公开(公告)号：US20230141729A1

公开(公告)日：2023-05-11

申请号：US17906890

申请日：2021-03-30

Applicant: Denka Company Limited

Inventor： Yoshitaka MINAKATA ,  Yusuke WAKUDA ,  Shinya SAKAGUCHI ,  Tomoya YAMAGUCHI ,  Koji NISHIMURA

IPC: C04B41/48 ,  C04B35/583 ,  C04B35/64 ,  C04B35/63 ,  C04B41/00 ,  C04B41/83 ,  H05K1/03

CPC classification number: C04B41/4853 ,  C04B35/583 ,  C04B35/64 ,  C04B35/6303 ,  C04B41/0072 ,  C04B41/83 ,  H05K1/0353 ,  C04B2235/386 ,  C04B2235/3856 ,  C04B2235/3409 ,  C04B2235/442 ,  C04B2235/612 ,  C04B2235/652 ,  H05K2201/06

Abstract: Provided is a method for manufacturing a composite body, the method including: a nitriding step of firing a boron carbide powder in a nitrogen atmosphere to obtain a fired product containing boron carbonitride; a sintering step of molding and heating a blend containing the fired product and a sintering aid to obtain a boron nitride sintered body including boron nitride particles and pores; and an impregnating step of impregnating the boron nitride sintered body with a resin composition, the composite body having the boron nitride sintered body and a resin filled in at least some of the pores of the boron nitride sintered body.

公开(公告)号：US20180235074A1

公开(公告)日：2018-08-16

申请号：US15861676

申请日：2018-01-04

Applicant: Amazing Cool Technology Corp

Inventor： Yang-Ming SHIH ,  Hung-Yun Hsu

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H05K1/0209 ,  H05K2201/0257 ,  H05K2201/0323 ,  H05K2201/06 ,  H05K2201/09781

Abstract: A radiative cooling structure for a printed circuit includes a circuit board and a cooling structure. A printed circuit is disposed on the circuit board. The printed circuit includes a plurality of printed leads and a thermal conductive area. The printed leads are connected to the thermal conductive area. A cooling structure covers the thermal conductive area. The cooling structure covers the thermal conductive area, and the cooling structure incudes a thermal radiation layer. Heat generated by heat sources on the circuit board is transferred to the thermal conductive area via the printed circuit. The cooling structure radiates the heat into surrounding space by radiation.

公开(公告)号：US09883578B1

公开(公告)日：2018-01-30

申请号：US15386234

申请日：2016-12-21

Applicant: Deere & Company

Inventor： Thomas J. Roan ,  Brij N. Singh

IPC: H05K1/02

CPC classification number: H05K1/0201 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/06 ,  H05K2201/064 ,  H05K2201/09036

Abstract: An electrical assembly comprises a dielectric substrate and a metallic conductive trace overlying the substrate. The metallic conductive trace has a hollow cross-section that forms a duct. An annular member protrudes from the metallic conductive trace. The annular member has an opening in communication with the duct, the opening for receiving pressurized air or gas.

公开(公告)号：US20170273217A1

公开(公告)日：2017-09-21

申请号：US15617123

申请日：2017-06-08

Applicant: Coriant Operations, Inc.

Inventor： Zhen Lei ,  Qinzhen Ba ,  Zongxian Duan ,  HuiHui Yu

IPC: H05K7/20 ,  H01L23/40 ,  B23P15/26 ,  H05K1/02 ,  H01L23/367

CPC classification number: H05K7/20409 ,  B23P15/26 ,  H01L23/3677 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/06 ,  H01L2924/00

Abstract: An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.

公开(公告)号：US20170245373A1

公开(公告)日：2017-08-24

申请号：US15434466

申请日：2017-02-16

Applicant: DENSO CORPORATION

Inventor： Akito IWAMA ,  Shinichi AWANO ,  Seiji TACHIBANA

IPC: H05K3/22 ,  B05D5/00 ,  H05K1/02

CPC classification number: H05K3/22 ,  B05D1/26 ,  B05D5/00 ,  H05K1/0203 ,  H05K1/0209 ,  H05K3/284 ,  H05K2201/0209 ,  H05K2201/06 ,  H05K2201/10166 ,  H05K2203/0126

Abstract: There is provided a method of manufacturing an electronic unit that includes an electronic component having a rectangular plate shape and generating heat during operation, and a heat dissipation gel covering the electronic component. The method includes a side surface coating step of coating opposite two side surfaces of four side surfaces of the electronic component with the heat dissipation gel by discharging the heat dissipation gel from a flat-shaped opening of a nozzle, and a top surface coating step of coating a top surface of the electronic component by discharging the heat dissipation gel from the opening of the nozzle after completion of the side surface coating step.

公开(公告)号：US20170137674A1

公开(公告)日：2017-05-18

申请号：US15319160

申请日：2015-06-25

Applicant: AMOGREENTECH CO., LTD.

Inventor： Seung Jae HWANG

IPC: C09J11/04 ,  C09J7/00 ,  C09J7/02 ,  H05K1/18 ,  B32B27/20 ,  B32B27/08 ,  H05K1/02 ,  C09J9/00 ,  B32B7/12

CPC classification number: H05K7/20 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B2307/302 ,  B32B2457/08 ,  C08K7/04 ,  C08K7/18 ,  C09J7/00 ,  C09J7/20 ,  C09J9/00 ,  C09J11/04 ,  C09J2203/326 ,  C09J2205/102 ,  H05K1/0203 ,  H05K1/028 ,  H05K1/18 ,  H05K2201/06 ,  H05K2201/10128 ,  H05K2201/10159

Abstract: Provided are a heat-radiating adhesive member, a heat-radiating sheet using the heat-radiating adhesive member, and an electronic apparatus having the heat-radiating sheet. The heat-radiating adhesive member includes: an adhesive layer; first thermally conductive fillers that are dispersed inside the adhesive layer and spreads heat generated from a heat-generating component of an electronic apparatus in a horizontal direction of the adhesive layer; and second thermally conductive fillers that are dispersed inside the adhesive layer and transfer the heat generated from the heat-generating component of the electronic apparatus to the first thermally conductive fillers.

