公开(公告)号：US08705775B2

公开(公告)日：2014-04-22

申请号：US12597572

申请日：2008-04-25

Applicant: Mark Sheplak ,  David Patrick Arnold

Inventor： Mark Sheplak ,  David Patrick Arnold

IPC: H04R25/00

CPC classification number: H04R31/006 ,  H01L2224/16225 ,  H04R1/04 ,  H04R19/04 ,  H04R31/003 ,  H04R2201/02 ,  H04R2201/029 ,  H04R2231/00 ,  H04R2400/00 ,  H05K1/0272 ,  H05K1/16 ,  H05K1/185 ,  H05K3/46 ,  H05K2201/10083 ,  Y10T29/49005 ,  Y10T29/49226

Abstract: A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micro-machined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.

Abstract translation: 提供一种电容麦克风及其制造方法。 可以在第一印刷电路板（PCB）中形成一个或多个孔。 膜片可以在具有一个或多个孔的区域上被表面微加工到第一PCB的内表面上。 接口电子元件也可以互连到PCB的内表面。 一个或多个间隔PCB可以连接到第二PCB到第一PCB，使得形成互连通孔之间的适当互连。 可以将第二PCB和间隔件之间的第一PCB连接起来，以便形成隔膜和接口电子设备所在的空腔。

公开(公告)号：US20130199829A1

公开(公告)日：2013-08-08

申请号：US13641860

申请日：2011-04-21

Applicant: Thomas Gottwald

Inventor： Thomas Gottwald

IPC: H05K1/03 ,  H05K3/00 ,  H05K1/02

CPC classification number: H05K1/0306 ,  G01L19/0645 ,  H05K1/02 ,  H05K1/0243 ,  H05K1/183 ,  H05K3/0067 ,  H05K3/4697 ,  H05K2201/10083 ,  H05K2201/10151 ,  H05K2203/063 ,  H05K2203/1147 ,  Y10T156/1062

Abstract: A printed circuit board multilayer construction comprising a layer stack composed of plurality of electrically insulating and/or conductive layers arranged one above another and a cavity in the interior of the layer stack, which extends laterally only in a partial region of the areal extent of the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction through an opening provided in the layer stack and is sealed relative to ingress of liquid. Furthermore, the present invention relates to a method suitable for producing a printed circuit board multilayer construction of this type.

Abstract translation: 一种印刷电路板多层结构，其包括由多层电绝缘和/或导电层组成的层叠层和层堆叠内部的空腔，其仅横向延伸到层叠层的面积范围的局部区域 层堆叠通过设置在层叠中的开口暴露于围绕印刷电路板多层结构的压力，并且相对于液体的入口被密封。 此外，本发明涉及一种适用于制造这种类型的印刷电路板多层结构的方法。

公开(公告)号：US08476720B2

公开(公告)日：2013-07-02

申请号：US13172604

申请日：2011-06-29

Applicant: Chia-Ming Liu

Inventor： Chia-Ming Liu

IPC: H01L29/84

CPC classification number: H05K1/181 ,  B81C1/0023 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/1461 ,  H05K1/0201 ,  H05K3/3431 ,  H05K2201/10083 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00

Abstract: A sensing unit package with reduced size and improved thermal sensing capabilities. An exemplary package includes a printed circuit board with a plurality of electrical traces, an application-specific integrated circuit (Analog ASIC) chip, and a micromachined sensor formed on a microelectromechanical system (MEMS) die. The Analog ASIC chip is electrically and mechanically attached to the printed circuit board. The MEMS die is in direct electrical communication with only a portion of the electrical traces of the printed circuit board and is mechanically and thermally attached directly to the Analog ASIC chip. A thermally conducting compound is located between the MEMS die and the Analog ASIC chip. One or more solder balls electrically attach the Analog ASIC chip to the printed circuit board and one or more solder traces electrically attach the MEMS die to the printed circuit board.

Abstract translation: 感测单元封装尺寸减小，热感测能力更强。 示例性封装包括具有多个电迹线的印刷电路板，专用集成电路（Analog ASIC）芯片，以及形成在微机电系统（MEMS））芯片上的微机械传感器。 模拟ASIC芯片电气和机械连接到印刷电路板。 MEMS管芯与印刷电路板的仅一部分电迹线直接电连通，并且机械和热连接到模拟ASIC芯片。 导热化合物位于MEMS管芯和模拟ASIC芯片之间。 一个或多个焊球将模拟ASIC芯片电连接到印刷电路板，并且一个或多个焊迹迹线将MEMS管芯电连接到印刷电路板。

