公开(公告)号：US20160143187A1

公开(公告)日：2016-05-19

申请号：US14881423

申请日：2015-10-13

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Yusuke SEKINO

IPC: H05K7/20 ,  H05K3/32 ,  H05K7/02

CPC classification number: H05K3/32 ,  H01L23/4006 ,  H01L23/4093 ,  H01L2023/4043 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/1059 ,  H05K2201/10871

Abstract: A semiconductor device includes a semiconductor module which has an external terminal protruding from one surface thereof; a printed circuit board which is electrically and mechanically connected to the external terminal of the semiconductor module; a heatsink which abuts against the other surface of the semiconductor module opposite to the one surface; and a joint member which serves as an elastic support column having a first head portion and a second head portion. The first head portion is shaped like a truncated cone and disposed at one end of the elastic support column, and the second head portion is disposed at the other end of the elastic support column. The semiconductor module, the printed circuit board and the heat sink are integrated by the first head portions and the second head portions.

Abstract translation: 半导体器件包括：半导体模块，其具有从其一个表面突出的外部端子; 印刷电路板，其电连接和机械连接到所述半导体模块的外部端子; 与所述半导体模块的与所述一个表面相对的另一个表面邻接的散热器; 以及用作具有第一头部和第二头部的弹性支撑柱的接合构件。 第一头部形状为截头圆锥形并设置在弹性支撑柱的一端，第二头部设置在弹性支撑柱的另一端。 半导体模块，印刷电路板和散热器由第一头部和第二头部一体化。

公开(公告)号：US09119327B2

公开(公告)日：2015-08-25

申请号：US13659066

申请日：2012-10-24

Applicant: TDK-Lambda Corporation

Inventor： L. Ray Albrecht, III ,  Gordon K. Y. Lee ,  Jin He

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/14 ,  H01L23/473

CPC classification number: H05K7/20463 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/144 ,  H05K7/20454 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/1056 ,  H05K2201/10871 ,  Y10T29/49144

Abstract: A thermal management system/method allowing efficient electrical/thermal attachment of heat sourcing PCBs to heat sinking PCBs using reflow/wave/hand soldering is disclosed. The disclosed system/method may incorporate a combination of support pins, spacer pads, and/or contact paste that mechanically attaches a heat sourcing PCB (and its associated components) to a heat sinking PCB such that thermal conductivity between the two PCBs can be optimized while simultaneously allowing controlled electrical conductivity between the two PCBs. Controlled electrical isolation between the two PCBs is provided for using spacer pads that may also be thermal conductive. Contact paste incorporated in some embodiments permits enhanced conductivity paths between the heat sourcing PCB, a thermally conductive plate mounted over the heat sourcing PCB, and the heat sinking PCB. The use of self-centering support pins incorporating out-gassing vents in some embodiments allows reflow/wave/hand soldering as desired.

Abstract translation: 公开了一种热管理系统/方法，其允许使用回流/波/手焊接将散热PCB的热源PCB与电源/热附件进行高效电连接。 所公开的系统/方法可以包括将热源PCB（及其相关部件）机械连接到散热PCB上的支撑销，间隔垫和/或接触膏的组合，使得可以优化两个PCB之间的导热性 同时允许两个PCB之间的受控电导率。 两个PCB之间的受控电气隔离被提供用于使用也可以是导热的间隔垫。 在一些实施例中结合的接触膏允许加热PCB，安装在热源PCB上的导热板和散热PCB之间的增强的导电路径。 在一些实施例中，使用包含排气孔的自定心支撑销允许根据需要进行回流/波/手焊。

公开(公告)号：US20120122326A1

公开(公告)日：2012-05-17

申请号：US13319863

申请日：2010-05-07

Applicant: Werner Kallee

Inventor： Werner Kallee

IPC: H01R12/51

CPC classification number: H05K1/141 ,  H01C1/014 ,  H01C1/022 ,  H01C1/14 ,  H01C7/10 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/10022 ,  H05K2201/10181 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10871

Abstract: In order to releasably mount an electronic or electric component, the component is combined in a subassembly along with a support element and a housing. An insulating member that is penetrated by through-holes is mounted on the external face of the support element. Connecting elements are accommodated within said through-holes. The connecting elements are electrically and mechanically connected to the support element on one side and project from the front of the insulating member on the other side, where the connecting elements are designed as contact elements that are to be inserted into plated-through bores of a printed circuit board. This allows the electronic component to be plugged as a subassembly to the housing containing the printed circuit board and be removed again as required. If necessary, multiple components can be arranged on the support element inside the housing if said components form a functional unit.

