公开(公告)号：US20190189326A1

公开(公告)日：2019-06-20

申请号：US16210524

申请日：2018-12-05

Applicant: NXP B.V.

Inventor： MUSTAFA ACAR ,  Jawad Hussain Qureshi ,  Mark Pieter van der Heijden

IPC: H01F17/00 ,  H01F17/04 ,  H01F27/28 ,  H01F41/04 ,  H05K1/16

CPC classification number: H01F17/0013 ,  H01F17/045 ,  H01F27/2804 ,  H01F41/041 ,  H01F2017/0073 ,  H01F2017/046 ,  H05K1/165 ,  H05K2201/1003

Abstract: An inductor and a method of making an inductor. The inductor includes a stack of dielectric layers. The inductor also includes a plurality of metal levels comprising patterned metallic features of the inductor. Each metal level is located at an interface between adjacent dielectric layers in the stack. The patterned metallic features include a first plurality of inductor windings arranged in a substantially flat spiral in one of the metal levels. The patterned metallic features also include a second plurality of inductor windings in which each winding is located in a respective one of the plurality of metal levels. The first plurality of windings is connected in series with the second plurality of windings.

公开(公告)号：US20190140551A1

公开(公告)日：2019-05-09

申请号：US16024793

申请日：2018-06-30

Applicant: Delta Electronics (Thailand) Public Company Limited

Inventor： Hao LU ,  Tianding Hong ,  Bofeng Xu ,  Jie Ruan ,  Jinfa Zhang

IPC: H02M7/00 ,  H05K1/14 ,  H05K1/02

CPC classification number: H02M7/003 ,  H02M2001/0048 ,  H05K1/0242 ,  H05K1/0263 ,  H05K1/141 ,  H05K2201/09045 ,  H05K2201/09909 ,  H05K2201/1003 ,  H05K2201/10272

Abstract: A rectification module includes a transformer, a connecting unit and a rectification unit. The transformer includes a first lateral region, a second lateral region and at least one secondary winding assembly. The second lateral region is located beside the first lateral region. The secondary winding assembly includes plural outlet ends. The plural outlet ends are arranged near the first lateral region. The connecting unit is located at the first lateral region, and includes plural conducting parts. Each of the conducting parts includes at least one opening and at least one connecting structure. The conducting parts are partially or completely stacked on each other. The outlet ends are accommodated within the corresponding openings. The conducting parts are fixed on the first lateral region. The connecting structures face the second lateral region. The rectification unit includes a circuit board and plural rectifier components.

公开(公告)号：US20180331081A1

公开(公告)日：2018-11-15

申请号：US15777458

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Eng Huat Goh ,  Wee Hoe ,  Khang Choong Yong ,  Ping Ping Ooi

IPC: H01L25/16 ,  H01L25/18 ,  H05K1/18 ,  H01L23/538 ,  H01L25/00 ,  H05K3/30 ,  H05K1/14

CPC classification number: H01L25/16 ,  H01L23/48 ,  H01L23/5386 ,  H01L25/065 ,  H01L25/18 ,  H01L25/50 ,  H01L2924/1432 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19042 ,  H01L2924/19106 ,  H05K1/144 ,  H05K1/147 ,  H05K1/181 ,  H05K3/303 ,  H05K2201/048 ,  H05K2201/055 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/10356 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.

公开(公告)号：US20180315542A1

公开(公告)日：2018-11-01

申请号：US15960391

申请日：2018-04-23

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Chiharu HAYASHI

IPC: H01F27/29 ,  H01F27/28 ,  H05K1/11 ,  H05K1/18 ,  H01F27/24

CPC classification number: H01F27/29 ,  H01F27/24 ,  H01F27/2823 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/1003

Abstract: In an embodiment, a coil component includes: a core 10 having a pillar part 24, and a hollow space 22 around the pillar part 24; a coil conductor 40 having a spiral part 42 placed around the pillar part 24, and a lead part 48a or 48b led out from the spiral part 42 toward the bottom face 28 of the core 10, which lead part includes an end part 46a or 46b extending in parallel with the bottom face 28 and serves as an external terminal 49a or 49b; and an insulated terminal 60 electrically insulated from the coil conductor 40, which is provided on at least the bottom face 28; wherein the total base area of the bottom part 72 of the dummy terminal 60, on the bottom face 28, is greater than the total base area of the external terminals 49a, 49b.

公开(公告)号：US20180263121A1

公开(公告)日：2018-09-13

申请号：US15913094

申请日：2018-03-06

Applicant: BorgWarner Ludwigsburg GmbH

Inventor： Sisay Tadele ,  Helmut Hoppe ,  Alexander Dauth ,  Gerd Bräuchle

IPC: H05K3/30

CPC classification number: H05K3/306 ,  H01G2/06 ,  H01G2/106 ,  H01G9/06 ,  H01G9/08 ,  H01G9/26 ,  H05K1/18 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/09027 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10265 ,  H05K2201/10272 ,  H05K2201/10522 ,  H05K2201/10606 ,  H05K2201/10628 ,  H05K2201/10651 ,  H05K2201/10901 ,  H05K2201/2018 ,  H05K2201/2045

Abstract: What is described is a mounting aid for mounting electrical components, in particular electrolytic capacitors or chokes, on a printed circuit board, said mounting aid comprising a body, which has compartments for receiving the electrical components, wherein the compartments have a base with openings for the insertion of connection wires of the electrical components, and metal parts fastened to the body, which metal parts each form at least one contact pin on the underside of the body and each from a busbar for connection to electrical components in a plurality of compartments of the body.

