公开(公告)号：US20070023877A1

公开(公告)日：2007-02-01

申请号：US10570980

申请日：2004-08-03

Applicant: Hideo Yamazaki

Inventor： Hideo Yamazaki

IPC: H01L23/495

CPC classification number: H01L23/4985 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/118 ,  H05K2201/09781 ,  H05K2201/10681 ,  H01L2924/00

Abstract: To provide a chip on flex (COF) tape having an improved precision of cumulative pitches while retaining bending properties. [Means to Solve the Problems] A chip on flex (COF) tape having a wiring pattern comprising a plurality of wirings arranged in parallel formed on the surface of a flexible insulating film, wherein a dimension retention pattern is formed on said surface of said flexible insulating film and/or the surface of the side of the film opposite thereto so as to cross the width direction of at least two of said wirings arranged in parallel in the vicinity of the connecting portion of said wiring pattern with a semiconductor chip and/or the connecting portion with an external device.

Abstract translation: 提供具有提高的累积间距精度同时保持弯曲性能的柔性（COF）胶带上的芯片。 解决问题的手段具有在柔性绝缘膜的表面上形成有平行布置的多个布线的布线图案的柔性（COF）带芯片，其中在所述柔性绝缘膜的所述表面上形成尺寸保持图案 绝缘膜和/或与其相对的膜的表面，以与半导体芯片和/或所述布线图案的连接部分附近平行布置的至少两条所述布线的宽度方向交叉 连接部分与外部设备。

公开(公告)号：US20060262481A1

公开(公告)日：2006-11-23

申请号：US11436697

申请日：2006-05-18

Applicant: Yasuaki Mashiko

Inventor： Yasuaki Mashiko

IPC: H01G4/228 ,  H01G4/10 ,  H01G4/06

CPC classification number: H05K1/162 ,  H01G4/228 ,  H01G4/33 ,  H01L27/016 ,  H05K1/0393 ,  H05K3/243 ,  H05K3/3457 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09763 ,  H05K2201/10681

Abstract: The present invention provides a manufacturing method capable of mass production of a thin film decoupling capacitor provided with a capacitor circuit on the surface of a film tape carrier form of a polyimide resin or the like. For the purpose of achieving the above described object, there is provided a film carrier tape with a capacitor circuit, including a wiring pattern on the surface of a resin film including a plurality of sprocket holes on each of the two edges, wherein the resin film includes solder ball land holes and the wiring pattern includes a capacitor circuit having a structure in which a dielectric layer is disposed between an upper electrode and a lower electrode. As the method for manufacturing the aforementioned film carrier tape, there is provided such a method for semicontinuously manufacturing the film carrier tape concerned in the state of tape as applied to manufacturing conventional TAB products.

Abstract translation: 本发明提供一种能够大量生产在聚酰亚胺树脂等的薄膜带载体的表面上设置有电容器电路的薄膜去耦电容器的制造方法。 为了实现上述目的，提供了一种具有电容器电路的薄膜载带，其包括在包括两个边缘中的每一个上的多个链轮孔的树脂膜的表面上的布线图案，其中树脂膜 包括焊球接地孔，并且布线图案包括电容器电路，其电介质层设置在上电极和下电极之间。 作为制造上述薄膜载带的方法，提供了一种在制造传统的TAB产品时，以带状状半连续制造薄膜载带的方法。

公开(公告)号：US20060257625A1

公开(公告)日：2006-11-16

申请号：US10571135

申请日：2004-09-06

Applicant: Yasuhiro Wakizaka

Inventor： Yasuhiro Wakizaka

IPC: B32B15/08 ,  B32B27/00 ,  B05D3/10 ,  B05D3/02

CPC classification number: B32B15/20 ,  B32B7/02 ,  B32B15/08 ,  B32B15/085 ,  B32B15/09 ,  B32B27/08 ,  B32B27/26 ,  B32B27/281 ,  B32B27/325 ,  B32B27/36 ,  B32B2250/03 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2307/31 ,  B32B2307/536 ,  B32B2307/54 ,  B32B2307/546 ,  B32B2307/7265 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/10681 ,  Y10T428/24355 ,  Y10T428/269 ,  Y10T428/31504 ,  Y10T428/31678

Abstract: To provide a resin composite film which is assured of high insulating performance and excellent mechanical properties, to allow for bending, and gives a flexible printed circuit excellent in the adhesive property. A resin composite film comprising a resin A layer having formed on at least one surface thereof a resin B layer, wherein the thickness of the resin B layer is from 0.1 to 4 μm and the resin B layer comprises an insulating material capable of giving a film having a thickness of 10 μm and a water absorptivity of 0.03 to 0.25%. When a metal layer is formed on the resin B layer surface of this resin composite film, a metal-resin composite film is obtained.