Abstract translation: 为了可释放地安装电子或电气部件，该部件与支撑元件和壳体一起组合在子组件中。 通过贯通孔的绝缘构件安装在支撑元件的外表面上。 连接元件容纳在所述通孔内。 连接元件在一侧电连接和机械地连接到支撑元件，并且在另一侧从绝缘构件的前部突出，其中连接元件被设计为接触元件，该接触元件将被插入到 印刷电路板。 这允许将电子部件作为子组件插入到包含印刷电路板的外壳上，并根据需要再次移除。 如果需要，如果所述组件形成功能单元，则可以在壳体内的支撑元件上布置多个部件。

公开(公告)号：US07946861B2

公开(公告)日：2011-05-24

申请号：US12449283

申请日：2007-02-02

Applicant: Reinhard Sander

Inventor： Reinhard Sander

IPC: H01R12/00

CPC classification number: H01R12/585 ,  H05K3/308 ,  H05K2201/09827 ,  H05K2201/1059 ,  H05K2201/10787 ,  H05K2201/10871

Abstract: The invention relates to contact pins for providing an electrical connection between electronic devices. In one aspect the pin is adapted to be inserted into a hole of a circuit carrier and the pin comprises at least three portions; namely a contact termination portion, an electrical contact portion and a mechanical fastening portion. The mechanical fastening portion preferably allows a fastening of the contact pin without any soldering.

Abstract translation: 本发明涉及用于在电子设备之间提供电连接的接触针。 在一个方面，所述销适于插入电路载体的孔中，并且所述销包括至少三个部分; 即接触终端部分，电接触部分和机械紧固部分。 机械紧固部分优选地允许接触针的紧固而没有任何焊接。

公开(公告)号：US07944028B2

公开(公告)日：2011-05-17

申请号：US12154753

申请日：2008-05-27

Applicant: Don Saunders ,  Gabe Cherian

Inventor： Don Saunders ,  Gabe Cherian

IPC: H01L21/60

CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/73 ,  H01L24/742 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73257 ,  H01L2224/81903 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/308 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10825 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10977 ,  H05K2203/0769 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/72

Abstract: Two groups of interconnection devices and methods are described. Both provide columns between electronic packages and boards or between chips and substrates or the like. In the first group, called Thermal Flex Contact Carrier (TFCC), the column elements are carved out of a flat laminated structure and then formed to suit. In the second group, the carrier, which carries the connecting elements, is made out of a soluble or removable material, which acts at the same time, as a solder mask, to prevent the solder from wicking along the stem of the elements.

Abstract translation: 描述了两组互连设备和方法。 两者都在电子封装和电路板之间或芯片和衬底之间提供列等。 在第一组中，称为热挠性接触载体（TFCC），将柱元素从平面层压结构中雕刻出来，然后形成。 在第二组中，承载连接元件的载体由可溶或可移除的材料制成，其作为焊接掩模同时作用，以防止焊料沿着元件的芯部芯吸。

公开(公告)号：US07705618B2

公开(公告)日：2010-04-27

申请号：US11815506

申请日：2006-01-11

Applicant: Kiyoshi Kimura ,  Fujio Hara ,  Ken-ichi Koyama ,  Sugiro Shimoda

Inventor： Kiyoshi Kimura ,  Fujio Hara ,  Ken-ichi Koyama ,  Sugiro Shimoda

IPC: G01R1/073 ,  G01R31/28

CPC classification number: G01R3/00 ,  G01R1/07378 ,  H01R11/01 ,  H01R13/03 ,  H05K3/4046 ,  H05K2201/10871 ,  H05K2203/308 ,  Y10T29/49124

Abstract: Disclosed herein are a composite conductive sheet that has rigid conductors movable in a thickness-wise direction of an insulating sheet without falling off from the insulating sheet and is easy to handle by itself, a production process thereof, and an anisotropically conductive connector, an adaptor device and an electrical inspection apparatus for circuit devices, which are each equipped with this composite conductive sheet.The composite conductive sheet of the invention has an insulating sheet, in which a plurality of through-holes each extending in a thickness-wise direction of the sheet are formed, and rigid conductors arranged respectively in the through-holes in the insulating sheet so as to protrude from both surfaces of the insulating sheet, wherein each of the rigid conductors has terminal portions formed on both ends of a body portion inserted into the through-hole in the insulating sheet and each having a diameter greater than a diameter of the through-hole in the insulating sheet, and is movable in the thickness-wise direction of the insulating sheet.

