公开(公告)号：US11688984B2

公开(公告)日：2023-06-27

申请号：US17351652

申请日：2021-06-18

Applicant: TE Connectivity Germany GmbH

Inventor： Dominik Heiss ,  Philipp Kowarsch ,  Tobias Meissner ,  Frank Wittrock

IPC: H01R4/36 ,  H01R27/02 ,  H01R13/50 ,  H01R13/52 ,  H01R13/66 ,  H01R43/20 ,  H01R43/24 ,  H05K1/18 ,  H01R12/57 ,  H01R12/58

CPC classification number: H01R27/02 ,  H01R13/50 ,  H01R13/521 ,  H01R13/6683 ,  H01R43/205 ,  H01R43/24 ,  H05K1/18 ,  H01R12/57 ,  H01R12/58 ,  H05K2201/09227 ,  H05K2201/09281 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/2009

Abstract: A high-current contact device includes a first contact element transmitting electrical energy, a circuit carrier, a first data contact transmitting data, and a data interface. The first contact element extends through the circuit carrier along a mating axis at a feedthrough. A conductor track of the circuit carrier electrically connects the first data contact to the data interface. A carrier of the circuit carrier is injection-molded and mechanically supports the first data contact, the conductor track, and the data interface.

公开(公告)号：US20230197622A1

公开(公告)日：2023-06-22

申请号：US17559431

申请日：2021-12-22

Applicant: Intel Corporation

Inventor： Karumbu Meyyappan ,  Jeffory L, Smalley ,  Gregorio Murtagian ,  Srikant Nekkanty ,  Pooya Tadayon ,  Eric J.M. Moret ,  Bijoyraj Sahu

IPC: H01L23/538 ,  H01L23/498 ,  H01R12/52 ,  H01L25/00 ,  H01L25/18 ,  H01L25/065 ,  H01R12/58 ,  H05K3/32 ,  H05K1/18

CPC classification number: H01L23/5384 ,  H01L23/49827 ,  H01L23/5385 ,  H01R12/52 ,  H01L25/50 ,  H01L25/18 ,  H01L25/0655 ,  H01R12/58 ,  H05K3/32 ,  H05K1/181 ,  H05K2201/10189 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/1053

Abstract: An electronic system and associated methods are disclosed. In one example, the electronic system includes an interposer including electrically conductive interposer interconnect, a first interposer surface, and a second interposer surface; a processor package including at least one processor integrated circuit (IC), the processor package attached to the first interposer surface and electrically connected to the interposer interconnect; a first liquid metal well array including multiple liquid metal wells attached to a second interposer surface and the interposer interconnect; a second liquid metal well array including a first array surface attached to the first interposer surface and the interposer interconnect; and a packaged companion IC to the processor IC attached to a second array surface of the second liquid metal well array.

公开(公告)号：US20230187858A1

公开(公告)日：2023-06-15

申请号：US17548688

申请日：2021-12-13

Applicant: Mellanox Technologies Ltd.

Inventor： Tamir LEDERMAN ,  Aziz MAZBAR ,  Tomer KLEIN ,  Alexander SHUSTERMAN ,  Andrey GER

IPC: H01R12/70 ,  H05K1/18

CPC classification number: H01R12/7052 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/10189

Abstract: A device may include a frame, a first leg extending from the frame, and a second leg extending from the frame, wherein each of the first leg and the second leg is curved in a respective direction, the respective directions being different.

公开(公告)号：US11673038B1

公开(公告)日：2023-06-13

申请号：US17650715

申请日：2022-02-11

Applicant: Lifeware Labs, LLC

Inventor： Alexandros Charalambides ,  Brian Stancil ,  Andrew Rape ,  Nolen Keeys ,  Carmel Majidi ,  Philip LeDuc

IPC: G08B5/36 ,  A63B71/06 ,  A63B71/14 ,  G06F3/14 ,  H05K1/18 ,  H05K5/00

CPC classification number: A63B71/0622 ,  A63B71/143 ,  G06F3/1423 ,  G08B5/36 ,  H05K1/189 ,  H05K5/0017 ,  A63B2071/0655 ,  A63B2071/0663 ,  A63B2071/0694 ,  A63B2209/08 ,  A63B2225/20 ,  A63B2225/50 ,  A63B2225/74 ,  H05K2201/10189

Abstract: An apparatus for communication, a system thereof, and methods of manufacture thereof are provided. The apparatus comprises a body and a printed circuit board (PCB) operatively coupled to the body. The PCB comprises a processing unit, a first communication module operatively coupled to the processing unit, and an array of assemblies. The first communication module is configured to communicate with a secondary communication module wirelessly. The array of assemblies comprises at least two rows and at least two columns. Each assembly comprises a switch and a light. The array of assemblies are operatively coupled to the processing unit. Each light is configured to change a state responsive to at least one of a change in state by the switch within the same assembly and a control signal from the first communication module.

公开(公告)号：US20230178923A1

公开(公告)日：2023-06-08

申请号：US17924086

申请日：2021-05-05

Applicant: JABIL INC.

Inventor： MARCEL MOORTGAT ,  WENLU WANG

IPC: H01R13/516 ,  H05K1/11 ,  H01R13/631

CPC classification number: H01R13/516 ,  H05K1/111 ,  H01R13/631 ,  H05K2201/10409 ,  H05K2201/10189

Abstract: An apparatus, system and method capable of providing a high precision connection between a plurality of pins of a C form factor pluggable (CFP) and a connection pad of a printed circuit board (PCB). The apparatus, system and method include: a connector mask suitable to receive therein a body of the CFP; a ruler suitable to receive therein the connector mask, and sized and shaped for direct physical associated with the PCB about the connection pad; and an adjustment mechanism at least partially passing through the ruler for contacting at least the connector mask and capable of adjusting the position of the pins in relation to the connection pad.

