公开(公告)号：US20120074208A1

公开(公告)日：2012-03-29

申请号：US13313293

申请日：2011-12-07

Applicant: Masahiro TAGANO ,  Teruyuki KITAHARA

Inventor： Masahiro TAGANO ,  Teruyuki KITAHARA

IPC: B23K1/20

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H01R12/707 ,  H05K1/0263 ,  H05K2201/0979 ,  H05K2201/10272 ,  H05K2201/10856 ,  H05K2203/0195 ,  H05K2203/1446 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed board includes a printed board body having a first side, a second side opposing the first side, and a through-hole; a printed conductor disposed on the first side of the printed board body; and a bus bar disposed on the second side of the printed board body, the bus bar including a terminal that extends through the through-hole. The terminal includes a plurality of branched terminal portions at a position corresponding to an interior of the through-hole, and at least one of the branched terminal portions is bent and attached to the printed conductor.

Abstract translation: 印刷电路板包括具有第一侧，与第一侧相对的第二侧和通孔的印刷电路板主体; 布置在所述印刷电路板主体的第一侧上的印刷导体; 以及布置在印刷电路板主体的第二侧上的母线，母线包括延伸穿过通孔的端子。 端子在与通孔内部相对应的位置处包括多个分支端子部分，并且至少一个分支端子部分弯曲并附着到印刷导体。

公开(公告)号：US08100043B1

公开(公告)日：2012-01-24

申请号：US12411762

申请日：2009-03-26

Applicant: Christopher J Nance ,  Christopher A McKellips ,  James D Lucas

Inventor： Christopher J Nance ,  Christopher A McKellips ,  James D Lucas

IPC: F42B3/10

CPC classification number: F42B3/195 ,  F42B3/103 ,  F42B3/18 ,  F42C19/0815 ,  H05K1/181 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10325 ,  Y02P70/611 ,  Y10T29/49133

Abstract: An energetic material initiation device having a receiver assembly and an initiator assembly that includes an electronic initiator and a pellet assembly with an energetic material. The receiver assembly is configured to be coupled to a firing circuit. When the firing circuit is to be armed, the initiator assembly can be pressed into a socket in the receiver assembly to electrically couple the receiver assembly and the initiator assembly. A method for mounting an energetic material initiation device to a firing circuit is also provided.

Abstract translation: 具有接收器组件和引发器组件的高能材料引发装置，其包括电子引发器和具有高能材料的小球组件。 接收器组件被配置为耦合到击发电路。 当燃烧电路要布防时，启动器组件可以被压入接收器组件中的插座中，以将接收器组件和引发器组件电耦合。 还提供了一种用于将高能材料引发装置安装到击发电路的方法。

公开(公告)号：US08089007B2

公开(公告)日：2012-01-03

申请号：US12331444

申请日：2008-12-10

Applicant: Ying-Tso Lai ,  Tsung-Sheng Huang ,  Shou-Kuo Hsu

Inventor： Ying-Tso Lai ,  Tsung-Sheng Huang ,  Shou-Kuo Hsu

IPC: H05K1/11

CPC classification number: H05K1/0265 ,  H05K1/114 ,  H05K1/115 ,  H05K2201/094 ,  H05K2201/0979 ,  H05K2201/09854 ,  H05K2201/10189

Abstract: A printed circuit board includes a reference layer, at least one first hole defined in the reference layer and adjacent from a first pin in a first column of pins of an electronic component, and at least one second hole defined in the reference layer and adjacent from a second pin of the electronic component. The at least one second hole is defined in the reference layer and opposite to the at least one first hole. The second pin is in a neighboring second column of pins from the first column of pins. A diameter of the at least one first hole is greater than a diameter of the at least one second hole such that a difference in current flowing through the first pin and the second pin is reduced.

Abstract translation: 印刷电路板包括参考层，限定在参考层中并与电子部件的第一列销中的第一销相邻的至少一个第一孔以及限定在参考层中并与参考层相邻的至少一个第二孔 电子部件的第二引脚。 至少一个第二孔限定在参考层中并与至少一个第一孔相对。 第二引脚位于与第一列引脚相邻的第二列引脚中。 所述至少一个第一孔的直径大于所述至少一个第二孔的直径，使得流过所述第一销和所述第二销的电流差减小。

公开(公告)号：US08063316B2

公开(公告)日：2011-11-22

申请号：US11818508

申请日：2007-06-14

Applicant: Dan Gorcea

Inventor： Dan Gorcea

IPC: H05K1/11

CPC classification number: H05K1/0248 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/09336 ,  H05K2201/09627 ,  H05K2201/0979 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31511

Abstract: In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.

