公开(公告)号：US20080226826A1

公开(公告)日：2008-09-18

申请号：US12091197

申请日：2007-06-22

Applicant: Takashi Tanaka ,  Kenichi Hara ,  Mitsuaki Iwashita

Inventor： Takashi Tanaka ,  Kenichi Hara ,  Mitsuaki Iwashita

IPC: B05D3/10 ,  B05C11/08

CPC classification number: H01L21/76849 ,  C23C18/1689 ,  C23C18/1834 ,  C23C18/50 ,  H01L21/288 ,  H01L21/67051 ,  H01L21/6723 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A substrate processing method includes applying electroless plating of CoWB onto a Cu interconnection line formed on a wafer W, and then performing a post-cleaning process by use of a cleaning liquid on the target substrate or wafer before a by-product is precipitated on the surface of the CoWB film formed by the electroless plating to cover the Cu interconnection line.

Abstract translation: 基板处理方法包括将CoWB的无电镀施加到形成在晶片W上的Cu互连线上，然后在副产物沉淀在靶基板或晶片上之后，通过使用目标基板或晶片上的清洗液进行后清洗处理 通过无电镀形成的CoWB膜的表面覆盖Cu互连线。

公开(公告)号：US20080176410A1

公开(公告)日：2008-07-24

申请号：US11772638

申请日：2007-07-02

Applicant: Tomoaki Muramatsu ,  Yuko Kaimoto ,  Ichiro Omata

Inventor： Tomoaki Muramatsu ,  Yuko Kaimoto ,  Ichiro Omata

IPC: H01L21/31 ,  B05C11/08

CPC classification number: H01L21/6715

Abstract: A method of forming a liquid coating on a substrate that reduces the amount of consumption of the coating liquid and achieves a more even distribution of the thickness of the liquid coating film. The method may include supplying a solvent to a surface of a substrate, starting a supply of a coating liquid to the surface of the substrate while rotating the substrate at a first rotation speed, stopping a rotation of the substrate by decelerating the rotation of the substrate at a deceleration larger than 30000 rpm/sec at a point of time when the supply of the coating liquid is stopped, and then rotating the substrate at a second rotation speed. Accordingly, the dispense amount of the coating liquid is reduced and the film thickness of the coating liquid is flatten.

Abstract translation: 一种在基板上形成液体涂层的方法，其减少涂布液的消耗量并且实现液体涂膜的厚度的更均匀分布。 该方法可以包括将溶剂供应到基材的表面，开始向基材的表面供应涂料，同时以第一转速旋转基材，通过减速基材的旋转来停止基材的旋转 在停止供给涂布液的时刻，以大于30000rpm /秒的减速度，然后以第二转速旋转基板。 因此，涂布液的分配量减少，涂布液的膜厚变平。

公开(公告)号：US20050241572A1

公开(公告)日：2005-11-03

申请号：US10888451

申请日：2004-07-09

Applicant: Jae Doo Eom

Inventor： Jae Doo Eom

IPC: G03F7/16 ,  B05C11/02 ,  B05C11/08 ,  B05C13/00 ,  H01L21/00 ,  H01L21/027

CPC classification number: G03F7/162 ,  B05C11/08 ,  H01L21/6715

Abstract: Disclosed is a photoresist coating apparatus capable of preventing a substrate from being contaminated and preventing a pattern bridge phenomenon from being created in the substrate during an exposure process by shielding backflow of photoresist through forcibly exhausting photoresist to an exterior. The photoresist coating apparatus includes a vacuum chuck for holding a substrate by using vacuum, a driving motor connected to the vacuum chuck through an arm, a first nozzle for coating photoresist onto the substrate, a second nozzle for performing a rinse process, a bath surrounding the vacuum chuck to prevent photoresist from being discharged to an exterior, a first drain pipe connected to both lower ends of the bath in order to discharge photoresist contained in the bath, and a photoresist discharge section for forcibly discharging photoresist contained in the bath to the exterior.

