公开(公告)号：US12133049B2

公开(公告)日：2024-10-29

申请号：US18371488

申请日：2023-09-22

Applicant: InvenSense, Inc.

Inventor： Roberto Brioschi ,  Kazunori Hayata ,  Jr-Cheng Yeh ,  Dinesh Kumar Solanki

IPC: H04R19/04 ,  B81B7/00 ,  B81C1/00 ,  H04R1/04 ,  H04R3/00

CPC classification number: H04R19/04 ,  B81B7/0064 ,  B81C1/00333 ,  H04R1/04 ,  H04R3/00 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/0292 ,  B81B2203/0127 ,  B81B2207/015 ,  B81C2203/0109 ,  H04R2201/003

Abstract: A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.

公开(公告)号：US12050102B2

公开(公告)日：2024-07-30

申请号：US17025977

申请日：2020-09-18

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Gabriele Gattere ,  Carlo Valzasina ,  Enri Duqi

IPC: B81B7/00 ,  G01B7/16 ,  G01L1/14 ,  H01G5/01 ,  H01G5/16 ,  H01H1/00 ,  H03K17/975 ,  G06F3/044

CPC classification number: G01B7/22 ,  B81B7/0058 ,  G01L1/14 ,  H01G5/01 ,  H01G5/16 ,  H01H1/0036 ,  H03K17/975 ,  B81B2201/0221 ,  B81B2201/0292 ,  B81B2203/0154 ,  B81B2203/0181 ,  B81B2203/0307 ,  B81B2203/04 ,  B81B2203/056 ,  B81B2207/012 ,  G06F3/044

Abstract: A button device includes a MEMS sensor having a MEMS strain detection structure and a deformable substrate configured to undergo deformation under the action of an external force. The MEMS strain detection structure includes a mobile element carried by the deformable substrate via at least a first and a second anchorage, the latter fixed with respect to the deformable substrate and configured to displace and generate a deformation force on the mobile element in the presence of the external force; and stator elements capacitively coupled to the mobile element. The deformation of the mobile element causes a capacitance variation between the mobile element and the stator elements. Furthermore, the MEMS sensor is configured to generate detection signals correlated to the capacitance variation.

公开(公告)号：US20240219431A1

公开(公告)日：2024-07-04

申请号：US18396946

申请日：2023-12-27

Applicant: AIRBUS OPERATIONS, S.L.U.

Inventor： David VICENTE OLIVEROS ,  Carlos ANDRES GONZALEZ ,  Salvador SALES MAICAS ,  Hector GARCIA MIGUEL ,  Jorge Daniel MARTINEZ PEREZ

IPC: G01R15/24 ,  B81B7/02 ,  G01R19/00

CPC classification number: G01R15/24 ,  B81B7/02 ,  G01R19/0084 ,  B81B2201/0292

Abstract: An electrical voltage values measuring device having at least one microelectromechanical device comprising a first electrode connectable to an anode of an electrical voltage source and a second electrode connectable to a cathode of the electrical voltage source, wherein the microelectromechanical device is configured to receive an electrical voltage from the electrical voltage source causing a deviation of the first electrode, associated with the electrical voltage, wherein the deviation causes a distance variation between the first electrode and the second electrode, and an optical processor that comprises a laser and an optical sensor.

公开(公告)号：US20240215649A1

公开(公告)日：2024-07-04

申请号：US18454041

申请日：2023-08-22

Applicant: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.

Inventor： Jinyang Li ,  Rui Zhang

IPC: A24F40/51 ,  A24F40/10 ,  A24F40/40 ,  B81B3/00 ,  H04R1/02 ,  H04R7/04 ,  H04R19/04

CPC classification number: A24F40/51 ,  A24F40/10 ,  A24F40/40 ,  B81B3/0021 ,  H04R1/028 ,  H04R7/04 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2201/0292 ,  B81B2203/0127 ,  B81B2203/019 ,  H04R2201/003

Abstract: A MEMS sensor, includes a substrate with a back cavity, and a capacitive system arranged on the substrate, the MEMS sensor includes a first back plate assembly and a diaphragm opposite to the first back plate assembly. The first back plate assembly includes a first back plate and a second back plate, the first back plate includes a plurality of a first back plate holes, the second back plate includes a plurality of a second back plate holes, each first back plate hole and each second back plate hole are staggered with each other in a vibration direction of the diaphragm. Compared with the related art, the MEMS sensor disclosed by the present disclosure could play a good dustproof effect.

公开(公告)号：US12008432B2

公开(公告)日：2024-06-11

申请号：US17636942

申请日：2020-08-20

Applicant: Ruhr-Universität Bochum

Inventor： Philip Schmitt ,  Martin Hoffmann

IPC: G06M1/10 ,  B81B3/00

CPC classification number: G06M1/108 ,  B81B3/0064 ,  B81B2201/0292 ,  B81B2203/04

Abstract: A passive micromechanical counter for counting and storing a number of mechanical pulses includes at least one memory cell, the memory cell having a cell input, a latching mechanism and an electromechanical coding unit, the cell input being designed to mechanically transmit the mechanical pulse to the latching mechanism, and the latching mechanism being designed to store the number of mechanical pulses transmitted by means of its discrete latching position. It is provided that an electrical digital signal can be generated by applying an electrical voltage to the electromechanical coding unit, the electrical digital signal representing the discrete latching position of the latching mechanism.

