公开(公告)号：US09258880B2

公开(公告)日：2016-02-09

申请号：US13987701

申请日：2013-08-22

Applicant: INTEL CORPORATION

Inventor： Aleksandar Aleksov ,  Vladimir Noveski ,  Sujit Sharan ,  Shankar Ganapathysubramanian

IPC: H05H1/02 ,  H05K1/02 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  H05K3/46 ,  H05K1/03 ,  H05K3/06 ,  H05K3/10 ,  H05K3/20 ,  H05K3/38

CPC classification number: H05K1/0201 ,  H01L21/4807 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/107 ,  H05K3/205 ,  H05K3/388 ,  H05K3/4617 ,  H05K3/4629 ,  H05K3/4647 ,  H05K2201/0175 ,  H05K2201/0187 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

公开(公告)号：US09253870B2

公开(公告)日：2016-02-02

申请号：US14711248

申请日：2015-05-13

Applicant: ROLLS-ROYCE PLC

Inventor： Michael Christopher Willmot ,  Alec Michael Georgala ,  Martin Anthony James Emery

IPC: H05K1/00 ,  H05K1/02 ,  F02C7/25 ,  H05K3/46 ,  H05K3/10

CPC classification number: H05K1/0201 ,  B29C70/88 ,  B32B3/08 ,  B32B27/065 ,  B32B27/08 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/10 ,  B32B2307/3065 ,  B32B2457/00 ,  B32B2605/00 ,  F02C7/25 ,  F02C7/32 ,  H01B7/295 ,  H05K3/10 ,  H05K3/46 ,  H05K2203/1147 ,  Y02T50/672 ,  Y10T29/49119

Abstract: A rigid electrical panel and a method of manufacturing a rigid electrical panel is provided with a fire protection layer on at least one side. The fire protection layer comprises fibers and an intumescent material. The rigid electrical panel comprises electrical conductors embedded in a rigid organic matrix composite. In the event of a fire, the fire protection layer protects the embedded electrical conductors, and any other features or components carried by the electrical panel.

Abstract translation: 刚性电气面板和制造刚性电气面板的方法在至少一侧上设置有防火层。 防火层包括纤维和膨胀材料。 刚性电气面板包括嵌入刚性有机基质复合材料中的电导体。 在发生火灾的情况下，防火层可以保护嵌入的电导体以及由电气面板承载的任何其他特征或组件。

公开(公告)号：US20160014901A1

公开(公告)日：2016-01-14

申请号：US14772329

申请日：2014-03-11

Applicant: SCHWEIZER ELECTRONIC AG

Inventor： Thomas GOTTWALD ,  Alexander NEUMANN

IPC: H05K1/18 ,  H05K3/28 ,  H05K1/11 ,  H05K3/42 ,  H05K1/02 ,  H05K3/32 ,  H05K3/00

CPC classification number: H05K1/181 ,  H01L23/142 ,  H01L23/3677 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/111 ,  H05K3/0047 ,  H05K3/0094 ,  H05K3/284 ,  H05K3/32 ,  H05K3/42 ,  H05K2201/09036 ,  H01L2924/00

Abstract: Electronic sub-assembly comprising a carrier layer and a mounting area with at least one electronic component, wherein the carrier layer has at least in portions a material with a low coefficient of thermal expansion to adjust the coefficient of thermal expansion of the carrier layer, and wherein at least one compensation layer is provided on the carrier layer adjacent to the installation area, on which compensation layer an electrically insulating, thermally conductive layer and at least one electrically conductive layer are provided.

Abstract translation: 电子子组件包括载体层和具有至少一个电子部件的安装区域，其中载体层至少部分具有低热膨胀系数的材料以调节载体层的热膨胀系数，以及 其中至少一个补偿层设置在邻近安装区域的载体层上，补偿层上设置有电绝缘的导热层和至少一个导电层。

公开(公告)号：US09214617B2

公开(公告)日：2015-12-15

申请号：US13589446

申请日：2012-08-20

Applicant: Hiromasa Kato ,  Takayuki Naba ,  Noritaka Nakayama

Inventor： Hiromasa Kato ,  Takayuki Naba ,  Noritaka Nakayama

IPC: H05K1/16 ,  H05K1/18 ,  H05K1/02 ,  H01L35/30 ,  H01L23/373 ,  H01L23/00 ,  H05K3/34

CPC classification number: H01L35/30 ,  H01L23/3735 ,  H01L23/473 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83805 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/351 ,  H05K1/0201 ,  H05K1/18 ,  H05K3/3463 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/01039

Abstract: An electronic component module has a circuit board in which metal plates are bonded to both surfaces of a ceramic substrate, and an electronic component that is bonded to at least one surface of the metal plate and is operable at least 125° C. The electronic component is bonded to the metal plate via a brazing material layer having a higher melting point than a operating temperature of the electronic component.