Abstract translation: 公开了一种光致抗蚀剂涂覆装置，其能够防止基板被污染，并且通过屏蔽通过强制排出光致抗蚀剂到外部的光致抗蚀剂回流而防止在曝光过程中在基板中产生图案桥现象。 光致抗蚀剂涂布装置包括用于通过真空保持基板的真空卡盘，通过臂连接到真空卡盘的驱动马达，用于将光致抗蚀剂涂覆到基板上的第一喷嘴，用于进行冲洗处理的第二喷嘴， 真空吸盘以防止光致抗蚀剂被排出到外部，连接到浴的两个下端的第一排水管，以便排出浴中所含的光致抗蚀剂;以及光致抗蚀剂放电部分，用于强制地将包含在浴中的光致抗蚀剂排出到 外观。

公开(公告)号：US20050150451A1

公开(公告)日：2005-07-14

申请号：US11029401

申请日：2005-01-06

Applicant: Michio Tanaka ,  Masami Yamashita

Inventor： Michio Tanaka ,  Masami Yamashita

IPC: B05D3/00 ,  B05C11/00 ,  B05C11/08 ,  B05C11/10 ,  G03C5/00 ,  H01L21/00 ,  H01L21/027 ,  H01L21/68

CPC classification number: H01L21/67178 ,  B05C11/08 ,  H01L21/6715 ,  H01L21/67184 ,  H01L21/67288 ,  H01L21/681

Abstract: According to the present invention, in a coating treatment apparatus comprising a rotary holding member and a coating solution discharge member, positional adjustment of the holding position of the substrate with respect to the rotary holding member and a discharge position of a coating solution discharge member is quickly and accurately performed, so that the time required for the positional adjustment can be shortened. Further, variations in accuracy of the positional adjustment depending on the degree of proficiency of operator can be eliminated, realizing positional adjustment with a high precision at all times.

Abstract translation: 根据本发明，在包括旋转保持构件和涂布液排出构件的涂布处理装置中，基板相对于旋转保持构件的保持位置和涂布液排出构件的排出位置的位置调整是 快速且准确地执行，从而可以缩短位置调整所需的时间。 此外，可以消除根据操作者的熟练程度的位置调整的精度的变化，始终以高精度实现位置调整。

公开(公告)号：US20050095368A1

公开(公告)日：2005-05-05

申请号：US11006876

申请日：2004-12-07

Applicant: Emir Gurer ,  Ed Lee ,  Murthy Krishna ,  Reese Reynolds ,  John Salois ,  Royal Cherry

Inventor： Emir Gurer ,  Ed Lee ,  Murthy Krishna ,  Reese Reynolds ,  John Salois ,  Royal Cherry

IPC: B05B7/08 ,  B05C5/02 ,  B05C11/08 ,  G03F7/30 ,  H01L21/027 ,  B05C11/00 ,  B05C5/00

CPC classification number: G03F7/322 ,  B05B7/0884 ,  B05C5/027 ,  B05C11/08 ,  G03F7/3021 ,  H01L21/67051

Abstract: Systems and methods are described for improved yield and line width performance for liquid polymers and other materials. A method for minimizing precipitation of developing reactant by lowering a sudden change in pH includes: developing at least a portion of a polymer layer on a substrate with an initial charge of a developer fluid; then rinsing the polymer with an additional charge of the developer fluid so as to controllably minimize a subsequent sudden change in pH; and then rinsing the polymer with a charge of another fluid. An apparatus for minimizing fluid impingement force on a polymer layer to be developed on a substrate includes: a nozzle including: a developer manifold adapted to supply a developer fluid; a plurality of developer fluid conduits coupled to the developer manifold; a rinse manifold adapted to supply a rinse fluid; and a plurality of rinse fluid conduits coupled to the developer manifold. The developer manifold and the rinse manifold can be staggered so as to reduce an external width of the nozzle compared to a nominal external width of the nozzle achievable without either intersecting the fluid manifold and the another manifold or staggering the fluid manifold and the another manifold. The systems and methods provide advantages including improve yield via reduced process-induced defect and partial counts, and improved critical dimension (CD) control capability.