公开(公告)号：US09655238B2

公开(公告)日：2017-05-16

申请号：US14698276

申请日：2015-04-28

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kazutaka Kobayashi

IPC: H05K1/05 ,  H05K1/02 ,  H05K7/20 ,  H05K1/11 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K1/056 ,  H05K1/0206 ,  H05K1/0256 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/181 ,  H05K7/205 ,  H05K2201/0195 ,  H05K2201/06 ,  H05K2201/09227 ,  H05K2201/10106 ,  H05K2201/10969

Abstract: A wiring board includes a heat dissipation plate, a heat-conductive adhesive layer, an insulating layer, a thermal via, a heat dissipation metal terminal, and electrodes. The heat-conductive adhesive layer is disposed on the heat dissipation plate. The insulating layer is disposed on the heat-conductive adhesive layer. The insulating layer is formed with an opening portion. The thermal via is disposed in the opening portion of the insulating layer. The heat dissipation metal terminal is disposed on the thermal via and electrically connected to the heat dissipation plate. The electrodes are disposed on the insulating layer. The electrodes are to be connected to an electronic component.

公开(公告)号：US09648736B2

公开(公告)日：2017-05-09

申请号：US14528346

申请日：2014-10-30

Applicant: A.B. Mikroelektronik Gesellschaft mit beschraenkter Haftung

Inventor： Robert Christopher Burns ,  Wolfgang Tusler ,  Bernd Haegele

IPC: H05K7/00 ,  H05K1/05 ,  H01L23/492 ,  H01L25/07 ,  H05K1/02 ,  H02M7/00 ,  H05K7/02 ,  H05K7/04 ,  H01L25/18

CPC classification number: H05K1/05 ,  H01L23/492 ,  H01L25/072 ,  H01L25/18 ,  H01L2924/0002 ,  H02M7/003 ,  H05K1/021 ,  H05K1/0263 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/4644 ,  H05K7/023 ,  H05K7/04 ,  H05K2201/0326 ,  H05K2201/04 ,  H05K2201/06 ,  H05K2201/10166 ,  H01L2924/00

Abstract: The invention relates to a circuit board, particularly for a power-electronic module, comprising an electrically-conductive substrate which consists, at least partially and preferably entirely, of aluminium and/or an aluminium alloy. On at least one surface of the electrically-conductive substrate, at least one conductor surface is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface being in direct electrical contact with the electrically-conductive substrate.

公开(公告)号：US20170075083A1

公开(公告)日：2017-03-16

申请号：US15295269

申请日：2016-10-17

Applicant: Lumentum Operations LLC

Inventor： David Moore ,  Dean Flockton

IPC: G02B6/42 ,  H05K3/30 ,  H05K1/18 ,  H05K7/20

CPC classification number: G02B6/4269 ,  B32B7/12 ,  B32B27/06 ,  B32B27/281 ,  G02B6/428 ,  H05K1/18 ,  H05K3/301 ,  H05K7/20 ,  H05K7/2039 ,  H05K7/20409 ,  H05K7/20418 ,  H05K9/0058 ,  H05K2201/06 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10962

Abstract: Present thermal solutions to conduct heat from pluggable optical modules into heat sinks use a metal heat sink attached with a spring clip. The interface between the pluggable module and the heat sink is simple metal-on-metal contact, which is inherently a poor thermal interface and limits heat dissipation from the optical module. Heat dissipation from pluggable optical modules is enhanced by the application of thermally conductive fibers, such as an advanced carbon nanotube velvet. The solution improves heat dissipation while preserving the removable nature of the optical modules.

Abstract translation: 目前，将可插拔光模块传导热量的热解决方案使用附有弹簧夹的金属散热器。 可插拔模块和散热器之间的接口是简单的金属对金属接触，这本质上是一个差的热接口，并限制了光学模块的散热。 通过使用诸如先进的碳纳米管天鹅绒的导热纤维来增强可插拔光学模块的散热。 该解决方案可以改善散热，同时保持光学模块的可拆卸性。

公开(公告)号：US09521738B1

公开(公告)日：2016-12-13

申请号：US14560898

申请日：2014-12-04

Applicant: Flextronics AP, LLC

Inventor： Dennis Willie ,  Richard Loi ,  David Geiger ,  Anwar Mohammed ,  Murad Kurwa ,  Hector Rene Marin Hernandez

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/473

CPC classification number: H05K1/0201 ,  H01L23/373 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/115 ,  H05K1/181 ,  H05K3/3494 ,  H05K7/20209 ,  H05K7/2039 ,  H05K2201/0323 ,  H05K2201/06 ,  H05K2201/062 ,  H05K2201/10371 ,  H05K2203/304

Abstract: A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology.

Abstract translation: 形成的石墨片的形状和尺寸被设计为位于耦合到PCB的电子部件上方的保护屏蔽。 形成的石墨片用于保护电子部件的主体免受在电子部件组装到PCB期间所施加的热，例如在SMT和通孔技术中使用的加热步骤。