Abstract translation: 为了提供确保具有高绝缘性能和优异的机械性能，允许弯曲的树脂复合膜，并且提供了粘合性优异的柔性印刷电路。 一种树脂复合膜，包括在其至少一个表面上形成有树脂B层的树脂A层，其中树脂B层的厚度为0.1至4μm，并且树脂B层包括能够产生膜的绝缘材料 厚度为10μm，吸水率为0.03〜0.25％。 当在该树脂复合膜的树脂B层表面上形成金属层时，获得金属 - 树脂复合膜。

公开(公告)号：US20060108699A1

公开(公告)日：2006-05-25

申请号：US11247610

申请日：2005-10-10

Applicant: Munehide Saimen

Inventor： Munehide Saimen

IPC: H01L23/52

CPC classification number: H05K1/118 ,  H01L23/49572 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K3/0058 ,  H05K2201/09236 ,  H05K2201/09727 ,  H05K2201/10681 ,  H05K2201/2009 ,  H05K2203/0228 ,  H01L2924/00

Abstract: A method for manufacturing an electronic part, including: cutting a wiring substrate, which contains a base substrate, a wiring pattern provided on a first surface of the base substrate, and a reinforcing member provided on a second surface of the base substrate, along a line intersecting with an outer circumference of the reinforcing member; wherein a wire, out of a plurality of wires composing the wiring pattern, arranged closest to an intersecting point of the outer circumference of the reinforcing member and the line has a widest width.

Abstract translation: 一种电子部件的制造方法，其特征在于，包括：切断包含基底基板的布线基板，设置在所述基板的第一面上的布线图案，以及沿着所述基板的第二面设置的加强部件 与所述加强构件的外周相交的线; 其特征在于，构成所述布线图案的多根配线最靠近所述加强部件的外周的交叉点布线的线最宽。

公开(公告)号：US06983539B2

公开(公告)日：2006-01-10

申请号：US10161472

申请日：2002-06-03

Applicant: Mohammad Akhavain ,  Ghassem Azdasht

Inventor： Mohammad Akhavain ,  Ghassem Azdasht

IPC: B21D53/76 ,  B23K26/00

CPC classification number: H01L24/80 ,  B23K26/22 ,  B23K2101/42 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/56 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1643 ,  B41J2/1646 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01R43/02 ,  H01R43/0221 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/10681 ,  H05K2203/107 ,  Y10T29/49083 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49401 ,  H01L2924/00

Abstract: In one form of the invention, a laser beam propagates directly through bulk material of a TAB tape or base, to heat and form a bond between electrical leads formed on the base and aligned contact bumps. In another form, a chromium seed-metal layer is formed on a TAB tape or base, and leads are in turn formed on the chromium; the chromium absorbs a laser beam to heat the leads. In both forms, an optical fiber preferably presses copper leads and gold bumps together with over 300 g force, without aid by a gas stream—and then also conducts the beam to the bond site, forming a bond of shear strength over 200 g. Also preferably gold contacts are plated on the leads; and the method makes an inkjet printhead—with the bumps formed on a die or other printhead component, and nozzles formed through the base.

Abstract translation: 在本发明的一种形式中，激光束直接通过TAB带或基底的材料传播，以加热并形成在基底上形成的电引线和对准的接触凸块之间的结合。 在另一种形式中，在TAB带或基底上形成铬种子金属层，并在铬上形成引线; 铬吸收激光束以加热引线。 在两种形式中，光纤优选地将铜引线和金凸起与超过300g的力一起压制，而不用气流的帮助，然后还将梁传导到结合位置，形成剪切强度超过200g的粘结。 金触点也优选镀在引线上; 并且该方法制造喷墨打印头，其中凸起形成在模具或其它打印头部件上，以及通过基部形成的喷嘴。

公开(公告)号：US20050253141A1

公开(公告)日：2005-11-17

申请号：US11186906

申请日：2005-07-22

Applicant: Masuyuki Ohta ,  Masahiro Ishi ,  Kikuo Ono ,  Nobuyuki Suzuki

Inventor： Masuyuki Ohta ,  Masahiro Ishi ,  Kikuo Ono ,  Nobuyuki Suzuki

IPC: G02F1/1333 ,  G02F1/1343 ,  G02F1/1362 ,  G02F1/1368 ,  H01L29/04 ,  H01L29/10

CPC classification number: G02F1/134363 ,  G02F1/133345 ,  G02F1/1368 ,  G02F2001/136218 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/10136 ,  H05K2201/10681