Abstract translation: 根据第一实施例，本发明提供了一种包括第一表面的电路基板; 第二表面 具有靠近所述第一表面的第一端和靠近所述第二表面的第二端的第一通孔; 第二通孔，其具有靠近所述第一表面的第一端和靠近所述第二表面的第二端; 电连接所述第一通孔的所述第一端和所述第二通孔的所述第一端的第一导电元件; 电连接所述第一通孔的所述第二端和所述第二通孔的所述第二端的第二导电元件; 耦合到所述第一通孔的输入信号线; 以及耦合到所述第二通孔的输出信号线。

公开(公告)号：US08035214B1

公开(公告)日：2011-10-11

申请号：US09830949

申请日：1999-11-17

Applicant: Naohiro Hirose ,  Hitoshi Ito ,  Yoshiyuki Iwata ,  Masanori Kawade ,  Hajime Yazu

Inventor： Naohiro Hirose ,  Hitoshi Ito ,  Yoshiyuki Iwata ,  Masanori Kawade ,  Hajime Yazu

IPC: H01L23/48 ,  H01L21/4763

CPC classification number: H01L23/49811 ,  H01L2224/05001 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/15312 ,  H05K1/111 ,  H05K1/112 ,  H05K3/28 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0979 ,  H05K2201/10318 ,  Y10T428/239

Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.

Abstract translation: 一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与母板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的衬垫16 用于封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口部分地暴露于外部。 导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。

公开(公告)号：US20110174525A1

公开(公告)日：2011-07-21

申请号：US12690297

申请日：2010-01-20

Applicant: Timothy R. Conrad ,  Theresa Ann Updike Thompson ,  Terry L. Warner ,  Daniel E. Kettles ,  Phuc B. Dao

Inventor： Timothy R. Conrad ,  Theresa Ann Updike Thompson ,  Terry L. Warner ,  Daniel E. Kettles ,  Phuc B. Dao

IPC: H05K1/18 ,  B23K31/02 ,  H05K1/09

CPC classification number: B23K1/0016 ,  B23K2101/42 ,  H05K1/113 ,  H05K3/3431 ,  H05K3/3484 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10015

Abstract: A method and an electronic assembly for attaching a component to a substrate, or printed circuit board, is recited. The printed circuit board comprises a solder-nonwettable surface and a bond pad being formed of a solder-wettable surface. The printed circuit board defines a through hole extending through the printed circuit board and the bond pad. A plate lining a first portion of the through hole in the printed circuit board is formed of a solder-wettable material. Solder paste is applied to the bond pad and into the through hole. A component including a terminal overlies the bond pad in an arrangement. Reflowing the solder paste forms a solder fillet that bonds the terminal to the bond pad. The solder fillet extends within the through hole attaching the component to the printed circuit board.

Abstract translation: 列举了用于将部件附接到基板或印刷电路板的方法和电子组件。 印刷电路板包括焊料不润湿表面和由可焊接润湿表面形成的接合焊盘。 印刷电路板限定穿过印刷电路板和接合垫的通孔。 印刷电路板中的通孔的第一部分的板由可焊料润湿的材料形成。 将焊膏施加到接合焊盘并进入通孔。 包括端子的部件在布置中覆盖在焊盘上。 焊锡膏的回流形成了将端子连接到接合焊盘的焊锡圆角。 焊接圆角在将组件附接到印刷电路板的通孔内延伸。

公开(公告)号：US07952229B2

公开(公告)日：2011-05-31

申请号：US12393994

申请日：2009-02-26

Applicant: Yi-Chang Lu ,  Cheng-Hung Li ,  Chung-Yui Kuo ,  Tsung-Yu Wu

Inventor： Yi-Chang Lu ,  Cheng-Hung Li ,  Chung-Yui Kuo ,  Tsung-Yu Wu

IPC: H05K1/02

CPC classification number: H02J1/06 ,  H05K1/0265 ,  H05K2201/09254 ,  H05K2201/09727 ,  H05K2201/0979 ,  Y10T307/492

Abstract: A power distribution system is disclosed. The system includes a first power line and a second power line laid out on a substrate. The first power line is spaced apart from the second power line. The system also includes at least one conductive connecting line that electrically couples the first power line at one end and the second power line at another end. A power supply supplies power to the first power line and the second power line. A supply node on the conductive connecting line is then used to provide the supplied power.