Abstract translation: 电子部件模块具有电路基板，金属板与陶瓷基板的两面接合，电子部件与金属板的至少一个面接合，并且可操作至少125℃。电子部件 通过具有比电子部件的工作温度更高的熔点的钎料层与金属板接合。

公开(公告)号：US20150342022A1

公开(公告)日：2015-11-26

申请号：US14711248

申请日：2015-05-13

Applicant: ROLLS-ROYCE PLC

Inventor： Michael Christopher WILLMOT ,  Alec Michael GEORGALA ,  Martin Anthony James EMERY

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/10 ,  F02C7/25

CPC classification number: H05K1/0201 ,  B29C70/88 ,  B32B3/08 ,  B32B27/065 ,  B32B27/08 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/10 ,  B32B2307/3065 ,  B32B2457/00 ,  B32B2605/00 ,  F02C7/25 ,  F02C7/32 ,  H01B7/295 ,  H05K3/10 ,  H05K3/46 ,  H05K2203/1147 ,  Y02T50/672 ,  Y10T29/49119

Abstract: A rigid electrical panel and a method of manufacturing a rigid electrical panel is provided with a fire protection layer on at least one side. The fire protection layer comprises fibres and an intumescent material. The rigid electrical panel comprises electrical conductors embedded in a rigid organic matrix composite. In the event of a fire, the fire protection layer protects the embedded electrical conductors, and any other features or components carried by the electrical panel.

Abstract translation: 刚性电气面板和制造刚性电气面板的方法在至少一侧上设置有防火层。 防火层包括纤维和膨胀材料。 刚性电气面板包括嵌入刚性有机基质复合材料中的电导体。 在发生火灾的情况下，防火层可以保护嵌入的电导体以及由电气面板承载的任何其他特征或组件。

公开(公告)号：US09161432B2

公开(公告)日：2015-10-13

申请号：US13598269

申请日：2012-08-29

Applicant: Toshio Watanabe ,  Isao Ichimura ,  Tatsuo Maeda ,  Takuma Nagata

Inventor： Toshio Watanabe ,  Isao Ichimura ,  Tatsuo Maeda ,  Takuma Nagata

IPC: H05K7/20 ,  H05K1/02 ,  H05K3/00 ,  H05K3/30

CPC classification number: H05K1/0201 ,  H05K3/0061 ,  H05K3/303 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2201/10409 ,  H05K2203/165

Abstract: A circuit board includes a board having a hole formed therein, and an imager that is bonded to a first region including at least a portion of the hole in a front surface of the board.

Abstract translation: 电路板包括其中形成有孔的板，以及结合到包括板的前表面中的孔的至少一部分的第一区域的成像器。

公开(公告)号：US20150263512A1

公开(公告)日：2015-09-17

申请号：US14210759

申请日：2014-03-14

Applicant: General Electric Company

Inventor： Davide Jonathan Leone

IPC: H02H7/20 ,  H05K1/11 ,  H05K1/03 ,  H02H3/16 ,  H05K1/18

CPC classification number: H05K1/0201 ,  H05K1/0262 ,  H05K3/0064 ,  H05K3/3447 ,  H05K2201/0116 ,  H05K2201/10151 ,  H05K2203/0278 ,  H05K2203/1136

Abstract: Printed circuit board assemblies providing fault detection are provided. One example printed circuit board assembly includes a substrate layer. One or more solder pins are located on a rear surface of the substrate layer. The printed circuit board assembly includes a non-conductive layer adjacent to the rear surface of the substrate layer. The printed circuit board assembly includes a conductive layer adjacent to the non-conductive layer. The conductive layer is electrically connected to a ground. The printed circuit board assembly includes a mounting surface. The printed circuit board assembly includes a support layer compressed between the conductive layer and the mounting surface. The support layer applies a mechanical force that presses the conductive layer towards the non-conductive layer.