公开(公告)号：US20130014976A1

公开(公告)日：2013-01-17

申请号：US13485274

申请日：2012-05-31

Applicant: Saori ISHIGAKI ,  Jun ISHII ,  Yoshito FUJIMURA ,  Yuu SUGIMOTO

Inventor： Saori ISHIGAKI ,  Jun ISHII ,  Yoshito FUJIMURA ,  Yuu SUGIMOTO

IPC: H05K1/00 ,  H05K3/10 ,  H05K1/05

CPC classification number: H05K1/189 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/4873 ,  H05K3/321 ,  H05K2201/0385 ,  H05K2201/053 ,  H05K2201/09072 ,  H05K2201/10083

Abstract: [Purpose] To provide a wired circuit board in which it is possible to inhibit a conductive adhesive from leaking to the outside, while inhibiting terminals from being increased in size, and also improve connection reliability.[Solving Means] A suspension board with circuit 3 includes power-source wires 25B, and piezoelectric-side terminals 40 formed continuously to the power-source wires 25B and electrically connected thereunder to piezoelectric elements 5. Each of the piezoelectric-side terminals 40 includes an outer contact portion 51, and an inner contact portion 53 provided around the outer contact portion 51 to protrude below the outer contact portion 51.

Abstract translation: [目的]提供一种布线电路基板，其中可以抑制导电粘合剂泄漏到外部，同时抑制端子的尺寸增加，并且还提高连接可靠性。 具体实施方式具有电路3的悬挂基板包括电源线25B和压电侧端子40，压电侧端子40与电源线25B连续地形成，并且与压电元件5电连接。各压电侧端子40包括 外接触部51和设置在外接触部51周围的内接触部53，突出到外接触部51的下方。

公开(公告)号：US08339798B2

公开(公告)日：2012-12-25

申请号：US12832885

申请日：2010-07-08

Applicant: Jahan Minoo ,  Anthony P. N. Bidmead ,  Michael Nikkhoo

Inventor： Jahan Minoo ,  Anthony P. N. Bidmead ,  Michael Nikkhoo

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/00 ,  H05K1/16

CPC classification number: H05K1/183 ,  H04R1/025 ,  H04R1/04 ,  H05K1/02 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0919 ,  H05K2201/10053 ,  H05K2201/10083 ,  H05K2201/10356 ,  H05K2201/10446

Abstract: Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices.

Abstract translation: 印刷电路板配有嵌入式组件。 嵌入式部件可以安装在印刷电路板基板的表面中的凹部内。 印刷电路板基板可以具有可以安装电线的凹槽和埋入通道。 凹部可以设置有焊料，焊丝可以焊接或者用导电粘合剂附着。 集成开关可以设置在印刷电路板基板的开口内。 集成开关可以具有安装在开口内的圆顶开关构件。 用于开关的盖构件可以由覆盖圆顶开关构件的柔性层形成。 集成开关的端子可以由内部印刷电路板层中的导电结构形成。 互连可用于电连接嵌入式组件，例如开关，集成电路，电线焊盘和其他设备。

公开(公告)号：US08228681B2

公开(公告)日：2012-07-24

申请号：US12607571

申请日：2009-10-28

Applicant: Gil Ju Jin ,  Jung Lim Park ,  Jae Yk Kim

Inventor： Gil Ju Jin ,  Jung Lim Park ,  Jae Yk Kim

IPC: H05K7/00

CPC classification number: A61B8/4494 ,  A61B8/00 ,  A61B8/4461 ,  A61B8/4483 ,  B06B1/0622 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/055 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10083 ,  H05K2201/10462 ,  Y02P70/613

Abstract: Disclosed herein are a printed circuit board (PCB) and a probe including the same. The probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.

Abstract translation: 这里公开了印刷电路板（PCB）和包括该电路板的探针。 探头包括换能器，具有经由面对面接触与换能器接触的图案部分的PCB以及将换能器接合到PCB的图案部分的接合构件。 PCB的接合部分设置有图案部分以增加接合部分的接合面积，并且允许接合部件不仅接触接合部分的金属层，而且接触其电绝缘部分，从而改善接合 传感器和PCB之间的力。 结果，换能器可以可靠地结合到PCB，使得可以防止换能器的性能由于PCB和换能器之间的不良连接而劣化。

公开(公告)号：US20120121117A1

公开(公告)日：2012-05-17

申请号：US13274143

申请日：2011-10-14

Applicant: Dongok KIM

Inventor： Dongok KIM

IPC: H04R1/02 ,  H05K5/00

CPC classification number: H04M1/03 ,  H04M1/02 ,  H04M1/026 ,  H04R2499/11 ,  H05K3/326 ,  H05K3/4015 ,  H05K2201/10083

Abstract: A mobile terminal is provided. The mobile terminal includes a case defining a body of the mobile terminal, a circuit board located in the body, an electronic device located in the body, a mounting portion formed at the case so as to mount the electronic device to the case, and a connection terminal provided at the circuit board, the connection terminal providing an elastic contact between the circuit board and the electronic device, the electronic device being electrically connected to the circuit board via the connection terminal.

