些肋加强件可以改善PTH的机械强度，而不影响电气性能，并且不影响将部件焊接到PCB的能力。

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