公开(公告)号：US08470680B2

公开(公告)日：2013-06-25

申请号：US12180768

申请日：2008-07-28

Applicant: John D. Prymak ,  Chris Stolarski ,  Alethia Melody ,  Antony P. Chacko ,  Gregory J. Dunn

Inventor： John D. Prymak ,  Chris Stolarski ,  Alethia Melody ,  Antony P. Chacko ,  Gregory J. Dunn

IPC: H01G4/005

CPC classification number: H05K1/162 ,  H01G9/012 ,  H01G9/042 ,  H01G9/045 ,  H01G9/15 ,  H05K3/429 ,  H05K2201/0329 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2201/09909 ,  H05K2203/0315 ,  Y10T29/417 ,  Y10T29/435

Abstract: A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.

公开(公告)号：US08465214B2

公开(公告)日：2013-06-18

申请号：US13057432

申请日：2010-01-21

Applicant: Andreas Matiss ,  Alexander Jacob ,  Christoph Leonhardt

Inventor： Andreas Matiss ,  Alexander Jacob ,  Christoph Leonhardt

IPC: G02B6/36

CPC classification number: H05K1/0243 ,  G02B6/4201 ,  G02B6/4274 ,  H05K1/024 ,  H05K3/3421 ,  H05K2201/09909 ,  H05K2201/10121 ,  H05K2201/10977 ,  Y10T29/49144

Abstract: An arrangement including an electrical conductor track carrier and a component applied on the conductor track carrier. The component is a fiber-optoelectronic component and has: a housing, at least one electro-optical or optoelectronic component, at least one fiber-optic interface connected to the electro-optical or optoelectronic component, and at least one electrical interface for connecting the component on the conductor track carrier. The electrical interface has at least one bent electrical soldering connection element which is attached by one end to a base connection section of the housing base and extends from there laterally toward the outside so that the other end of the soldering connection element projects laterally and is soldered laterally outside the outer housing contour on the conductor track carrier. The soldering connection element is bent away from the base connection section so that the base connection section is at a distance from the conductor track carrier.

Abstract translation: 一种包括电导体轨道载体和施加在导体轨道载体上的​​分量的装置。 该组件是光纤 - 光电子部件，并具有：壳体，至少一个电光或光电子部件，连接到电光或光电子部件的至少一个光纤接口，以及至少一个电接口，用于连接 导体轨道载体上的​​分量。 电接口具有至少一个弯曲的电焊接连接元件，该弯曲的电焊接连接元件一端连接到壳体基座的基部连接部分，并从其横向向外延伸，使得焊接连接元件的另一端向外突出并被焊接 在导体轨道载体上的​​外壳轮廓外侧。 焊接连接元件从基座连接部分弯曲，使得基座连接部分距离导体轨道架一定距离。

公开(公告)号：US08449143B2

公开(公告)日：2013-05-28

申请号：US12600377

申请日：2008-05-14

Applicant: Takeshi Miyakawa ,  Kenji Miyata ,  Taiki Nishi ,  Yoshihiko Okajima

Inventor： Takeshi Miyakawa ,  Kenji Miyata ,  Taiki Nishi ,  Yoshihiko Okajima

IPC: F21V7/00

CPC classification number: H05K1/0274 ,  H01L33/60 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0266 ,  H05K2201/0338 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: Provided is a metal base circuit board having a new function of a light reflection in addition to the conventional printed circuit board function for mounting electronic parts. The metal base circuit board has a circuit arranged on a metal plate via an insulation layer. A white film is arranged at least one the insulation layer.

Abstract translation: 提供除了用于安装电子部件的常规印刷电路板功能之外，还具有具有光反射的新功能的金属基底电路板。 金属基电路板具有通过绝缘层设置在金属板上的电路。 绝缘层至少布置有白色膜。

公开(公告)号：US20130114228A1

公开(公告)日：2013-05-09

申请号：US13631156

申请日：2012-09-28

Applicant: Apple Inc.