Abstract translation: 描述了用于提高液体聚合物和其它材料的产量和线宽性能的系统和方法。 通过降低pH的突然变化来最小化显影反应物的沉淀的方法包括：用显影剂流体的初始电荷在基底上显影至少一部分聚合物层; 然后用额外的显影剂流体冲洗聚合物，以便可控地最小化随后的pH的突然变化; 然后用另一种流体的电荷冲洗聚合物。 用于使要在基底上显影的聚合物层上的流体冲击力最小化的装置包括：喷嘴，包括：适于供应显影剂流体的显影剂歧管; 耦合到显影剂歧管的多个显影剂流体导管; 适于提供漂洗液的冲洗歧管; 以及耦合到显影剂歧管的多个冲洗流体导管。 显影剂歧管和冲洗歧管可以交错，以便与可实现的喷嘴的标称外部宽度相比，减小喷嘴的外部宽度，而不用与流体歧管和另一歧管交叉或交错流体歧管和另一歧管。 这些系统和方法提供了优点，包括通过减少的过程引起的缺陷和部分计数提高产量，以及改进的临界尺寸（CD）控制能力。

公开(公告)号：US20050092206A1

公开(公告)日：2005-05-05

申请号：US10964276

申请日：2004-10-13

Applicant: Yoshinori Sakamoto ,  Naoki Yamashita

Inventor： Yoshinori Sakamoto ,  Naoki Yamashita

IPC: C09D183/04 ,  B05C11/08 ,  C08H1/00 ,  C09D5/25 ,  C09D7/12 ,  H01L21/316 ,  C07G1/00

CPC classification number: C09D183/04

Abstract: To provide a silica film-forming material having a low dielectric constant and giving a film of less undergoing change in aging, a coating solution for forming a silica film includes a hydrolysis product of a mixture comprising: a tetraalkoxysilane; and at least one of a monoalkyltrialkoxysilane and a dialkyldialkoxysilane, and an ammonium salt represented by formula (I): wherein R1 represents an alkyl group having from 6 to 30 carbon atoms, R2 represents an alkyl group having from 1 to 5 carbon atoms, and X represents CH3COO, SO3H or OH.

Abstract translation: 为了提供具有低介电常数的二氧化硅成膜材料，并且产生较小的老化变化的膜，用于形成二氧化硅膜的涂布溶液包括混合物的水解产物，其包含：四烷氧基硅烷; 和至少一种单烷基三烷氧基硅烷和二烷基二烷氧基硅烷，以及由式（I）表示的铵盐：其中R 1表示具有6至30个碳原子的烷基，R 2， / SUP>表示具有1至5个碳原子的烷基，X表示CH 3 COO，SO 3 H或OH。

公开(公告)号：US20050058775A1

公开(公告)日：2005-03-17

申请号：US10901412

申请日：2004-07-29

Applicant: Akio Oku ,  Yorikazu Sakamoto

Inventor： Akio Oku ,  Yorikazu Sakamoto

IPC: B05D1/40 ,  B05C5/00 ,  B05C11/08 ,  B05C11/10 ,  B05D1/00 ,  B05D1/26 ,  H01L21/00 ,  H01L21/027 ,  B05D3/12

CPC classification number: H01L21/67259 ,  B05D1/005 ,  H01L21/6715 ,  H01L21/67253

Abstract: A method of forming a coating film includes rotating a support member to rotate a target substrate in a horizontal state, and supplying a coating liquid onto a target surface from a supply port of a nozzle, while moving the nozzle in a horizontal direction relative to the target substrate being rotated. This method also includes detecting a height of the target surface, and controlling a vertical position of the nozzle, based on a detected height of the target surface, to satisfy a formula, (S/R)>D>0, when supplying the coating liquid. In the formula, S denotes an area of the supply port, R denotes an inner perimeter of the supply port, and D denotes a distance between the supply port and the target surface.

