Abstract:
The present invention provides a printed circuit board including: a circuit pattern formed on a first insulating layer; a via pad disposed on the first insulating layer by being spaced apart from the circuit pattern, formed on a lower surface, where a via hole is formed, to have a cross section larger than that of the via hole, and having concavo-convex patterns; a second insulating layer formed on the via pad where the via hole is not formed and on the circuit pattern; and a copper foil layer formed on the second insulating layer and the via hole, and a method of manufacturing the same.
Abstract:
A contact area is provided on a carrier for connection to a mating contact area on a further carrier using an adhesive containing conductive particles. The contact area includes at least one recess forming a drain channel for the adhesive, extending from one edge of the contact area to an opposing edge and having a width being less than an average diameter of the particles. Alternatively, the contact area includes boreholes extending from a main surface to an opposing main surface and having diameters being approximately equal to or smaller than the average diameter of the particles in at least one direction and a cavity is formed in the carrier beneath the contact area. Alternatively, integral moldings forming a turf structure are provided on the contact area and distances between the moldings are equal to or smaller than the average diameter of the particles in at least one direction.
Abstract:
A producing method of a suspension board with circuit includes simultaneously forming a conductive pattern formed on an insulating layer formed on a metal supporting board and having a terminal portion for connecting to an electronic component, and a mark formed on the metal supporting board, or on the insulating layer and having an opening for forming a reference hole for mounting the electronic component, and forming the reference hole by etching the metal supporting board disposed in the opening of the mark, or the insulating layer and the metal supporting board each disposed in the opening of the mark.
Abstract:
A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.
Abstract:
A display apparatus including a display panel including a pixel electrode and a plurality of first signal lines transmitting a driving signal to the pixel electrode, a conductive member on the first signal lines, the conductive member having a resin, and a second signal line on the conductive member, the second signal line having an opening through which the resin travels to couple the second signal line with one of the first signal lines.
Abstract:
The present invention provides a liquid crystal display configured with a backframe having an internal surface and external surface. A liquid crystal display panel is installed on the internal surface of the backframe. A printed circuit board is disposed on the external surface of the backframe, the printed circuit board being defined with openings. And wherein the liquid crystal display further includes fixtures located on the backframe, each of the fixture configured with a supporting post and a positioning arm cantilevered from the supporting post, the positioning beam being provided with embossed button, wherein when the printed circuit board is attached to the external surface of the backframe, the printed circuit board is positioned by the fixtures which at least a portion of the embossed button extending into the opening of the printed circuit board. Not only will this ensure a reliable interconnection between the printed circuit board and the backframe, but also will upgrade the performance of assembling the printed circuit board to the backframe.
Abstract:
A printed circuit board includes a substrate, at least one pad on the substrate, and permanent mold coatings capable of coating on the copper foil. Each pad includes a copper foil and a solder resist coating on the substrate and surrounding the copper foil. The copper foil defines an opening. The opening is coated with solder resist, whereby the permanent mold coatings form a recess corresponding to the opening when coated on the copper foil. A method for manufacturing a printed circuit board is also provided.
Abstract:
An electrical interconnect has a circuit substrate and an electrical connection point on the circuit substrate. The electrical connection point includes a lattice of conductive material that is adjacent a gap in the circuit substrate and has anchor points that are attached to the circuit substrate. In some configurations, a conductive epoxy encapsulates at least a portion of the lattice of conductive material and may include a second electrical connection point that is bonded to the other electrical connection point through the conductive epoxy.
Abstract:
There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.
Abstract:
Provided are a belt-like flexible LED light which can use a general surface mounting type LED having a large number of kinds, can be bent in both an orthogonal direction to a light emitting direction and a vertical direction, is long and compact and applies a stress to a circuit board with difficulty, a circuit board capable of implementing the same, and an LED illuminating device using the same. An LED mounting circuit board in which an LED mounting portion 1 having a plurality of LEDs mounted in an array is provided on a central part in a transverse direction of a long belt-like flexible board, both sides in a transverse direction of the LED mounting portion 1 are provided with a first board 2 and a second board 3 having a feed pattern for causing a current to flow to the LEDs which is formed thereon, and the LED mounting portion 1 and the first board 2 and second board 3 are formed to be bendable, and a belt-like flexible LED light using the same are provided.