公开(公告)号：US09532475B2

公开(公告)日：2016-12-27

申请号：US15016915

申请日：2016-02-05

Applicant: FUJITSU LIMITED

Inventor： Satoshi Masuda

IPC: H01L23/66 ,  H05K7/02 ,  H01L25/16 ,  H01L23/045 ,  H01L23/047 ,  H01L23/498 ,  H05K3/46 ,  H05K7/20 ,  H01L23/00 ,  H01L23/367 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K7/026 ,  H01L23/045 ,  H01L23/047 ,  H01L23/3677 ,  H01L23/49833 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/06181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/19107 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/0215 ,  H05K3/4697 ,  H05K7/20509 ,  H05K9/0039 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10242 ,  H05K2201/10371 ,  H05K2201/1056 ,  H01L2224/45099

Abstract: A high-frequency module includes a lower base member having a recess part formed in an upper face thereof, and having a base metal part formed on a lower face thereof that is to be grounded, an upper substrate disposed inside the recess part of the lower base member. The high frequency module also includes a semiconductor device and a first ground metal part connected to the base metal part and disposed in the lower base member. The upper substrate has a first through hole formed therethrough at a position where the first ground metal part is situated, and the semiconductor device is placed on the first ground metal part in the first through hole.

Abstract translation: 高频模块包括下基部件，其具有形成在其上表面中的凹部，并且具有形成在其下表面上的待接地的基底金属部分，设置在下部的凹部内的上基板 基地会员 高频模块还包括半导体器件和连接到母体金属部分并设置在下部基底部件中的第一接地金属部件。 上基板具有在第一接地金属部件所在的位置处穿过其形成的第一通孔，并且半导体器件被放置在第一通孔中的第一接地金属部件上。

公开(公告)号：US20160358064A1

公开(公告)日：2016-12-08

申请号：US15245291

申请日：2016-08-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru KATO ,  Satoshi ISHINO ,  Takeshi KATAYA ,  Ikuhei KIMURA ,  Nobuo IKEMOTO ,  Yuya DOKAI

IPC: G06K19/077 ,  G06K19/07

CPC classification number: G06K19/07749 ,  G06K19/06187 ,  G06K19/0723 ,  G06K19/07756 ,  G06K19/07773 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  G06K19/07786 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q13/10 ,  H05K1/0216 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/16 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10371 ,  H05K2201/10522 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.

公开(公告)号：US20160338232A1

公开(公告)日：2016-11-17

申请号：US15219555

申请日：2016-07-26

Applicant: Baomin Liu ,  Todd W. Steigerwald

Inventor： Baomin Liu ,  Todd W. Steigerwald

IPC: H05K9/00 ,  H01L23/552 ,  H01L21/48 ,  G06F1/16 ,  G06F1/20 ,  H01L23/367 ,  H05K1/02

CPC classification number: H05K9/0024 ,  G06F1/1656 ,  G06F1/203 ,  H01L21/4882 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0243 ,  H05K9/0026 ,  H05K2201/10371 ,  Y10T29/4902 ,  H01L2924/00

Abstract: Various EMI shields with thermal management capabilities are disclosed. In one aspect, an EMI shield is provided that includes a thermal spreader plate adapted to be seated on and convey heat from an electromagnetic emissions generating component. The thermal spreader plate has a first material composition and a shield effectiveness that is absorption dominant to electromagnetic waves at a given electromagnetic emissions frequency. The EMI shield also includes a shell to cover and reflect electromagnetic emissions from the electromagnetic emissions generating component. The shell has a second material composition different than the first material composition and a shield effectiveness that is reflection dominant to electromagnetic waves at the given electromagnetic emissions frequency.

公开(公告)号：US20160323990A1

公开(公告)日：2016-11-03

申请号：US15070659

申请日：2016-03-15

Applicant: FUJITSU LIMITED

Inventor： Takahiro KITAGAWA

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/09

CPC classification number: H05K1/111 ,  H05K1/0216 ,  H05K2201/09272 ,  H05K2201/099 ,  H05K2201/10371 ,  Y02P70/611

Abstract: A printed substrate includes: a substrate; a copper layer formed on the substrate; and a resin formed on the substrate to cover a part of the copper layer, wherein the copper layer includes a first region covered by the resin and a second region in which a shield sheet metal is installed, the shield sheet metal surrounding a predetermined region of the substrate, and wherein an angle formed between an outer edge portion of the copper layer covered by the resin and an outer edge portion of the resin which covers the copper layer at a location at which the outer edge portion of the copper layer and the outer edge portion of the resin intersect each other as viewed in plan is an obtuse angle.