Abstract translation: 提供了提供故障检测的印刷电路板组件。 一个示例性印刷电路板组件包括基底层。 一个或多个焊针位于衬底层的后表面上。 印刷电路板组件包括与衬底层的后表面相邻的非导电层。 印刷电路板组件包括与非导电层相邻的导电层。 导电层电连接到地面。 印刷电路板组件包括安装表面。 印刷电路板组件包括在导电层和安装表面之间压缩的支撑层。 支撑层施加将导电层压向非导电层的机械力。

公开(公告)号：US09089072B2

公开(公告)日：2015-07-21

申请号：US13753824

申请日：2013-01-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ki Lee ,  Kwang Soo Kim ,  Bum Seok Suh ,  Chang Seob Hong ,  Joon Seok Chae

IPC: H05K7/20 ,  B23P15/26 ,  H05K1/02

CPC classification number: H05K7/20 ,  B23P15/26 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0201 ,  H05K1/0204 ,  H05K1/0271 ,  H05K1/05 ,  H05K3/44 ,  H05K2201/0187 ,  H05K2201/09909 ,  H05K2201/09972 ,  H05K2203/0207 ,  Y10T29/4935 ,  H01L2924/00014

Abstract: Disclosed herein is a heat radiating substrate including: a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a conductor pattern layer formed on the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.

Abstract translation: 本发明公开了一种散热基板，其特征在于，包括：散热板，具有规定深度的多个孔，形成在其一侧的下部; 导体图案层，其形成在所述散热板上并且包括其上安装有控制装置和功率器件的安装焊盘和电路图案; 以及形成在散热板和导体图案层之间的绝缘层。

公开(公告)号：US09084371B2

公开(公告)日：2015-07-14

申请号：US13386835

申请日：2010-07-27

Applicant: Hitoshi Shimadu ,  Kazunori Kondou ,  Takehiko Sawada ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

Inventor： Hitoshi Shimadu ,  Kazunori Kondou ,  Takehiko Sawada ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

IPC: H05K1/16 ,  H05K1/18 ,  H05K1/02 ,  H05K3/20 ,  H01L23/367 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H05K3/38

CPC classification number: H05K3/202 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49861 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/0263 ,  H05K1/111 ,  H05K1/181 ,  H05K3/341 ,  H05K3/386 ,  H05K2201/09745 ,  H05K2203/167 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Disclosed is a wiring substrate that is provided with a wiring pattern formed from a metal plate, and an insulation layer as a base material to which the wiring pattern is to be fixed. The wiring pattern has a mounting pad for having electronic parts (11) surface-mounted. Electronic parts are mounted onto the surface of the wiring pattern, by pouring solder into the mounting pad of the wiring pattern.

Abstract translation: 公开了一种布线基板，其具有由金属板形成的布线图案，以及作为要固定布线图案的基材的绝缘层。 布线图案具有用于具有表面安装的电子部件（11）的安装垫。 电子部件通过将焊料倒入配线图案的安装焊盘而安装在布线图案的表面上。

公开(公告)号：US20150181690A1

公开(公告)日：2015-06-25

申请号：US14516487

申请日：2014-10-16

Applicant: HYUNDAI MOTOR COMPANY ,  KIA MOTORS CORPORATION ,  YURA CORPORATION CO., LTD.

Inventor： Mun Jong KIM ,  Kwan Bum LEE ,  Jin Su YEOM

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/44 ,  H05K3/46 ,  H05K3/00 ,  H05K3/06

CPC classification number: H05K1/0201 ,  H05K1/0206 ,  H05K1/09 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/067 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0338 ,  H05K2201/09045 ,  H05K2203/0278 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49165

Abstract: A heat dissipation printed circuit board includes a metal core, lower and upper insulating layers, first lower and first upper circuit patterns, and second lower and second upper circuit patterns. The lower and upper insulating layers are disposed at a lower side and an upper side of the metal core, respectively. The first lower and first upper circuit patterns are disposed at a lower side of the lower insulating layer and at an upper side of the upper insulating layer, respectively. The second lower and second upper circuit patterns are disposed at a lower side of the first lower circuit pattern and at an upper side of the first upper circuit pattern, respectively. An etching portion in the first lower circuit pattern is filled with the lower insulating layer and an etching portion in the first upper circuit pattern is filled with the upper insulating layer.

Abstract translation: 散热印刷电路板包括金属芯，下绝缘层和上绝缘层，第一下电极图案和第一上电路图案以及第二下电路图案和第二上电路图案。 下绝缘层和上绝缘层分别设置在金属芯的下侧和上侧。 第一下电极和第一上电路图案分别设置在下绝缘层的下侧和上绝缘层的上侧。 第二下电路图案和第二上电路图案分别设置在第一下电路图案的下侧和第一上电路图案的上侧。 第一下部电路图案中的蚀刻部分填充有下部绝缘层，并且第一上部电路图案中的蚀刻部分填充有上部绝缘层。