Abstract translation: 提供移动终端。 移动终端包括限定移动终端的主体的壳体，位于主体中的电路板，位于主体中的电子设备，形成在壳体上以将电子设备安装到壳体上的安装部分，以及 所述连接端子设置在所述电路板上，所述连接端子在所述电路板与所述电子设备之间提供弹性接触，所述电子设备经由所述连接端子电连接到所述电路板。

公开(公告)号：US08175299B2

公开(公告)日：2012-05-08

申请号：US10586575

申请日：2004-10-01

Applicant: Cheong-Dam Song ,  Eek-Joo Chung ,  Jun Lim ,  Sung-Ho Park ,  Hyun-Ho Kim

Inventor： Cheong-Dam Song ,  Eek-Joo Chung ,  Jun Lim ,  Sung-Ho Park ,  Hyun-Ho Kim

IPC: H04R25/00

CPC classification number: H04R1/06 ,  H04R19/04 ,  H05K1/181 ,  H05K2201/09072 ,  H05K2201/10083 ,  Y02P70/611

Abstract: A condenser microphone mountable on a main PCB includes a cylinder-shaped case having opened and closed sides; a first metal ring inserted into the case; a disk-shaped back plate having a sound hole to be connected electrically to the case through the first metal ring; a spacer; an insulating ring to provide electrical insulation and mechanical support. A diaphragm is inserted into the insulating ring and faces the back plate while interposing the spacer between the diaphragm and the back plate. A second metal ring is connected electrically to the diaphragm and mechanically supports the diaphragm, and a PCB is mounted and forms with a sound hole. The PCB is connected to the back plate through the second metal ring and the case, and the PCB includes connection terminals.

Abstract translation: 可安装在主PCB上的电容麦克风包括具有开放和封闭侧面的圆柱形壳体; 插入壳体中的第一金属环; 具有通过第一金属环与壳体电连接的声孔的盘形背板; 间隔物 绝缘环提供电气绝缘和机械支撑。 将隔膜插入绝缘环中并面向后板，同时将间隔件插入隔膜和背板之间。 第二金属环与隔膜电连接并且机械地支撑隔膜，并且PCB被安装并形成有声孔。 PCB通过第二金属环和外壳连接到背板，PCB包括连接端子。

公开(公告)号：US20120086516A1

公开(公告)日：2012-04-12

申请号：US13253394

申请日：2011-10-05

Applicant: Hiroyuki MURAKOSHI ,  Kenji KASAHARA ,  Daisuke NISHIYAMA

Inventor： Hiroyuki MURAKOSHI ,  Kenji KASAHARA ,  Daisuke NISHIYAMA

IPC: H03B5/30

CPC classification number: H03L1/028 ,  H05K1/0271 ,  H05K3/3442 ,  H05K2201/09063 ,  H05K2201/10083 ,  H05K2201/10636 ,  Y02P70/611

Abstract: Provided is an oven controlled crystal oscillator which can reduce an occurrence of cracks in an applied solder of a large-sized circuit component and improve reliability. It is an oven controlled crystal oscillator in which a slit is formed in a periphery or below a lower surface of a large-sized circuit component provided on the substrate, further, a plurality of small-sized circuit components, which are smaller than the large-sized circuit component, are disposed around the large-sized circuit component, as necessary, and for the plurality of small-sized circuit components, an electronic component, which is electrically connected, and a dummy electronic component, which is not electrically connected, are used.

Abstract translation: 本发明提供一种可控制晶体振荡器，其可以减少大尺寸电路元件的焊接中出现的裂缝，提高可靠性。 它是一种烤箱控制的晶体振荡器，其中在设置在基板上的大尺寸电路部件的下表面的周边或下方形成有狭缝，此外，多个小型电路部件小于大 根据需要设置在大尺寸电路部件周围，对于多个小型电路部件，电连接的电子部件和未电气连接的虚拟电子部件， 被使用。

公开(公告)号：US08125791B2

公开(公告)日：2012-02-28

申请号：US12124933

申请日：2008-05-21

Applicant: Hiroyuki Hirota ,  Takashi Hasegawa

Inventor： Hiroyuki Hirota ,  Takashi Hasegawa

IPC: H05K7/02

CPC classification number: H04M1/0277 ,  H04M1/0214 ,  H04M1/026 ,  H04M1/03 ,  H05K3/32 ,  H05K3/325 ,  H05K2201/10083 ,  H05K2201/1031 ,  H05K2201/10446 ,  H05K2201/10962 ,  Y02P70/611

Abstract: A portable electronic device includes a case, a circuit board in the case, an electronic component in the case. The electronic component includes a connection terminal and a portion facing a side surface of the circuit board. The portable electronic device also includes a terminal member for connecting the circuit board and the connection terminal of the electronic component.

Abstract translation: 便携式电子设备包括壳体，壳体中的电路板，壳体中的电子部件。 电子部件包括连接端子和面向电路板的侧面的部分。 便携式电子设备还包括用于连接电路板和电子部件的连接端子的端子部件。