Abstract translation: 公开了配电系统。 该系统包括布置在基板上的第一电源线和第二电源线。 第一电力线与第二电力线隔开。 该系统还包括至少一个导电连接线，其在一端电耦合第一电力线和在另一端电耦合第二电力线。 电源为第一电力线和第二电力线供电。 然后使用导电连接线上的供电节点来提供所供电的电力。

公开(公告)号：US20110072656A1

公开(公告)日：2011-03-31

申请号：US12957431

申请日：2010-12-01

Applicant: Timothy Harrison Daubenspeck ,  Jeffrey Peter Gambino ,  Christopher David Muzzy ,  Wolfgang Sauter

Inventor： Timothy Harrison Daubenspeck ,  Jeffrey Peter Gambino ,  Christopher David Muzzy ,  Wolfgang Sauter

IPC: H05K3/10

CPC classification number: H01L24/10 ,  H01L23/49838 ,  H01L23/528 ,  H01L24/12 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05018 ,  H01L2224/05022 ,  H01L2224/05558 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/0265 ,  H05K1/111 ,  H05K1/112 ,  H05K2201/0769 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/0979 ,  Y02P70/611 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A method for forming an electrical structure. The electrical structure comprises an interconnect structure and a substrate. The substrate comprises an electrically conductive pad and a plurality of wire traces electrically connected to the electrically conductive pad. The electrically conductive pad is electrically and mechanically connected to the interconnect structure. The plurality of wire traces comprises a first wire trace, a second wire trace, a third wire trace, and a fourth wire trace. The first wire trace and second wire trace are each electrically connected to a first side of the electrically conductive pad. The third wire trace is electrically connected to a second side of the electrically conductive pad. The fourth wire trace is electrically connected to a third side of said first electrically conductive pad. The plurality of wire traces are configured to distribute a current.

Abstract translation: 一种形成电结构的方法。 电结构包括互连结构和衬底。 衬底包括导电焊盘和电连接到导电焊盘的多个导线迹线。 导电焊盘电连接和机械连接到互连结构。 多条导线包括第一线迹线，第二线迹线，第三线迹线和第四线迹线。 第一线迹和第二线迹均电连接到导电垫的第一侧。 第三线迹电连接到导电垫的第二侧。 第四线迹电连接到所述第一导电焊盘的第三侧。 多个导线配置成分布电流。

公开(公告)号：US20100288545A1

公开(公告)日：2010-11-18

申请号：US12775916

申请日：2010-05-07

Applicant: Akiyoshi Saitou

Inventor： Akiyoshi Saitou

IPC: H05K1/16 ,  H05K1/11

CPC classification number: H05K1/0251 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0242 ,  H05K1/115 ,  H05K3/4602 ,  H05K2201/09627 ,  H05K2201/0979 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A printed wiring board having an insulating core; a plurality of vias having axes parallel to and at equal distance from a reference axis and passing through the core; a first conductive film formed on a front surface of the core from the reference axis to each of the individual vias; a first insulating film stacked on the front surface of the core and covering the first conductive film; a first connecting via having an axis identical to the reference axis and passing through the first stacked film; a second conductive film formed on a back surface of the core from the reference axis to each of the individual vias; a second insulating film stacked on the back surface of the core and covering the second conductive film; and a second connecting via having an axis identical to the reference axis and passing through the second stacked film.

Abstract translation: 一种具有绝缘芯的印刷线路板; 多个通孔具有平行于参考轴线并且距离参考轴线等距离并且穿过芯部的轴线; 第一导电膜，其形成在所述芯的前表面上，从参考轴线到每个所述各个通孔; 第一绝缘膜，堆叠在所述芯的前表面上并覆盖所述第一导电膜; 第一连接通孔，其具有与参考轴线相同的轴线并穿过第一层叠膜; 形成在所述芯的背面上的第二导电膜，所述第二导电膜从所述参考轴线到每个所述各个通孔; 层叠在所述芯的背面上并覆盖所述第二导电膜的第二绝缘膜; 以及第二连接通孔，其具有与参考轴线相同的轴线并且穿过第二层叠膜。

公开(公告)号：US20100236823A1

公开(公告)日：2010-09-23

申请号：US12406850

申请日：2009-03-18

Applicant: LIEN-FEN HU ,  JORGE E. MARTINEZ-VARGAS, JR. ,  SAMUEL M. LEE ,  KARL A. SAUTER ,  AARON MENDELSOHN

Inventor： LIEN-FEN HU ,  JORGE E. MARTINEZ-VARGAS, JR. ,  SAMUEL M. LEE ,  KARL A. SAUTER ,  AARON MENDELSOHN

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K1/116 ,  H05K1/0201 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09627 ,  H05K2201/0979 ,  Y10T29/49155

Abstract: Systems and methods for providing plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB.

Abstract translation: 本文描述了用于在PCB中提供电镀通孔（PTH）的系统和方法，其有利地允许改进的焊接能力。 通过提供围绕PTH的一个或多个通孔来提供PTH与PCB的内部和底部导电层之间的电连接来减少PTH的散热效应来实现这种系统和方法。 在这方面，PTH与至少一个内部导电层（例如，接地层或功率层）间隔开，因此降低了散热效果。 该特征使得熔融焊料在冷冻之前基本上填充整个PTH，从而改善电气部件和PCB之间的机械和电连接。