Abstract: A display device includes a first conductive layer formed on a substrate, an insulating layer formed on a portion of the first conductive layer and having a flat plane and an edge, and a second conductive layer continuously formed on the flat plane of the insulating layer, on the edge of the insulating layer, and on another portion of the first conductive layer. The edge of the insulating layer has a region so that an angle formed between the edge of the insulating layer and the first conductive layer is changed to be small at a side near to the first conductive layer.

Abstract translation: 显示装置包括形成在基板上的第一导电层，形成在第一导电层的一部分上并具有平面和边缘的绝缘层，以及连续地形成在绝缘层的平面上的第二导电层， 在绝缘层的边缘上和第一导电层的另一部分上。 绝缘层的边缘具有使绝缘层的边缘与第一导电层之间形成的角度在靠近第一导电层的一侧变小的区域。

公开(公告)号：US06930384B2

公开(公告)日：2005-08-16

申请号：US10831340

申请日：2004-04-26

Applicant: Sin-Gu Kang

Inventor： Sin-Gu Kang

IPC: H01L21/60 ,  G02F1/1345 ,  H01L23/28 ,  H01L23/498 ,  H05K1/00 ,  H05K3/28 ,  H05K3/36 ,  H01L23/12

CPC classification number: H05K1/028 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/0989 ,  H05K2201/10681 ,  H01L2924/00

Abstract: Disclosed is a tape carrier package for electrically connecting LCD panel with source and gate driver PCBs and an LCD module to which the tape carrier package is applied. The tape carrier package includes: a first flexible film made of insulator; a conductive pattern formed on the first flexible film and having a plurality of input/output leads each having an input terminal and an output terminal; a semiconductor chip having a plurality of input/output terminals electrically connected with the input/output leads of the conductive pattern; and a second film made of insulator, the second film coating the conductive input/output leads such that the input/output leads are exposed by a selected length from respective ends thereof, wherein at least one selected lead of the input/output leads disposed at at least one sided end of the tape carrier package comprises a first portion and a second portion which is wider than the first portion, the second portion extending from a first selected position of the exposed leads to a second selected position of the second film passing over a boundary between the second film and the exposed leads.

Abstract translation: 公开了用于将LCD面板与源极和栅极驱动器PCB电连接的带载体封装以及应用带载体封装的LCD模块。 带状载体包括：由绝缘体制成的第一柔性膜; 形成在所述第一柔性膜上并具有多个具有输入端子和输出端子的输入/输出引线的导电图案; 具有与导电图案的输入/输出引线电连接的多个输入/输出端子的半导体芯片; 以及由绝缘体制成的第二膜，所述第二膜涂覆所述导电输入/输出引线，使得所述输入/输出引线从其相应端部暴露出选定长度，其中所述输入/输出引线中的至少一个选定引线设置在 所述带状载体封装的至少一侧端部包括第一部分和比所述第一部分宽的第二部分，所述第二部分从所述暴露引线的第一选定位置延伸到所述第二膜的第二选定位置， 第二膜和暴露引线之间的边界。

公开(公告)号：US06924865B2

公开(公告)日：2005-08-02

申请号：US10838241

申请日：2004-05-05

Applicant: Masuyuki Ohta ,  Masahiro Ishi ,  Kikuo Ono ,  Nobuyuki Suzuki

Inventor： Masuyuki Ohta ,  Masahiro Ishi ,  Kikuo Ono ,  Nobuyuki Suzuki

IPC: G02F1/1333 ,  G02F1/1343 ,  G02F1/1362 ,  G02F1/1368 ,  H01L29/04 ,  H01L29/10 ,  G02F1/136

CPC classification number: G02F1/134363 ,  G02F1/133345 ,  G02F1/1368 ,  G02F2001/136218 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/10136 ,  H05K2201/10681

Abstract: An active matrix type liquid crystal display device having a first and a second substrate with a liquid crystal layer therebetween, a plurality of drain lines and gate lines formed on the first substrate and crossing each other in a matrix form, and a plurality of counter signal lines formed on the first substrate and extending along an extension direction of the gate lines. Pixels are delimited by adjacent ones of the drain lines and the gate lines. A counter signal line connects counter electrodes of neighboring pixels which are arranged with a drain line therebetween by crossing the drain line, and the counter electrodes of neighboring pixels which are arranged with a gate line therebetween are electrically connected by a connecting member. The connecting member is arranged so as to be spaced with respect to the drain line in plane view.