Inventor： Nicholas G. Merz ,  Hong Wang ,  Michael M. Nikkhoo ,  Dennis R. Pyper ,  Christopher Matthew Werner

IPC: H05K9/00 ,  H05K3/30 ,  H05K7/06

CPC classification number: H05K1/0218 ,  H05K3/284 ,  H05K2201/0317 ,  H05K2201/09618 ,  H05K2201/09872 ,  H05K2201/09909 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.

Abstract translation: 公开了用于制造具有电磁干扰（EMI）屏蔽的印刷电路板（PCB）的方法和装置，并且与传统的框架 - 屏蔽方法相比也具有减小的体积。 一些实施例包括通过将集成电路安装到PCB来制造PCB，通过多个接地通孔来概括对应于集成电路的区域，在PCB上选择性地施加绝缘层，使得接地通孔中的至少一个暴露， 以及选择性地在所述PCB上施加导电层，使得所述导电层覆盖所述集成电路的至少一部分，并且使得所述导电层耦合到暴露的所述接地通孔中的至少一个。

公开(公告)号：US20130107486A1

公开(公告)日：2013-05-02

申请号：US13590793

申请日：2012-08-21

Applicant: Pritesh HIRALAL

Inventor： Pritesh HIRALAL

IPC: H05K7/06 ,  H05K3/36

CPC classification number: H01G11/84 ,  H01G11/08 ,  H01G11/14 ,  H01M10/04 ,  H05K1/145 ,  H05K1/162 ,  H05K3/0097 ,  H05K3/361 ,  H05K3/368 ,  H05K3/4697 ,  H05K2201/09909 ,  H05K2201/10037 ,  H05K2203/1147 ,  Y02E60/13 ,  Y10T29/49126

Abstract: An apparatus comprising: first and second circuit boards with respective electrodes thereon, the first and second circuit boards in a bonded configuration; One or more first layers positioned to be proximal to the one or more of the electrodes; electrolyte proximal to the respective electrodes; one or more second layers configured to provide for the bonded configuration in which the first and second circuit boards are bonded together, under curing, such that the respective one or more first layers are positioned between the one or more second layers and the electrodes, the bonding defining a chamber therebetween with the electrodes therein and facing one another, the chamber comprising the electrolyte; and wherein the one or more first layers are configured to inhibit interaction of the electrolyte with the one or more second layers during curing.

Abstract translation: 一种装置，包括：第一和第二电路板，其上具有各自的电极，所述第一和第二电路板处于接合构型; 定位成邻近所述一个或多个电极的一个或多个第一层; 靠近各个电极的电解质; 一个或多个第二层，被配置为提供其中第一和第二电路板结合在一起的接合构造，在固化下，使得相应的一个或多个第一层位于一个或多个第二层和电极之间， 接合，其间具有电极并且彼此面对的室，所述室包括电解质; 并且其中所述一个或多个第一层被配置为在固化期间抑制所述电解质与所述一个或多个第二层的相互作用。

公开(公告)号：US20130048363A1

公开(公告)日：2013-02-28

申请号：US13304374

申请日：2011-11-24

Applicant: CHENG-FEI WENG ,  ZHENG-HENG SUN

Inventor： CHENG-FEI WENG ,  ZHENG-HENG SUN

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K1/0293 ,  H05K2201/0305 ,  H05K2201/0939 ,  H05K2201/09909 ,  H05K2203/1105 ,  H05K2203/173 ,  Y10T29/49124

Abstract: A circuit board includes a board, a first signal trace and a second signal trace on the board, a first solder pad formed on the board and connected to a terminal of the first signal trace near to one end of the second signal trace, and a second pad formed on the board and connected to a terminal of the second signal trace near to the first solder pad. The second pad is apart from the first pad. The first pad or the second pad is coated with solder. After heated, the solder melts and spread to the second pad or the first pad, thereby connecting the first signal trace to the second signal trace.