Abstract translation: 印刷基板包括：基板; 形成在所述基板上的铜层; 以及形成在所述基板上以覆盖所述铜层的一部分的树脂，其中所述铜层包括被所述树脂覆盖的第一区域和其中安装有屏蔽金属片的第二区域，所述屏蔽金属片围绕预定区域 并且其中在由所述树脂覆盖的铜层的外边缘部分和覆盖铜层的树脂的外边缘部分之间形成的角度处于铜层的外边缘部分和外层 如图所示，树脂的边缘部分彼此相交是钝角。

公开(公告)号：US20160313771A1

公开(公告)日：2016-10-27

申请号：US14691740

申请日：2015-04-21

Applicant: Seagate Technology LLC

Inventor： Dana Lynn Simonson ,  John Wayne Shaw, II

IPC: G06F1/18 ,  H01M4/66 ,  H01G9/15 ,  H05K1/18 ,  H01G9/00 ,  H01M4/04 ,  H05K3/32 ,  H01M10/42 ,  H01G9/08

CPC classification number: H01M4/04 ,  H01G2/10 ,  H01G2/106 ,  H01G4/224 ,  H01G9/0029 ,  H01G9/08 ,  H01G9/15 ,  H01G11/78 ,  H01G11/82 ,  H01M2/1022 ,  H01M4/663 ,  H01M10/425 ,  H01M10/4257 ,  H05K1/162 ,  H05K2201/026 ,  H05K2201/0999 ,  H05K2201/10371 ,  H05K2201/10969 ,  Y02E60/13

Abstract: Technologies are described herein for implementing a space-efficient internal energy storage apparatus in a data storage device or other electronic device have a metallic or otherwise electrically-conductive housing or case structure. The energy storage apparatus comprises an interior surface of the metallic housing, a conductive layer disposed parallel to the interior surface of the metallic housing, and a separator disposed between the interior surface and the conductive layer. The metallic housing is configured to act as a first electrode of the energy storage apparatus and the conductive layer is configured to act as an opposing electrode to the first electrode.

Abstract translation: 这里描述了用于在数据存储设备或其他电子设备中实现空间高效的内部能量存储设备的技术，其具有金属或其它导电的壳体或壳体结构。 储能装置包括金属外壳的内表面，平行于金属外壳的内表面设置的导电层以及设置在内表面与导电层之间的隔离件。 金属壳体被配置为用作能量存储装置的第一电极，并且导电层被配置为充当与第一电极相对的电极。

公开(公告)号：US20160287865A1

公开(公告)日：2016-10-06

申请号：US14997758

申请日：2016-01-18

Applicant: CARDIAC PACEMAKERS, INC.

Inventor： Jean M. Bobgan ,  James E. Blood ,  Moira B. Sweeney ,  Ron A. Balczewski ,  William J. Linder

IPC: A61N1/08 ,  A61N1/39

CPC classification number: A61N1/375 ,  A61N1/3718 ,  A61N1/3931 ,  A61N1/3956 ,  A61N1/3968 ,  H05K2201/10371

Abstract: Implantable medical devices comprising electromagnetic interference shields which incorporate a dump resistor and various enhancements to control high voltage arcing. Included are embodiments in which a dump resistor is provided in a flexible shield having first and second conductive layers, where the resistor is provided in a layer between the conductive layers. In additional examples the design of plated through-holes is done to avoid the potential for arcing while maintaining close spacing.

Abstract translation: 可植入的医疗设备包括电磁干扰屏蔽，其包括转储电阻器和各种增强以控制高电压电弧。 包括这样的实施例，其中在具有第一和第二导电层的柔性屏蔽件中设置倾卸电阻器，其中电阻器设置在导电层之间的层中。 在另外的示例中，电镀通孔的设计是为了避免在保持紧密间隔的同时留下电弧的可能性。

公开(公告)号：US20160233616A1

公开(公告)日：2016-08-11

申请号：US15099229

申请日：2016-04-14

Applicant: Molex, LLC

Inventor： Kent E. Regnier

IPC: H01R13/6466 ,  H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  H01R13/66 ,  H05K1/02

CPC classification number: H05K1/0227 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/6625 ,  H01R13/6633 ,  H01R2107/00 ,  H03H7/09 ,  H05K1/0233 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/115 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09263 ,  H05K2201/09309 ,  H05K2201/09336 ,  H05K2201/09663 ,  H05K2201/1006 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2203/0307

Abstract: A cable assembly includes multi-layer circuit member with a conductive reference plane with first and second electrically connected regions. A pair of signal conductors are in proximity to the first region and a circuit component is in proximity to the second region. An area of increased impedance exists between the first and second electrically connected regions.