Abstract translation: 这里公开了一种复合导电片，其具有在绝缘片的厚度方向上可移动的刚性导体，而不会从绝缘片脱落，并且易于自身处理，其制造方法和各向异性导电连接器，适配器 装置和用于电路装置的电气检查装置，每个装备有该复合导电片。 本发明的复合导电片具有绝缘片，其中形成有沿片材的厚度方向延伸的多个通孔，以及分别布置在绝缘片中的通孔中的刚性导体，以便 从绝缘片的两个表面突出，其中每个刚性导体具有形成在插入绝缘片中的通孔中的主体部分的两端上的端子部分，并且每个具有大于通孔直径的直径， 并且能够在绝缘片的厚度方向上移动。

公开(公告)号：US07677905B2

公开(公告)日：2010-03-16

申请号：US11979968

申请日：2007-11-13

Applicant: Takayoshi Honda

Inventor： Takayoshi Honda

IPC: H01R12/00

CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: An electronic device includes a printed circuit board with multiple lands and through holes and an electronic element with multiple terminals on the board. Each terminal is coupled with the land through a solder. The lands include a surface land on the board and an insertion land on a sidewall of the through hole. The terminals include a branch terminal having an insertion member and a surface member. The insertion member is coupled with the insertion land through the solder. The surface member is coupled with the surface land through the solder. The surface member is parallel to the printed circuit board. The insertion member is perpendicular to the printed circuit board. The insertion member extends from a part of the surface member, which faces the surface land and disposed above the through hole.

Abstract translation: 电子设备包括具有多个焊盘和通孔的印刷电路板以及具有多个端子的电子元件。 每个端子通过焊料与焊盘连接。 焊盘包括板上的表面焊盘和通孔的侧壁上的插入焊盘。 端子包括具有插入部件和表面部件的分支端子。 插入构件通过焊料与插入平台耦合。 表面构件通过焊料与表面焊盘连接。 表面构件平行于印刷电路板。 插入构件垂直于印刷电路板。 所述插入部件从所述表面部件的面向所述表面焊盘并设置在所述通孔的上方的一部分延伸。

公开(公告)号：US20090262544A1

公开(公告)日：2009-10-22

申请号：US12175946

申请日：2008-07-18

Applicant: Hsiang-Chen WU

Inventor： Hsiang-Chen WU

IPC: B60Q1/00 ,  H01J9/02 ,  H01J9/24 ,  F21V21/00

CPC classification number: B60Q1/2696 ,  F21S43/14 ,  F21S43/195 ,  H05K1/141 ,  H05K3/0097 ,  H05K3/202 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/10106 ,  H05K2201/10871

Abstract: An illuminant device and a manufacturing method thereof. The manufacturing method includes the following steps of providing a body with a plurality of connecting members, disposing a plurality of lamps on the connecting members, respectively, dividing the body with the lamps into a plurality of assembling units, installing the assembling units on a carrier, and assembling the carrier with a holder.

Abstract translation: 发光装置及其制造方法。 该制造方法包括以下步骤：为主体提供多个连接构件，将多个灯分别设置在连接构件上，将主体与灯分为多个组装单元，将组装单元安装在载体上 ，以及用支架组装所述载体。

公开(公告)号：US07578681B2

公开(公告)日：2009-08-25

申请号：US12222321

申请日：2008-08-07

Applicant: Takayoshi Honda ,  Minoru Hozuka

Inventor： Takayoshi Honda ,  Minoru Hozuka

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H05K3/3447 ,  H01R12/57 ,  H01R12/58 ,  H01R12/724 ,  H01R43/0256 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/1084 ,  H05K2201/10848 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2203/1178

Abstract: An electronic device includes a printed circuit board and an electronic element having a terminal. The terminal has a surface section and an insertion section. The printed circuit board includes a through hole extending from a first surface to a second surface of the printed circuit board, a surface land disposed on the first surface, and an insertion land integrally disposed on a sidewall of the through hole and on a periphery around the through hole. The surface section is coupled with the surface land through a solder. The insertion section is disposed in the through hole and is coupled with the insertion land through the solder. The surface section has a recess part and a portion of recess part is disposed so as to be axially aligned with a portion of the through hole.

公开(公告)号：US07563112B2

公开(公告)日：2009-07-21

申请号：US11979972

申请日：2007-11-13

Applicant: Takayoshi Honda

Inventor： Takayoshi Honda

IPC: H01R12/00

CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: An electronic device includes a printed circuit board having lands and an electronic element having a body and terminals. First and second lands provide a zigzag pattern. Each first land is coupled with the first terminal, and each second land is coupled with the second terminal. The second terminal includes a first parallel member, a first connection member, a second parallel member and a first mounting member. The first parallel member is completely embedded in the body, or another part of the first parallel member exposed from the body is shorter than the second parallel member. A second height between the second parallel member and the printed circuit board is smaller than a first height between the first parallel member and the printed circuit board.

Abstract translation: 电子设备包括具有平台的印刷电路板和具有主体和端子的电子元件。 第一和第二土地提供锯齿形图案。 每个第一焊盘与第一端子耦合，并且每个第二焊盘与第二端子耦合。 第二端子包括第一平行构件，第一连接构件，第二平行构件和第一安装构件。 第一平行构件完全嵌入主体中，或者从主体露出的第一平行构件的另一部分比第二平行构件短。 第二平行构件和印刷电路板之间的第二高度小于第一平行构件和印刷电路板之间的第一高度。