Abstract translation: 电路板包括板上的第一信号迹线和板上的第二信号迹线，形成在板上并连接到靠近第二信号迹线的一端的第一信号迹线的端子的第一焊盘，以及 第二焊盘形成在板上并连接到靠近第一焊盘的第二信号迹线的端子。 第二垫与第一垫不同。 第一焊盘或第二焊盘涂覆有焊料。 加热后，焊料熔化并扩散到第二焊盘或第一焊盘，从而将第一信号迹线连接到第二信号迹线。

公开(公告)号：US08322033B2

公开(公告)日：2012-12-04

申请号：US12206800

申请日：2008-09-09

Applicant: Toshimitsu Hirai ,  Tsuyoshi Shintate ,  Jun Yamada

Inventor： Toshimitsu Hirai ,  Tsuyoshi Shintate ,  Jun Yamada

IPC: H01R43/16

CPC classification number: H05K3/4069 ,  H05K1/092 ,  H05K3/125 ,  H05K3/4664 ,  H05K3/4679 ,  H05K2201/09909 ,  H05K2203/013 ,  H05K2203/1131 ,  H05K2203/1173 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49206

Abstract: A method for forming a conductive post include: a) forming a liquid repellent portion having a thickness of 100 nm or less by disposing a liquid repellent material in a conductive post forming region on a conductive layer; b) forming an insulation layer having an opening in a region overlapping with the conductive post forming region by disposing a liquid including an insulation layer forming material on the conductive layer having the liquid repellent portion formed thereon and polymerizing the insulation layer forming material; c) disposing metal particulates in the opening; and d) heating the metal particulates at a fusing temperature of the metal particulates or higher so as to fusion bond the metal particulates to each other in order to form the conductive post, and to fusion bond the metal particulates and the conductive layer in order to couple the conductive post with the conductive layer.

Abstract translation: 形成导电柱的方法包括：a）通过在导电层上的导电柱形成区域中设置疏液材料，形成厚度为100nm以下的疏液部分; b）通过在其上形成有疏液部分的导电层上设置包括绝缘层形成材料的液体来形成在与导电柱形成区域重叠的区域中具有开口的绝缘层，并使绝缘层形成材料聚合; c）在开口处设置金属微粒; 以及d）在所述金属微粒的熔融温度以上加热所述金属微粒以将所述金属微粒彼此熔合以形成所述导电柱，并将所述金属微粒和所述导电层熔合，以便 将导电柱与导电层耦合。

公开(公告)号：US20120266770A1

公开(公告)日：2012-10-25

申请号：US13474933

申请日：2012-05-18

Applicant: Gabriel L. Smith ,  Sarah Bedair

Inventor： Gabriel L. Smith ,  Sarah Bedair

IPC: F42B3/13 ,  C06C9/00 ,  F42C15/34 ,  B05D5/00 ,  B82Y30/00 ,  B82Y40/00

CPC classification number: H05K1/16 ,  B82Y30/00 ,  H05K3/1258 ,  H05K2201/0257 ,  H05K2201/086 ,  H05K2201/09909 ,  H05K2203/105

Abstract: A method of forming a device on a substrate comprising creating a depository and at least one attached capillary; the depository being of millimeter scale; providing a liquid containing particles in the range 1 nanometer to 1 millimeter; depositing into the depository the liquid containing particles which flows into at least one capillary by capillary action; evaporating the liquid such that the particles form an agglomerate beginning at the end of the at least one capillary with a substantially uniform distribution of the particles within the agglomerate; which is used to form a device. A microelectronic integrated circuit device comprising a substrate; a depository coupled to said substrate, the depository being formed by at least one wall adjacent to the substrate; at least one capillary channel coupled to at least one depository that is formed by walls adapted to be filled with a liquid (by capillary action) comprising nanoparticles.