Abstract translation: 电缆组件包括具有导电参考平面的多层电路构件，其具有第一和第二电连接区域。 一对信号导体靠近第一区域，电路部件接近第二区域。 在第一和第二电连接区域之间存在增加阻抗的区域。

公开(公告)号：US20160095249A1

公开(公告)日：2016-03-31

申请号：US14672770

申请日：2015-03-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyoung KIM

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/205 ,  H05K1/0209 ,  H05K1/0216 ,  H05K9/0026 ,  H05K2201/09781 ,  H05K2201/10371 ,  H05K2201/10969

Abstract: Disclosed are a printed circuit board and an electronic component package having the printed circuit board, which includes: a base board; a heat-dissipating pad formed on the based board and having an electronic component installed thereon; and a bridging pad formed on the base board between the heat-dissipating pad and a shield can installed on the base board so as to allow heat generated by the electronic component to be transferred from the heat-dissipating pad to the shield can.

Abstract translation: 公开了具有印刷电路板的印刷电路板和电子部件封装，其包括：基板; 散热垫，其形成在所述基板上并且安装有电子部件; 并且形成在散热垫和屏蔽罩之间的基板上的桥接焊盘可以安装在基板上，以便允许由电子部件产生的热量从散热垫传递到屏蔽罐。

公开(公告)号：US20160066481A1

公开(公告)日：2016-03-03

申请号：US14830351

申请日：2015-08-19

Applicant: Apple Inc.

Inventor： Shayan Malek ,  David A. Pakula ,  Gregory N. Stephens ,  Jason Sloey

IPC: H05K9/00 ,  H05K1/18

CPC classification number: H05K9/0032 ,  H05K1/0216 ,  H05K1/181 ,  H05K2201/10371 ,  Y02P70/611

Abstract: An electronic device may have a printed circuit to which electrical components are mounted. Electromagnetic shields may be mounted to the printed circuit over the components to suppress interference. A shield may have a metal frame covered with a conductive fabric. The conductive fabric may cover an opening in the top of the frame. An insulating layer may be formed on the lower surface of the conductive fabric to prevent shorts between components on the printed circuit and the conductive fabric. An insulating cap such as an elastomeric polymer cap may also be formed over each component to provide electrical isolation between the components and the conductive fabric. Shields may be formed by coupling shield cans to subscriber identity module shields or other metal structures in a device. Intervening wall structures may be removed to help provide additional shielding volume.

Abstract translation: 电子设备可以具有安装电气部件的印刷电路。 电磁屏蔽可以通过部件安装到印刷电路上，以抑制干扰。 屏蔽件可以具有覆盖有导电织物的金属框架。 导电织物可以覆盖框架顶部的开口。 可以在导电织物的下表面上形成绝缘层，以防止印刷电路上的部件和导电织物之间的短路。 还可以在每个部件上形成诸如弹性体聚合物盖的绝缘帽以提供部件和导电织物之间的电隔离。 可以通过将屏蔽罐耦合到设备中的订户身份模块屏蔽或其他金属结构来形成屏蔽。 可以移除中间壁结构以帮助提供额外的屏蔽体积。

公开(公告)号：US09192057B2

公开(公告)日：2015-11-17

申请号：US13726890

申请日：2012-12-26

Applicant: Apple Inc.

Inventor： Shayan Malek ,  Gregory N. Stephens ,  Michael B. Wittenberg ,  Jared M. Kole ,  Warren Z. Jones

IPC: H05K1/00 ,  H05K3/30 ,  H05K9/00

CPC classification number: H05K3/30 ,  H05K9/003 ,  H05K2201/09063 ,  H05K2201/10371 ,  H05K2201/10409 ,  Y10T29/49117 ,  Y10T29/4913

Abstract: Electrical components are mounted on a printed circuit in an electronic device housing. Shielding can structures may include a sheet metal shield can layer with a conductive gasket. The printed circuit may have an opening. A screw passes through the opening in the printed circuit and openings in the conductive gasket and sheet metal shield can layer to secure the shielding can structures to the housing. When secured, a lip in the gasket lies between the printed circuit substrate and the housing. The gasket may be formed from conductive elastomeric material. A shield can lid and a flexible printed circuit may be embedded within conductive elastomeric material that provides a thermal conduction path to dissipate heat from electrical components under the lid. Shield can members that are located on opposing sides of a bend in a flexible printed circuit substrate may be coupled by a conductive elastomeric bridging structure.

Abstract translation: 电气部件安装在电子设备壳体中的印刷电路上。 屏蔽罐结构可以包括具有导电垫片的金属板屏蔽罐层。 印刷电路可以具有开口。 螺丝穿过印刷电路中的开口和导电垫圈和金属板护罩罐层中的开口，以将屏蔽罐结构固定到壳体上。 当固定时，垫圈中的唇缘位于印刷电路基板和壳体之间。 垫圈可以由导电弹性体材料形成。 屏蔽罐盖和柔性印刷电路可以嵌入在导电弹性体材料内，其提供热传导路径以从盖下方的电气部件散发热量。 位于柔性印刷电路基板中的弯曲部的相对侧上的屏蔽罐构件可以通过导电弹性体桥接结构耦合。