Abstract translation: 一种有源矩阵型液晶显示装置，其具有在其间具有液晶层的第一和第二基板，形成在第一基板上并以矩阵形式彼此交叉的多个漏极线和栅极线，以及多个计数器信号 形成在第一基板上并沿着栅极线的延伸方向延伸的线。 像素由相邻的漏极线和栅极线限定。 计数信号线通过与漏极线相交而连接排列在其间的相邻像素的对置电极，并且通过连接构件电连接在其间具有栅极线的相邻像素的对置电极。 连接构件布置成在平面视图中相对于排水管线间隔开。

公开(公告)号：US06899544B2

公开(公告)日：2005-05-31

申请号：US10853493

申请日：2004-05-26

Applicant: Masaru Tanokura ,  Yukio Yanagita

Inventor： Masaru Tanokura ,  Yukio Yanagita

IPC: H01L21/60 ,  H01R4/02 ,  H01R43/02 ,  H05K1/00 ,  H05K1/02 ,  H01R9/09

CPC classification number: H01L24/06 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/06153 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01R4/027 ,  H01R43/0249 ,  H05K1/0268 ,  H05K1/0393 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/10681 ,  H05K2203/1545 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A semiconductor device has a plurality of first pads to a plurality of fourth pads laid out in a first direction, thereby forming first to fourth pad rows. The first to fourth pad rows are laid out in the named order in a second direction orthogonal to the first direction. First to fourth leads are respectively connected between the first to fourth pad rows and a semiconductor chip. A first slanted side inclined to the first direction is formed at each second pad at that corner which lies on that side of the third pad row. A second slanted side inclined to the second direction in such a way as to face the first slanted side is formed at each third pad. Each first lead has a first slanted portion provided between the first slanted side and the second slanted side and extending in a direction oblique to the first direction.

Abstract translation: 半导体器件具有多个第一焊盘，至多布置在第一方向上的第四焊盘，从而形成第一至第四焊盘行。 在与第一方向正交的第二方向上，以所述顺序布置第一至第四焊盘行。 第一至第四引线分别连接在第一至第四焊盘行和半导体芯片之间。 在位于第三垫排的该侧的拐角处的每个第二垫处形成有朝向第一方向倾斜的第一倾斜面。 在每个第三垫处形成有朝向第一倾斜侧的方式倾斜到第二方向的第二倾斜面。 每个第一引线具有设置在第一倾斜侧和第二倾斜侧之间并沿与第一方向倾斜的方向延伸的第一倾斜部。

公开(公告)号：US20050093114A1

公开(公告)日：2005-05-05

申请号：US10900211

申请日：2004-07-28

Applicant: Dae-Woo Son ,  Sa-Yoon Kang ,  Kwan-Jai Lee

Inventor： Dae-Woo Son ,  Sa-Yoon Kang ,  Kwan-Jai Lee

IPC: H01L21/60 ,  H01L23/02 ,  H01L23/498 ,  H01L23/50 ,  H01L23/552 ,  H05K1/00 ,  H05K1/02

CPC classification number: H01L23/552 ,  H01L23/4985 ,  H01L23/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0393 ,  H05K2201/09772 ,  H05K2201/10681 ,  Y10T29/49121 ,  H01L2224/05599

Abstract: A tape circuit substrate and semiconductor apparatus employing the same, and a method for forming a tape circuit substrate may reduce or eliminate electromagnetic interference (EMI) and provide a substrate or apparatus which can supply a more stable power supply voltage. The tape circuit substrate may include an insulation film and a wiring pattern formed on the insulation film to define an electronic device-mounting region and including a ground electrode. The tape circuit substrate may include a ground electrode pattern formed at the electronic device-mounting region so as to be insulated from the wiring pattern, except where the ground electrode pattern is connected to the ground electrode.

Abstract translation: 带状电路基板和使用该电路基板的半导体装置以及形成带状电路基板的方法可以减少或消除电磁干扰（EMI），并提供能够提供更稳定的电源电压的基板或装置。 带状电路基板可以包括形成在绝缘膜上的绝缘膜和布线图案，以限定电子器件安装区域并且包括接地电极。 磁带电路基板可以包括形成在电子器件安装区域处的接地电极图案，以便除了接地电极图案连接到接地电极之外与布线图案绝缘。