Abstract translation: 一种在衬底上形成器件的方法，包括形成存储器和至少一个连接的毛细管; 存储器为毫米级; 提供含有1纳米至1毫米范围内的颗粒的液体; 通过毛细管作用将含有流入至少一个毛细管的含有液体的液体沉积到储存器中; 蒸发液体，使得颗粒形成从至少一个毛细管的末端开始的附聚物，其中颗粒在附聚物内具有基本均匀的分布; 用于形成设备。 一种微电子集成电路器件，包括衬底; 耦合到所述衬底的沉积物，所述沉积物由与所述衬底相邻的至少一个壁形成; 至少一个毛细管通道，其耦合到至少一个储存器，所述至少一个储存器由适于填充有包含纳米颗粒的液体（通过毛细管作用）的壁形成。

公开(公告)号：US08294031B2

公开(公告)日：2012-10-23

申请号：US12697407

申请日：2010-02-01

Applicant: Detlev Bagung ,  Michael Decker ,  Gregory Drew ,  Thomas Riepl ,  Bernd Roller

Inventor： Detlev Bagung ,  Michael Decker ,  Gregory Drew ,  Thomas Riepl ,  Bernd Roller

IPC: H05K1/00

CPC classification number: H05K3/3452 ,  H05K1/0278 ,  H05K1/028 ,  H05K3/4691 ,  H05K2201/0989 ,  H05K2201/09909 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T428/24273

Abstract: A solder resist coating for a rigid-flex circuit board contains one or more conductor tracks and at least one flex area. The solder resist coating has one or more movement gaps in the flex area of the circuit board. In addition, an electronic module is formed having at least one rigid-flex circuit board with a solder resist coating.

Abstract translation: 用于刚性 - 柔性电路板的阻焊涂层包含一个或多个导体轨道和至少一个弯曲区域。 阻焊涂层在电路板的柔性区域中具有一个或多个移动间隙。 此外，形成具有至少一个具有阻焊涂层的刚性 - 柔性电路板的电子模块。

公开(公告)号：US20120236227A1

公开(公告)日：2012-09-20

申请号：US13192021

申请日：2011-07-27

Applicant: SAE SAM JANG ,  Sung Won Chung ,  Jae Hwan Chun ,  Jin Min Chung ,  Kyung Rok Ko

Inventor： SAE SAM JANG ,  Sung Won Chung ,  Jae Hwan Chun ,  Jin Min Chung ,  Kyung Rok Ko

IPC: G02F1/1333

CPC classification number: G02F1/133308 ,  G02F1/1339 ,  G02F2001/133311 ,  G02F2001/13332 ,  G02F2202/22 ,  H05K5/0213 ,  H05K2201/09909

Abstract: A liquid crystal display includes a liquid crystal panel displaying images, a plurality of gate circuit chips-on-film connected to the liquid crystal panel and supplying gate driving signals to the liquid crystal panel, a plurality of data circuit chips-on-film connected to the liquid crystal panel and supplying data driving signals to the liquid crystal panel, a gate printed circuit board (PCB) connected to the gate circuit chips-on-film, a data printed circuit board (PCB) connected to the data circuit chips-on-film, a backlight assembly supplying light to the liquid crystal panel, and a top chassis fixing the liquid crystal panel and the backlight assembly, and including an upper surface and a lower surface, wherein the data printed circuit board (PCB) is disposed corresponding to the lower surface of the top chassis, and a plurality of drain holes are disposed in the lower surface of the top chassis.

Abstract translation: 液晶显示器包括显示图像的液晶面板，与液晶面板连接的多个栅极电路芯片，并将栅极驱动信号提供给液晶面板，多个数据电路芯片在膜上连接 向液晶面板提供数据驱动信号，向薄膜上的栅极电路连接的栅极印刷电路板（PCB），与数据电路芯片连接的数据印刷电路板（PCB） 在液晶面板上提供光的背光组件和固定液晶面板和背光组件的顶板，并且包括上表面和下表面，其中数据印刷电路板（PCB）被布置 对应于顶部底盘的下表面，并且多个排水孔设置在顶部底盘的下表面中。