公开(公告)号：US20180263106A1

公开(公告)日：2018-09-13

申请号：US15914228

申请日：2018-03-07

Applicant: Delphi International Operations Luxembourg S.A.R.L

Inventor： Timo Feismann ,  Matthias Rieke

IPC: H05K1/02 ,  H05K7/20 ,  H05K1/14 ,  H02K7/14 ,  H02K11/33 ,  H02K21/24 ,  F04D25/06 ,  F04D25/08 ,  F04D29/28

CPC classification number: H05K1/0203 ,  F04D25/068 ,  F04D25/08 ,  F04D29/282 ,  H02K7/14 ,  H02K11/33 ,  H02K21/24 ,  H02K2203/03 ,  H02K2211/03 ,  H05K1/144 ,  H05K7/20172 ,  H05K7/20863 ,  H05K2201/042 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/1003 ,  H05K2201/1009

Abstract: An electronic assembly including a cooling device comprises a cooling plate equipped, on its upper face, with a plurality of pin-fins; a first printed circuit board including at least one heat-generating zone bearing against the lower face of the cooling plate; each pin including a blowing means comprising a hub equipped with blades, the blades being arranged axially along each pin so as to be able to rotate about the pin, thus creating a flow of air for cooling the pins.

公开(公告)号：US10039190B2

公开(公告)日：2018-07-31

申请号：US15195134

申请日：2016-06-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshimasa Yoshioka ,  Kenji Nishiyama ,  Daisuke Takagi

IPC: H05K1/18 ,  H01F27/28 ,  H01F27/24 ,  H01F3/08 ,  H01F5/00 ,  G07D7/164 ,  H01F27/29

CPC classification number: H05K1/18 ,  G07D7/164 ,  H01F3/08 ,  H01F5/003 ,  H01F27/292 ,  H05K2201/1003

Abstract: A coil component includes a mounting surface that is a side mounted on a mounting board and a detecting surface that is a side generating a magnetic field to detect a distance from a detected conductor. The coil component has a coil conductor formed into a spiral shape, and a magnetic resin disposed on the mounting surface side of the coil conductor without being disposed on the detecting surface side of the coil conductor.

公开(公告)号：US10008757B2

公开(公告)日：2018-06-26

申请号：US15394868

申请日：2016-12-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kunitoshi Hanaoka

IPC: H01P1/00 ,  H01P5/18 ,  H03H7/38 ,  H04B1/04 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H02M1/00

CPC classification number: H01P5/18 ,  H01P5/184 ,  H01P5/187 ,  H02M1/00 ,  H03H7/38 ,  H04B1/04 ,  H05K1/0243 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/09772 ,  H05K2201/1003

Abstract: An inductor component is disposed outside a multilayer substrate, and thus a directional coupler defined by an internal wiring electrode and a coil electrode within the inductor component that is mounted on a pair of land electrodes, the multilayer substrate significantly reduces or prevents interference with other high-frequency circuit elements disposed in or on the multilayer substrate. Additionally, if a plurality of inductor components having different inductor characteristics are prepared, a high-frequency module including the multilayer substrate capable of defining the directional coupler whose characteristics are able to adjusted with ease is able to be provided simply by selecting the desired inductor component from the inductor components and replacing that inductor component.

公开(公告)号：US20180177052A1

公开(公告)日：2018-06-21

申请号：US15896959

申请日：2018-02-14

Applicant: QUALCOMM Incorporated

Inventor： Chengjie Zuo ,  David Francis Berdy ,  Daeik Daniel Kim ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  Jonghae Kim

IPC: H05K1/18 ,  H03H7/01 ,  H05K3/10 ,  H05K3/30 ,  H05K3/40 ,  H01L21/56 ,  H01L23/12 ,  H01L23/15 ,  H01L23/28

CPC classification number: H05K1/181 ,  H01L21/56 ,  H01L23/12 ,  H01L23/15 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H03H7/0138 ,  H05K1/0218 ,  H05K1/141 ,  H05K3/10 ,  H05K3/303 ,  H05K3/4007 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/09227 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10962 ,  H05K2201/2036

Abstract: Passive device assembly for accurate ground plane control is disclosed. A passive device assembly includes a device substrate conductively coupled to a ground plane separation control substrate. A passive device disposed on a lower surface of the device substrate is separated from an embedded ground plane mounted on a lower surface of the ground plane separation control substrate by a separation distance. The separation distance is accurately controlled to minimize undesirable interference that may occur to the passive device. The separation distance is provided inside the passive device assembly. Conductive mounting pads are disposed on the lower surface of the ground plane separation control substrate to support accurate alignment of the passive device assembly on a circuit board. By providing sufficient separation distance inside the passive device assembly, the passive device assembly can be precisely mounted onto any circuit board regardless of specific design and layout of the circuit board.

公开(公告)号：US20180174758A1

公开(公告)日：2018-06-21

申请号：US15664931

申请日：2017-07-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Jong LEE ,  Han KIM ,  Seung Hee HONG ,  Min Ki JUNG ,  Su Bong JANG

IPC: H01G4/40 ,  H01G4/232 ,  H01G4/012 ,  H01G4/30 ,  H05K1/11 ,  H05K1/18 ,  H01F27/28 ,  H01F27/29 ,  H01F27/40

CPC classification number: H01G4/40 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F27/32 ,  H01F27/40 ,  H01F2027/2809 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/1006

Abstract: A composite electronic component includes a body including a capacitor unit and an inductor unit and having a plurality of insulating layers stacked in a first direction perpendicular to a mounting surface of the body. A plurality of external electrodes are on external surfaces of the body. The capacitor unit includes first and second internal electrodes alternately stacked with insulating layers interposed therebetween. The inductor unit includes a coil including coil patterns having a spiral shape, on respective insulating layers, and connected together.