Abstract translation: 形成涂膜的方法包括旋转支撑构件以使水平状态的目标基板旋转，并且在喷嘴相对于喷嘴的水平方向移动喷嘴的同时，将涂布液从喷嘴的供给口供给到目标表面上 目标基板旋转。 该方法还包括检测目标表面的高度，并且基于检测到的目标表面的高度来控制喷嘴的垂直位置，以在供给涂层时满足公式（S / R）> D> 0 液体。 在公式中，S表示供给口的面积，R表示供给口的内周，D表示供给口与目标面的距离。

公开(公告)号：US20050053753A1

公开(公告)日：2005-03-10

申请号：US10967139

申请日：2004-10-19

Applicant: Yoshihisa Usami

Inventor： Yoshihisa Usami

IPC: B05C11/08 ,  B05D1/00 ,  B05D3/04 ,  G11B7/24 ,  G11B7/26 ,  B32B3/02

CPC classification number: G11B7/24 ,  B05C11/08 ,  B05D1/005 ,  B05D3/0406 ,  G11B7/26

Abstract: Disclosed is a method for producing an information-recording medium comprising, on a substrate, a dye recording layer capable of recording information, the method comprising the step of drying the substrate formed with the dye recording layer by allowing clean air to flow while rotating the substrate at a high speed; wherein an intake for introducing the clean air is narrowed by arranging a lid having a circular opening at a central portion, at an opening disposed at an upper portion of an apparatus for rotating the substrate at the high speed.

Abstract translation: 本发明公开了一种信息记录介质的制造方法，其特征在于，在基板上具有能够记录信息的染料记录层，所述方法包括以下步骤：使形成有染料记录层的基板通过允许清洁空气流动同时旋转 高速基板; 其中，用于引入清洁空气的入口通过在设置在用于高速旋转基板的设备的上部的开口处布置在中心部分处具有圆形开口的盖而变窄。

公开(公告)号：US06858088B1

公开(公告)日：2005-02-22

申请号：US09913986

申请日：2000-01-19

Applicant: Peter Dress ,  Karl Appich ,  Peter Krauss ,  Jakob Szekeresch ,  Robert Weihing

Inventor： Peter Dress ,  Karl Appich ,  Peter Krauss ,  Jakob Szekeresch ,  Robert Weihing

IPC: B05D1/40 ,  B05C11/08 ,  B05D3/10 ,  G03F7/16 ,  H01L21/00 ,  H01L21/027 ,  C23C16/00 ,  C23F1/00 ,  H01L21/306

CPC classification number: H01L21/6715 ,  B05C11/08 ,  G03F7/162

Abstract: To achieve a uniform coating of a substrate, with an apparatus and a method for coating substrates, according to which the substrate is supported on a substrate holder in such a way that a substrate surface that is to be coated is exposed, and the substrate is rotated together with the substrate holder, a cover can be secured to the substrate holder and together with the substrate holder forms a sealed chamber for the substrate.

Abstract translation: 为了实现衬底的均匀涂布，使用用于涂覆衬底的装置和方法，根据该装置和衬底被支撑在衬底保持器上，使得待被涂覆的衬底表面被暴露，并且衬底是 与衬底保持器一起旋转，盖可以固定到衬底保持器并与衬底保持器一起形成用于衬底的密封室。

公开(公告)号：US6165267A

公开(公告)日：2000-12-26

申请号：US167885

申请日：1998-10-07

Applicant: John R. Torczynski

Inventor： John R. Torczynski

IPC: B05C11/08 ,  B08B15/00 ,  H01L21/00 ,  H01L21/687 ,  B05C13/02 ,  B05D3/02 ,  B08B3/08 ,  B03D5/04

CPC classification number: H01L21/68735 ,  B05C11/08 ,  B08B15/007 ,  H01L21/6715 ,  Y10S134/902 ,  Y10T137/0357

Abstract: A spin coating apparatus requires less cleanroom air flow than prior spin coating apparatus to minimize cleanroom contamination. A shaped exhaust duct from the spin coater maintains process quality while requiring reduced cleanroom air flow. The exhaust duct can decrease in cross section as it extends from the wafer, minimizing eddy formation. The exhaust duct can conform to entrainment streamlines to minimize eddy formation and reduce interprocess contamination at minimal cleanroom air flow rates.

Abstract translation: 与现有的旋涂装置相比，旋涂装置需要较少的洁净室空气流量，以最小化洁净室污染。 来自旋转涂布机的成形排气管保持工艺质量，同时需要减少洁净室空气流。 当排气管从晶片延伸出来时，排气管的截面可以减小，从而使涡流形成最小化。 排气管道可以符合夹带流线，以最小化涡流形成，并在最小洁净室空气流速下减少进程间污染。