公开(公告)号：US20230163494A1

公开(公告)日：2023-05-25

申请号：US17989909

申请日：2022-11-18

Applicant: KOLLMORGEN CORPORATION

Inventor： Jeffery Todd BREWSTER ,  William Edward ANDERSON, IV ,  Tyler William WOOD ,  Elizabeth Cantando

IPC: H01R12/53 ,  H05K1/11

CPC classification number: H01R12/53 ,  H05K1/11 ,  H05K2201/10189

Abstract: A strain relief plug to restrict movement of wires on a printed circuit board, the strain relief plug having an elongated stem along a vertical axis of the strain relief plug. The strain relief plug has an in-board flange defined by the elongated stem, the in-board flange configured to seat in a bore defined by the printed circuit board. The strain relief plug has an anchor defined by a first end of the elongated stem configured to prevent the strain relief plug from releasing from the printed circuit board. The strain relief plug has a bar defined by a second end of the elongated stem and transverse the vertical axis, the bar forming wire channels. The strain relief plug provides strain relief for wires on the printed circuit board of an electric motor in a vertical dimension resembling the thickness of the printed circuit board.

公开(公告)号：US11647587B2

公开(公告)日：2023-05-09

申请号：US17714493

申请日：2022-04-06

Applicant: Delta Electronics, Inc.

Inventor： Da Jin ,  Kun Jiang ,  Junguo Cui ,  Yahong Xiong

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/16 ,  H01F27/26 ,  H01F27/28 ,  H01F27/29 ,  H01F27/34 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/145 ,  H01F27/266 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/34 ,  H05K1/111 ,  H05K1/144 ,  H05K1/165 ,  H05K1/181 ,  H05K3/3494 ,  H05K2201/086 ,  H05K2201/10015 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/10734

Abstract: The present disclosure is related to a power module power structure and an assembling method thereof. The power module structure includes a first printed-circuit-board (PCB) assembly, a second PCB assembly, and a conductive connection component. The first PCB assembly includes a first circuit board, a power switch and a magnetic component. The first circuit board includes a first side, a second side and a through hole. The power switch is disposed on the first circuit board. The magnetic component includes a first magnetic core and a second magnetic core fastened on the first circuit board through the through hole. The second PCB assembly includes a second circuit board having a third side, a fourth side and at least one opening. The second magnetic core is exposed through the opening. The conductive connection component is disposed and electrically connected between the first PCB assembly and the second PCB assembly.

公开(公告)号：US20190246505A1

公开(公告)日：2019-08-08

申请号：US16112759

申请日：2018-08-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyuk-jin LEE ,  Kyu-deuk KIM ,  Jae-young HONG

IPC: H05K3/34 ,  H05K1/18

CPC classification number: H05K3/3405 ,  H01R12/7041 ,  H01R12/707 ,  H01R12/725 ,  H05K1/181 ,  H05K3/0052 ,  H05K3/3415 ,  H05K3/3452 ,  H05K2201/10015 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10992 ,  H05K2203/1484 ,  H05K2203/163

Abstract: A semiconductor package module is provided. The semiconductor package module may prevent dropout of a large-scale device from a module substrate by improving bonding strength between the module substrate and a part, and perform assembling parts on a top surface and a bottom surface of the module substrate, simultaneously. The semiconductor package module includes: a module substrate; at least one first electric/electronic device mounted on the module substrate by using surface mount technology (SMT); a plurality of passive devices mounted on the module substrate; and at least one second electric/electronic device mounted on the module substrate by using SMT and a resin film adhesive, the at least one second electric/electronic device having a size or a weight greater than a size or a weight of the at least one first electric/electronic device.

公开(公告)号：US20190245308A1

公开(公告)日：2019-08-08

申请号：US16241422

申请日：2019-01-07

Applicant: CommScope Technologies LLC

Inventor： Bernard Harold Hammond, JR. ,  David Patrick Murray ,  Ian Robert George

IPC: H01R13/6466 ,  H01R24/64 ,  H01R4/2416 ,  H01R13/66 ,  H01R13/719 ,  H05K1/02

CPC classification number: H01R13/6466 ,  H01R4/2416 ,  H01R13/6658 ,  H01R13/719 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0228 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10S439/941 ,  Y10T29/49117 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

公开(公告)号：US20190215960A1

公开(公告)日：2019-07-11

申请号：US16330043

申请日：2016-10-01

Applicant: Intel Corporation

Inventor： Brian J. LONG

IPC: H05K1/14 ,  H01R12/71 ,  H01R12/73 ,  H01R13/66 ,  H01R12/72

CPC classification number: H05K1/141 ,  H01R12/716 ,  H01R12/721 ,  H01R12/73 ,  H01R13/6658 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: Electronic device package technology is disclosed. In one example, a connector for coupling an electronics sub-assembly to an electronics assembly includes a connector body. The connector body has a sub-assembly interface and a circuit board interface. The connector body has at least one passive electronic component that is necessary for operating the sub-assembly, thereby maximizing available space for computational components on the sub-assembly. The connector body can comprise two separate bodies wherein the passives are contained between the bodies. At least one extension cable can electrically couple the connector to the sub-assembly. A method of making an electronics assembly, capable of receiving a sub-assembly via a connector, comprises providing an assembly circuit board having an electrically coupled connector with at least one passive electronic component.