公开(公告)号：US20230341367A1

公开(公告)日：2023-10-26

申请号：US17906920

申请日：2020-07-10

Applicant: Wiinaa Co., Ltd.

Inventor： Lei XU ,  Dongcheng XIE ,  Dongliang CHEN

IPC: G01N33/00 ,  B81B7/04

CPC classification number: G01N33/0031 ,  B81B7/04 ,  B81B2201/0292

Abstract: A MEMS gas sensor (A) and array (B) thereof, a gas detection and preparation method. The gas sensor (A) comprises a first substrate (A2) with a cavity (A1) provided in a first surface, and a gas detection assembly (A3) arranged at an opening of the cavity The gas detection assembly comprises: a supporting suspension bridge (A31) erected on the opening of the cavity, and a gas detection part (A32) arranged on the supporting suspension bridge. The gas detection part comprises a strip-shaped heating electrode part (A321), an insulating layer (A322), a strip-shaped detection electrode part (A323) and a gas-sensitive material part (A324), which are sequentially stacked. The strip-shaped detection electrode part comprises a first detection electrode part (A323-1) and a second detection electrode part (A323-2), with a first opening (A325) provided between the A323-1 and A323-2; the gas-sensitive material part is arranged at the position of the first opening.

公开(公告)号：US11787689B2

公开(公告)日：2023-10-17

申请号：US16630036

申请日：2018-07-04

Applicant: TDK Corporation

Inventor： Wolfgang Pahl

IPC: B81C1/00 ,  B81B7/00 ,  H04R19/04 ,  H04R31/00 ,  H04R1/04

CPC classification number: B81C1/00309 ,  B81B7/0061 ,  H04R19/04 ,  H04R31/00 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/99 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2203/0109 ,  B81C2203/032 ,  H04R1/04 ,  H04R2201/003

Abstract: A MEMS sensor with a media access opening in its carrier board. The MEMS sensor has an integrally filter mesh closing the media access opening. The mesh can be applied in unstructured form over the whole surface of the carrier board. Then, a structuring is performed to produce preferably at the same time a perforation forming the filter mesh.

公开(公告)号：US20230314197A1

公开(公告)日：2023-10-05

申请号：US17855013

申请日：2022-06-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Arvinder Manmohan Singh Chadha ,  Ashley M. Okada ,  Srikanth Krishnamurthy ,  Ming Xu

IPC: G01F1/688 ,  B81B7/00 ,  B81C1/00

CPC classification number: G01F1/688 ,  B81B7/0058 ,  B81C1/00301 ,  B81B2201/0292 ,  B81B2207/093 ,  B81C2203/035 ,  B81C2203/054 ,  B81C2203/019 ,  B81C2203/036 ,  H01J37/3244

Abstract: Certain embodiments of the present disclosure relate to a sensor assembly including a substrate, a housing, and a sensor die. In certain embodiments, the substrate includes an outer region, an inner region, and a middle region between the outer region and the inner region. In certain embodiments, the substrate includes electrical contact pads on at least the inner region. In certain embodiments, the housing is coupled to the substrate at the middle region or the outer region to provide a hermetic seal. In certain embodiments, the sensor die is coupled to the substrate at the inner region via the electrical contact pads. The sensor die is aligned to the substrate via aligning features that align the sensor die relative to the substrate in at least one of a first plane or a second plane.

公开(公告)号：US11718519B2

公开(公告)日：2023-08-08

申请号：US17102973

申请日：2020-11-24

Applicant: STMicroelectronics S.r.l.

Inventor： Marco Omar Ghidoni

IPC: B81B7/00 ,  B81B7/02 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/092

Abstract: A packaged environmental sensor includes a supporting structure and a sensor die, which incorporates an environmental sensor and is arranged on a first side of the supporting structure. A control chip is coupled to the sensor die and is arranged on a second side of the supporting structure opposite to the first side. A lid is bonded to the first side of the supporting structure and is open towards the outside in a direction opposite to the supporting structure. The sensor die is housed within the lid.

公开(公告)号：US20190185317A1

公开(公告)日：2019-06-20

申请号：US16206861

申请日：2018-11-30

Applicant: INVENSENSE, INC.

Inventor： Jongwoo Shin ,  Houri Johari-Galle ,  Bongsang Kim ,  Joseph Seeger ,  Dongyang Kang

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/008 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81C1/00523 ,  B81C2203/0785

Abstract: A device comprising a micro-electro-mechanical system (MEMS) substrate with protrusions of different heights that has been integrated with a complementary metal-oxide-semiconductor (CMOS) substrate is presented herein. The MEMS substrate comprises defined protrusions of respective distinct heights from a surface of the MEMS substrate, and the MEMS substrate is bonded to the CMOS substrate. In an aspect, the defined protrusions can be formed from the MEMS substrate. In another aspect, the defined protrusions can be deposited on, or attached to, the MEMS substrate. In yet another aspect, the MEMS substrate comprises monocrystalline silicon and/or polysilicon. In yet even another aspect, the defined protrusions comprise respective electrodes of sensors of the device.