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    CLIP FOR BIOS CHIP
    42.
    发明申请
    CLIP FOR BIOS CHIP 失效
    CLIP BIOS芯片

    公开(公告)号：US20120155045A1

    公开(公告)日：2012-06-21

    申请号：US12979307

    申请日：2010-12-27

    Applicant: XING-LONG TENG

    Inventor： XING-LONG TENG

    IPC: H05K7/00

    CPC classification number: H01R12/7029 ,  H05K1/181 ,  H05K2201/1053

    Abstract: A clip for a basic input/output system (BIOS) chip includes a main body, two spindles, two clipping elements, and two torsion springs. The main body includes a number of connecting pins mounted on a bottom of the main body, and a number of signal pins mounted on a top of the main body and electrically and correspondingly connected to the number of the connecting pins. The clipping elements are rotatably mounted to opposite ends of the main body through the spindles. The torsion springs are mounted between the clipping members and the main body. The connecting pins of the main body respectively electrically contacts a number of chip pins of the BIOS chip in response to the clipping elements clipping the BIOS chip.

    Abstract translation: 用于基本输入/输出系统（BIOS）芯片的夹子包括主体，两个主轴，两个夹紧元件和两个扭转弹簧。 主体包括安装在主体底部的多个连接销，以及安装在主体顶部上的多个信号销，并且电连接并相应地连接到连接销的数量。 剪切元件通过主轴可旋转地安装到主体的相对端。 扭簧安装在夹持件和主体之间。 响应于限制BIOS芯片的限幅元件，主体的连接引脚分别电连接到BIOS芯片的多个芯片引脚。

    Electrical connection interfaces and methods for adjacently positioned circuit components
    44.
    发明授权
    Electrical connection interfaces and methods for adjacently positioned circuit components 有权
    电气连接接口和相邻定位电路元件的方法

    公开(公告)号：US07957153B2

    公开(公告)日：2011-06-07

    申请号：US12006618

    申请日：2008-01-03

    Applicant: Michael Rosenblatt ,  Amir Salehi

    Inventor： Michael Rosenblatt ,  Amir Salehi

    IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

    CPC classification number: H05K1/181 ,  H01L25/105 ,  H01L2224/13 ,  H01L2224/1302 ,  H01L2224/16137 ,  H01L2225/1005 ,  H01L2225/1058 ,  H05K2201/1053 ,  H05K2201/10727 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/00012

    Abstract: Electrical components, such as packaged integrated circuit devices that are mountable on a substrate surface, are provided with at least one exposed electrical contact on a side surface of the component that will be substantially perpendicular to the substrate surface when the component is mounted. Two such components can be mounted side-by-side on the substrate surface with the above-mentioned contacts close to one another between the above-mentioned side surfaces. An electrical connection between the contacts can be made (or perfected) by depositing an electrically conductive connector material in contact with both of the contacts between the above-mentioned side surfaces.

    Abstract translation: 诸如可安装在基板表面上的封装的集成电路器件的电气部件在组件的侧表面上设置有至少一个暴露的电接触件，当组件被安装时，其将基本上垂直于衬底表面。 两个这样的部件可以并排安装在基板表面上，上述触头在上述侧表面之间彼此靠近。 可以通过沉积与上述侧表面之间的两个触点接触的导电连接器材料来（或完善）触点之间的电连接。

    Connector and substrate mounting method for the same
    45.
    发明授权
    Connector and substrate mounting method for the same 失效
    连接器和基板安装方法相同

    公开(公告)号：US07905752B2

    公开(公告)日：2011-03-15

    申请号：US12181550

    申请日：2008-07-29

    Applicant: Taishi Morikawa

    Inventor： Taishi Morikawa

    IPC: H01R13/66

    CPC classification number: H05K1/0231 ,  H01R12/57 ,  H01R12/712 ,  H01R13/658 ,  H01R13/6608 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: A connector includes a connector housing made of an insulator, a first terminal having one end fixed to the connector housing and the other end connected to an opposite side connector, and a second terminal having one end electrically connected to a circuit on a substrate and the other end fixed to the connector housing. The connector housing includes an opening which is open in a direction orthogonal to a surface of the substrate in a state of being mounted on the substrate and through which one end of the first terminal and the other end of the second terminal enter. The opening permits an electronic component being connected to one end of the first terminal and the other end of the second terminal to enter thereinto.

    Abstract translation: 连接器包括由绝缘体制成的连接器壳体，第一端子的一端固定到连接器壳体，另一端连接到相对侧连接器，第二端子的一端电连接到基板上的电路， 另一端固定在连接器外壳上。 连接器壳体包括在安装在基板上并且第一端子的一端和第二端子的另一端进入的状态下在与基板的表面正交的方向上开口的开口。 开口允许电子部件连接到第一端子的一端并且第二端子的另一端进入其中。

    SEMICONDUCTOR MODULE AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR DEVICE USING SAME
    46.
    发明申请
    SEMICONDUCTOR MODULE AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR DEVICE USING SAME 有权
    使用相同的半导体模块和电子电路集成电动机

    公开(公告)号：US20100327709A1

    公开(公告)日：2010-12-30

    申请号：US12822403

    申请日：2010-06-24

    Applicant: Hideki MINATO ,  Hideki Kabune ,  Atsushi Furumoto ,  Ayako Iwai

    Inventor： Hideki MINATO ,  Hideki Kabune ,  Atsushi Furumoto ,  Ayako Iwai

    IPC: H02K5/22 ,  H02K11/00 ,  H05K1/02

    CPC classification number: H05K1/18 ,  H01L2224/73221 ,  H01L2924/0002 ,  H02K11/33 ,  H02K2211/03 ,  H02M7/003 ,  H05K2201/1003 ,  H05K2201/1053 ,  H05K2201/10659 ,  H01L2924/00

    Abstract: A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.

    Abstract translation: V1半导体模块具有可直接连接到线圈的引线的线圈端子。 结果，减少了连接电子部件所需的部件数量。 此外，由于不需要印刷电路板，所以线圈端子可以成形为任何尺寸，而不受对应于基板的铜膜厚度的限制。 连接到具有用于控制向线圈供电的控制电路的印刷电路板的线圈端子和控制端子设置在树脂部件的不同壁面上。 因此，线圈和印刷电路板可以分别容易地连接到线圈端子和控制端子，从而简化了装置。

    METHOD OF MANUFACTURING ELECTRONIC COMPONENT
    47.
    发明申请
    METHOD OF MANUFACTURING ELECTRONIC COMPONENT 有权
    制造电子元件的方法

    公开(公告)号：US20100315795A1

    公开(公告)日：2010-12-16

    申请号：US12788507

    申请日：2010-05-27

    Applicant: Yasuo YOKOYAMA

    Inventor： Yasuo YOKOYAMA

    IPC: H05K7/00 ,  H05K3/30

    CPC classification number: H05K3/3442 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K1/111 ,  H05K3/3484 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/048 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    Abstract: A method of manufacturing an electronic component including a first surface mount device and a second surface mount device is provided. The first surface mount device and the second surface mount device are joined to a substrate via joint materials such that either or both of the first and second surface mount devices are shifted from the locations corresponding to land electrodes located on the substrate so as to be aligned with each other and are subjected to a reflow process. The outer land electrodes are formed at locations shifted inwardly from the locations corresponding to a virtual arrangement state in which the first surface mount device and the second surface mount device are arranged in series such that an end surface of the first surface mount device is in contact with an end surface of the second surface mount device.

    Abstract translation: 提供一种制造包括第一表面安装装置和第二表面贴装装置的电子部件的方法。 第一表面安装器件和第二表面安装器件通过接合材料接合到衬底，使得第一和第二表面安装器件中的任一个或两者从对应于位于衬底上的焊盘电极的位置偏移以对准 并进行回流处理。 外部接地电极形成在从与第一表面安装器件和第二表面安装器件串联布置的虚拟布置状态对应的位置向内移位的位置处，使得第一表面安装器件的端面接触 具有第二表面安装装置的端面。

    Simultaneous bidirectional cable interface
    48.
    发明授权
    Simultaneous bidirectional cable interface 有权
    同时双向电缆接口

    公开(公告)号：US07803017B2

    公开(公告)日：2010-09-28

    申请号：US11653929

    申请日：2007-01-17

    Applicant: Martti Kalevi Voutilainen

    Inventor： Martti Kalevi Voutilainen

    IPC: H01R33/945

    CPC classification number: H05K1/0243 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/10253 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2201/1053 ,  H05K2201/10674 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A cable connection with at least one cable as a wire conducted signal interconnection between two cables module circuits connected to respective ends of the cable connection. Conductors of the cable may be directly and permanent electrical connected at each end to the respective contacts at the respective cable module circuit. The cable module circuits may be arranged for sending and/or receiving of a wire-conducted signal transmitted via the cable connection. During fabrication of the integrated cable module the cable module circuits can be matched to the respective cable impedance with high accuracy. Further, by connecting the cable permanent and directly to transceiver circuits at each end of the cable, the connection may be protected from different kinds of disturbances, enabling high simultaneous bidirectional bit rates using such interconnections between electronic units or modules.

    Abstract translation: 与至少一根电缆的电缆连接，作为连接到电缆连接的相应末端的两个电缆模块电路之间的导线传导信号互连。 电缆的导体可以在各个端部直接和永久地电连接到相应电缆模块电路处的各个触头。 电缆模块电路可以布置成用于发送和/或接收经由电缆连接传输的有线传导信号。 在集成电缆模块的制造期间，电缆模块电路可以以高精度与相应的电缆阻抗匹配。 此外，通过将电缆永久地直接连接到电缆每端的收发器电路，可以保护连接免受不同种类的干扰，从而能够使用电子单元或模块之间的这种互连实现高同时双向比特率。

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